JPS596550A - Semiconductor element fixing device - Google Patents

Abstract

PURPOSE:To enhance precision of the fixing position of the semiconductor element by a method wherein the holding table mechanism of a work is set up being enabled with vibrational motion in the horizontal direction, and a semiconductor element holding collet is equipped at the fixed position directly over the table mechanism. CONSTITUTION:The work 4 is set to a heater block 5 by a work clamp 6, and a semiconductor element 1 is held by a spring 3 and the collet 2 to be adhered with pressure to the upper surface of the work 4. Then, supersonic waves or sonic waves generated from an oscillator 9 are converted into a vibration by a vibrator 10 to be amplified by a horn 11, and a stage 13 and the heater block 5 are made to perform vibrational motion in the horizontal direction. Motion in the horizontal direction of the semiconductor element 1 is regulated, and because the work 4 performs vibrational motion in the horizontal direction, the lower face of the semiconductor element 1 and the upper face of the work 4 come in contact with the whole surfaces to be scrubbed mutually, and an eutectic alloy is generated to be joined. Accordingly, the gold-silicon alloy condition having reliability can be obtained, and precision of the fixing position of the semiconductor element 1 is also enhanced.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention involves compressing a semiconductor element onto a heated workpiece,
This invention relates to a semiconductor element fixing device that generates a eutectic alloy by rubbing the two together to bond them.

Among the manufacturing processes for semiconductor devices, the so-called die bonding process involves pressing a semiconductor element onto a workpiece under heating at 400 to 500°C, and then bonding the two together to form a gold-silicon eutectic alloy to bond the semiconductor. This is the process of fixing the element to the workpiece.

There are two types of conventional semiconductor device fixing devices: a cam type and an ultrasonic type. The conventional cam system is shown in Figure 1 (B). That is, the semiconductor element 1 is held by the collet 2 and pressed onto the workpiece 4 by the semiconductor element pressurizing spring 5, and the workpiece 4 is clamped to the heater block 5 by the workpiece clamp 6. The upper scrub cam 7 is driven by a motor to move the collet 2 horizontally, while the lower scrub cam 8 swings the heater block 5 in a vertical plane to separate the semiconductor element 1 and workpiece 4. They were rubbing together.

However, in the conventional cam method, since the workpiece 4 swings relative to the semiconductor element 1, it takes a lot of time to bring the two into contact over their entire surfaces in order to obtain a stable gold-silicon alloy state. Another disadvantage is that a stable gold-silicon alloy state cannot be obtained depending on the size of the semiconductor element and the condition of the mating surfaces.

However, in the conventional cam system, the slow speed of the swinging motion of the collet 2 may be a cause of preventing a stable gold-silicon alloy state from being obtained in a short time. The sonic method has been improved in this respect. That is, as shown in the second part, the ultrasonic waves generated by the oscillator 9 are converted into vibrations by the vibrator 10, further amplified by the horn 11, and applied from directly above the top surface of the semiconductor element 1 to vibrate the semiconductor element 1. In addition to vibration, the lower scrub cam 8 is driven by a motor to swing the heater block 5 in a vertical plane to rub the semiconductor element 1 and the workpiece 4 together.

However, in the case of the conventional ultrasonic method, since the direction of pressure applied by the spring 3 and the direction of the ultrasonic vibration load are the same, if the pressure applied by the spring 3 is increased, the scrubbing energy exceeds the destruction value of the element 1. In the case of Tsuda, there was a drawback that the element itself could be destroyed because there was no escape. Therefore, if the pressing force of the spring 3 is reduced, the element 1 and the workpiece 4
Since the degree of compression between the collet 2 and the gold-silicon alloy becomes weaker, not only will the state of the gold-silicon alloy become unstable, but also the semiconductor element 1 will be attached to the collet 2.
There were some drawbacks such as it falling off.

The present invention solves the above-mentioned problems, and is characterized in that the table mechanism for holding the workpiece is installed so as to be able to swing in the horizontal direction, and the collet for holding semiconductor elements is placed at a fixed position directly above the table mechanism. It is something to do.

Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

Components that are the same as those in FIGS. 1 and 2 will be described with the same reference numerals.

As shown in FIGS. 3(5) and 3(B), the present invention is a semiconductor element fixing device that presses a semiconductor element 1 onto a heated workpiece 4 and rubs them together to generate a eutectic alloy and bond them together. In this case, the holding table mechanism for the workpiece 4 is installed so as to be able to swing in the horizontal direction, and the semiconductor element holding collet 2 is installed at a fixed position directly above the holding table mechanism. In the example, 1. The holding table mechanism for the workpiece 4 has the following configuration. That is, the support 14 is placed on a stage 16 that slides horizontally on the substrate 12.
A heater block 5 is fixedly installed via the.

A workpiece 4 is set onto this heater block 5 by operating a workpiece clamp 6. Also, the horn 11 is attached to the pillar 14.
are brought into contact with each other and pulled by a pullback spring 13 to bring them into close contact.

In the embodiment, first, a workpiece 4 is set on the heater block 5 using a workpiece clamp 6, and a semiconductor element 1 is held by a flywheel and a collet 2 and pressed onto the upper surface of the workpiece 4. Next, the ultrasonic waves or sound waves generated by the oscillator 9 are converted into vibrations by the vibrator 10, which is amplified by the horn 11 to cause the stage 13 and the heater block 5 to swing in the horizontal direction. In the present invention, the movement of the semiconductor element 1 in the horizontal direction is restricted, and the workpiece 4 swings in the horizontal direction with respect to the element 1, so that the lower surface of the semiconductor element 1 and the upper surface of the workpiece 4 are separated from each other over the entire surface thereof. They touch and rub together, forming a eutectic alloy and joining the two. Further, if the stage 13 and the heater block 5 are moved in a swinging motion using ultrasonic waves, the swinging width in the horizontal direction thereof is small, and therefore the precision of the fixing position of the semiconductor element 1 to the workpiece 4 is improved.

As described above, the present invention restricts the movement in the horizontal direction and presses the semiconductor element directly above the workpiece (-7) and moves the workpiece in the horizontal direction, so that the semiconductor element and the workpiece are Since the entire surface is rubbed and bonded by surface contact, a reliable gold-silicon alloy state can be obtained regardless of the size of the semiconductor element or the state of the back surface.Furthermore, the workpiece is pressed against the semiconductor element in the direction of the bonding. Since the swing motion is made in the right angle direction, the pressure spring protects the semiconductor element, and even when the workpiece is vibrated by ultrasonic waves, there is no problem and a reliable alloy state can be obtained in a short time. Not only is this possible, but the horizontal swinging width of the work relative to the element is reduced, which has the effect of improving the accuracy of the fixing position of both.

[Brief explanation of drawings]

Figure 1 (4) is a front view of the conventional cam type fixing device.
) is a side view, FIG. 2 is a front view of a conventional ultrasonic fixing device, FIG. 5 is a front view showing an embodiment of the device of the present invention, and FIG. 3(B) is a side view. .

Claims (1)

[Claims] +11 In a semiconductor element fixing device that presses a semiconductor element onto a heated workpiece and rubs them together to generate a eutectic alloy and bond them together, a film force is applied to a holding table mechanism for the workpiece so that it can swing in the horizontal direction. With,
A semiconductor device fixing device characterized in that a semiconductor device holding collet is installed at a fixed position directly above a holding table mechanism.