JPS58191638U - 半導体ペレツト - Google Patents

半導体ペレツト

Info

Publication number
JPS58191638U
JPS58191638U JP1982085369U JP8536982U JPS58191638U JP S58191638 U JPS58191638 U JP S58191638U JP 1982085369 U JP1982085369 U JP 1982085369U JP 8536982 U JP8536982 U JP 8536982U JP S58191638 U JPS58191638 U JP S58191638U
Authority
JP
Japan
Prior art keywords
semiconductor
semiconductor pellets
semiconductor pellet
symmetrical
abstract
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1982085369U
Other languages
English (en)
Japanese (ja)
Other versions
JPS645887Y2 (2
Inventor
浩二 安藤
Original Assignee
日本インター株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本インター株式会社 filed Critical 日本インター株式会社
Priority to JP1982085369U priority Critical patent/JPS58191638U/ja
Publication of JPS58191638U publication Critical patent/JPS58191638U/ja
Application granted granted Critical
Publication of JPS645887Y2 publication Critical patent/JPS645887Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Wire Bonding (AREA)
JP1982085369U 1982-06-10 1982-06-10 半導体ペレツト Granted JPS58191638U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982085369U JPS58191638U (ja) 1982-06-10 1982-06-10 半導体ペレツト

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982085369U JPS58191638U (ja) 1982-06-10 1982-06-10 半導体ペレツト

Publications (2)

Publication Number Publication Date
JPS58191638U true JPS58191638U (ja) 1983-12-20
JPS645887Y2 JPS645887Y2 (2) 1989-02-14

Family

ID=30094246

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982085369U Granted JPS58191638U (ja) 1982-06-10 1982-06-10 半導体ペレツト

Country Status (1)

Country Link
JP (1) JPS58191638U (2)

Also Published As

Publication number Publication date
JPS645887Y2 (2) 1989-02-14

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