JPS5840855U - printed wiring board - Google Patents

printed wiring board

Info

Publication number
JPS5840855U
JPS5840855U JP12274281U JP12274281U JPS5840855U JP S5840855 U JPS5840855 U JP S5840855U JP 12274281 U JP12274281 U JP 12274281U JP 12274281 U JP12274281 U JP 12274281U JP S5840855 U JPS5840855 U JP S5840855U
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
utility
model registration
scope
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12274281U
Other languages
Japanese (ja)
Inventor
白石　潔
稔 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Faurecia Clarion Electronics Co Ltd
Original Assignee
Clarion Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Clarion Co Ltd filed Critical Clarion Co Ltd
Priority to JP12274281U priority Critical patent/JPS5840855U/en
Publication of JPS5840855U publication Critical patent/JPS5840855U/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図乃至第５図は本考案の一実施例によるプリント配
線基板を得るための製造ステップを示す；　　断面図で
ある。 １・・・基板、２・・・銅箔、３・・・銅めっき、４・
・・めっきレジスト、５・・・凹状ランド部。 補正　昭５７．１０．１８ 実用新案登録請求の範囲を次のように補正する。 Ｏ実用新案登録請求の範囲 プリント配線基板におけるランド部を凹状に形成したこ
とを特徴とするプリント配線基板。1 to 5 are cross-sectional views showing manufacturing steps for obtaining a printed wiring board according to an embodiment of the present invention. 1... Board, 2... Copper foil, 3... Copper plating, 4...
... Plating resist, 5... Concave land portion. Amendment October 18, 1980 The scope of claims for utility model registration is amended as follows. Utility Model Registration Claims A printed wiring board characterized in that a land portion of the printed wiring board is formed in a concave shape.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] プリント配線基板における銅箔部をＬ字状に形成したこ
とを特徴とするプリント配線基板。A printed wiring board characterized in that a copper foil portion of the printed wiring board is formed into an L-shape.
JP12274281U 1981-08-19 1981-08-19 printed wiring board Pending JPS5840855U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12274281U JPS5840855U (en) 1981-08-19 1981-08-19 printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12274281U JPS5840855U (en) 1981-08-19 1981-08-19 printed wiring board

Publications (1)

Publication Number Publication Date
JPS5840855U true JPS5840855U (en) 1983-03-17

Family

ID=29916659

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12274281U Pending JPS5840855U (en) 1981-08-19 1981-08-19 printed wiring board

Country Status (1)

Country Link
JP (1) JPS5840855U (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61193754U (en) * 1985-05-24 1986-12-02
JPS6216260U (en) * 1985-07-12 1987-01-30
JPS62149957U (en) * 1986-03-17 1987-09-22
JPH029048U (en) * 1988-07-04 1990-01-22
JPH029047U (en) * 1988-07-01 1990-01-22
JPH02308735A (en) * 1989-05-24 1990-12-21 Shimizu Corp plant cultivation equipment
JPH03126446U (en) * 1990-04-04 1991-12-19
JPH07163253A (en) * 1993-10-14 1995-06-27 Hideo Shimizu Three-dimensional plant-cultivation factory having controlled environment

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS546830U (en) * 1977-06-17 1979-01-17

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS546830U (en) * 1977-06-17 1979-01-17

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61193754U (en) * 1985-05-24 1986-12-02
JPS6216260U (en) * 1985-07-12 1987-01-30
JPS62149957U (en) * 1986-03-17 1987-09-22
JPH029047U (en) * 1988-07-01 1990-01-22
JPH029048U (en) * 1988-07-04 1990-01-22
JPH02308735A (en) * 1989-05-24 1990-12-21 Shimizu Corp plant cultivation equipment
JPH03126446U (en) * 1990-04-04 1991-12-19
JPH07163253A (en) * 1993-10-14 1995-06-27 Hideo Shimizu Three-dimensional plant-cultivation factory having controlled environment

Similar Documents

Publication Publication Date Title
JPS5840855U (en) printed wiring board
JPS60121674U (en) Printed board
JPS63124786U (en)
JPS5869977U (en) printed wiring board
JPS5897871U (en) Connection structure between flexible board and lid board
JPS5887380U (en) printed wiring board
JPS6146766U (en) printed wiring board
JPS5885375U (en) High frequency printed wiring board
JPS6061754U (en) Surface structure of printed circuit board
JPS5827966U (en) Printed board
JPS59182974U (en) Printed board
JPS60960U (en) Mounting structure for electronic components on printed wiring boards
JPS6120078U (en) printed wiring board
JPS5963467U (en) printed wiring board
JPS5974755U (en) printed wiring board
JPS5923766U (en) Printed board
JPS59158356U (en) Component mounting structure on multilayer printed wiring board
JPS5926272U (en) printed wiring board
JPS58111992U (en) Shield structure of solid electronic components
JPS58106970U (en) Printed board
JPS59109174U (en) printed wiring board
JPS5895667U (en) printed wiring board
JPS5846472U (en) printed wiring board
JPS5977257U (en) printed wiring board
JPS599571U (en) printed wiring board