JPS5923430Y2 - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS5923430Y2
JPS5923430Y2 JP1979013498U JP1349879U JPS5923430Y2 JP S5923430 Y2 JPS5923430 Y2 JP S5923430Y2 JP 1979013498 U JP1979013498 U JP 1979013498U JP 1349879 U JP1349879 U JP 1349879U JP S5923430 Y2 JPS5923430 Y2 JP S5923430Y2
Authority
JP
Japan
Prior art keywords
insulating film
punching
film layer
electrode
around
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1979013498U
Other languages
English (en)
Japanese (ja)
Other versions
JPS55115051U (2
Inventor
義弘 堀江
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1979013498U priority Critical patent/JPS5923430Y2/ja
Publication of JPS55115051U publication Critical patent/JPS55115051U/ja
Application granted granted Critical
Publication of JPS5923430Y2 publication Critical patent/JPS5923430Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view

Landscapes

  • Wire Bonding (AREA)
JP1979013498U 1979-02-05 1979-02-05 半導体装置 Expired JPS5923430Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1979013498U JPS5923430Y2 (ja) 1979-02-05 1979-02-05 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1979013498U JPS5923430Y2 (ja) 1979-02-05 1979-02-05 半導体装置

Publications (2)

Publication Number Publication Date
JPS55115051U JPS55115051U (2) 1980-08-13
JPS5923430Y2 true JPS5923430Y2 (ja) 1984-07-12

Family

ID=28831699

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1979013498U Expired JPS5923430Y2 (ja) 1979-02-05 1979-02-05 半導体装置

Country Status (1)

Country Link
JP (1) JPS5923430Y2 (2)

Also Published As

Publication number Publication date
JPS55115051U (2) 1980-08-13

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