JPS5787176A - Fabrication of semiconductor device - Google Patents
Fabrication of semiconductor deviceInfo
- Publication number
- JPS5787176A JPS5787176A JP55163556A JP16355680A JPS5787176A JP S5787176 A JPS5787176 A JP S5787176A JP 55163556 A JP55163556 A JP 55163556A JP 16355680 A JP16355680 A JP 16355680A JP S5787176 A JPS5787176 A JP S5787176A
- Authority
- JP
- Japan
- Prior art keywords
- gate
- control gate
- polycrystalline silicon
- layers
- floating gate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/68—Floating-gate IGFETs
- H10D30/681—Floating-gate IGFETs having only two programming levels
- H10D30/684—Floating-gate IGFETs having only two programming levels programmed by hot carrier injection
- H10D30/686—Floating-gate IGFETs having only two programming levels programmed by hot carrier injection using hot carriers produced by avalanche breakdown of PN junctions, e.g. floating gate avalanche injection MOS [FAMOS]
Landscapes
- Non-Volatile Memory (AREA)
Abstract
PURPOSE:To obtain an FAMOS transistor free from disconnection in a silicon gate MOS transistor with two gate layers consisting of a floating gate and control gate layers by diffusing impurities into both the layers of polycrystalline silicon. CONSTITUTION:Thick field oxide film 204 is formed on the periphery of a silicon substrate 201 so as to surround its internal regions. On the internal surface of the substrate 201, a thin gate oxide film 202 is formed and on which the floating gate 203 of polycrystalline silicon is formed at its center. Then, the control gate 206 of polycrystalline silicon is provided on the floating gate with a gate oxide coating 205 interlaid for formation of an FAMOS transistor. In such structure, normally diffusion of impurities is introduced only into the floating gate 203, not into the control gate 206. This particular type of semiconductor, however, provides the control gate 206 also with approximately the same degree of diffusion, so that there is no fear of disconnection of aluminum wiring on the control gate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55163556A JPS5787176A (en) | 1980-11-20 | 1980-11-20 | Fabrication of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55163556A JPS5787176A (en) | 1980-11-20 | 1980-11-20 | Fabrication of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5787176A true JPS5787176A (en) | 1982-05-31 |
Family
ID=15776137
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP55163556A Pending JPS5787176A (en) | 1980-11-20 | 1980-11-20 | Fabrication of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5787176A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5147813A (en) * | 1990-08-15 | 1992-09-15 | Intel Corporation | Erase performance improvement via dual floating gate processing |
| US5229631A (en) * | 1990-08-15 | 1993-07-20 | Intel Corporation | Erase performance improvement via dual floating gate processing |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5259585A (en) * | 1975-10-29 | 1977-05-17 | Intel Corp | Method of producing mos polycrystalline ic |
| JPS5488087A (en) * | 1977-12-23 | 1979-07-12 | Ibm | Method of fabricating fet |
-
1980
- 1980-11-20 JP JP55163556A patent/JPS5787176A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5259585A (en) * | 1975-10-29 | 1977-05-17 | Intel Corp | Method of producing mos polycrystalline ic |
| JPS5488087A (en) * | 1977-12-23 | 1979-07-12 | Ibm | Method of fabricating fet |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5147813A (en) * | 1990-08-15 | 1992-09-15 | Intel Corporation | Erase performance improvement via dual floating gate processing |
| US5229631A (en) * | 1990-08-15 | 1993-07-20 | Intel Corporation | Erase performance improvement via dual floating gate processing |
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