JPS597219B2 - pellet bonding equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a pellet bonding apparatus for sucking pellets adhered onto a wafer sheet one by one using a suction nozzle and transferring the pellets to a semiconductor substrate for bonding.

Generally, in order to cause the pellets adhered to the wafer sheet to be attracted to the suction nozzle, a push-up needle that pushes up the center of the pellet on the back side (lower side) of the wafer sheet is disposed directly below the suction nozzle.

For this reason, it is difficult to adjust the position of the push-up needle at the center of the suction nozzle. By the way, a conventional pellet bonding apparatus has a structure as shown in FIG.

That is, the pedestal 70 is provided with a hole 70a, and the pedestal 70 is provided with a hole 70a.
It is fixed to the gantry base T2 by a fixing screw 71 through a hole 70a. A pipe 13 is fixed to the support portion T0b of the gantry TO. This pipe T3 has
A cylindrical adsorbent T4 is fixed to one end in a direction perpendicular to and perpendicular to the pipe T3, and a hose T5 connected to a vacuum pump (not shown) is connected to the other end. Further, a cam shaft 76 driven by a motor (not shown) is rotatably supported on the mount TO, and a cam J/MOV is fixed to this cam shaft 76. Further, a shaft 78 is rotatably supported on the pedestal 70, and an arm 79 is fixed to this shaft 78.
A cam follower 80 is rotatably supported at one end of the arm 79 in correspondence with the cam J and V.
is spring 8 so that cam follower 80 comes into pressure contact with cam J mo V.
1 and is energized. A needle 82 is held at the other end of the arm 79 so as to hold a pin 83 which is attached to a holder 84 fixed to the lower end of the needle 82 for pushing up pellets. The needle 82 is slidably inserted into the adsorption body 74. In addition, 90 is pellet, 91 is pellet 90
92 is a frame for fixing the wafer sheet 91, and 93 is a suction nozzle for sucking the pellet 90 and transporting it to the bonding position.

In this way, the pipe 73 to which the suction body 74 is attached is fixed to the pedestal 70, and the arm 79 holding the needle 82 is rotatably supported by the pedestal 70, so that the needle 82 can be placed in the center of the suction nozzle 93. To position it, it is necessary to loosen the fixing screw 71 and move the pedestal 70 to which the entire thrust needle mechanism unit is attached. For this reason, it is difficult to make fine adjustments, takes a long time to make adjustments, and has poor workability. The present invention has been made in view of the above-mentioned drawbacks, and is a pellet bonding system equipped with a fine adjustment mechanism for pushing up pellets so that the pushing needle can be easily aligned with the center position of the suction nozzle stuck on the wafer sheet. The purpose is to provide equipment. The present invention will be explained below based on the illustrated embodiment U.

The figures show an embodiment of the pellet thrust fine adjustment mechanism of the pellet bonding apparatus according to the present invention, in which FIG. 1 is a front view, FIG. 2 is a top view, and FIG. 4 is a sectional view taken along line 4-4 in FIG. 1, and FIG. 5 is a sectional view taken along line 55 in FIG. 4. 10 is a pedestal, 1
1 is a boss fixed to the frame 10; 12 is a housing slidably fitted in the inner cylinder of the boss 11 in the axial direction; 13 is a shaft rotatably provided in the housing 12 via a bearing 14; Reference numeral 15 denotes stoppers for preventing the bearing 14 from coming off, which are fixed to both ends of the shaft 13.

Reference numeral 16 denotes a holder for holding an arm to which a needle, which will be described later, is attached.The upper end is fixed to the shaft 13 with a screw 17, and the lower end has a sleeve 18 fitted in a slidable manner.

Reference numeral 20 denotes a holder for holding a vacuum suction pipe, which will be described later.The lower end is fixed to the sleeve 18, and the upper end is fixed to a guide pin 21 that is slidable along a groove 16a provided in the holder 16.

Reference numeral 22 denotes a piece to which a pipe 23 for vacuum suction is fixed, and is arranged in a long hole 20a provided in the holder 20, and is attached to a pin 24 planted in the holder 20 so as to be pivotable in the direction in which the pipe 23J extends. supported.

The pipe 23 passes through a pipe escape hole 16b provided in the holder 16, and one end is connected to a vacuum pump (not shown) by a hose 25 made of vinyl or the like. A needle fixing arm 26 is fixed to the sleeve 18 substantially parallel to the pipe 23, and a needle 27 for pushing up pellets is fixed to the arm 26 at right angles and in a vertical direction at one end.

Reference numeral 28 denotes a cylindrical adsorbent that is integrally fixed to one end of the pipe 23 at right angles to the pipe 23 and in a vertical direction, and the needle 27 is slidably inserted therethrough.

Further, the upper end of the suction body 28 is provided with a hole 28a in the center through which the needle 27 can move up and down, and a plurality of holes 28b for vacuum suction around this hole 28a. 30 is needle 2 of arm 26
7. A guide holder fixed on the fixed side, and a pipe 23 is loosely engaged with a long hole 30a provided at the upper end.

A spring 31 makes the pipe 23 and the arm 26 repel each other, and is disposed between a spring holder 32 fixed to the pipe 23 and a guide holder 30.

A spring 33 biases the arm 26 in the axial direction, and is disposed between the holder 16 and the stopper P18a of the sleeve 18.

34 is a stopper plate fixed to one end of the arm 26.

Reference numeral 40 denotes a Y-direction fine adjustment screw for adjusting the axis (Y-Y● direction) of the needle 27 and the suction body 28, and is screwed into a proc 41 fixed to the holder 16.

42 is a stopper to which the Y-direction fine adjustment screw 40 comes into pressure contact;
It is fixed to the arm 26.

Reference numeral 43 denotes a Z-direction fine adjustment screw for adjusting the height (Z-Z● direction) of the adsorbent 28, and is screwed into a holder 44 fixed to the pedestal 10.

45 is a stopper fixed to the pipe 23 in correspondence with the Z direction fine adjustment screw 43.

Reference numeral 46 denotes an eccentric pin that adjusts the needle 27 and the suction body 28 at right angles to the axial direction (X→0 direction), and is fixed to the upper holder 47 fixed to the pedestal 10 with screws 48.

One end of the eccentric pin 46 is fitted through the hole 11a of the boss 11 into a long hole 12a provided in the center of the outer cylinder of the housing 12 in a direction perpendicular to the axial center. 12 is adapted to move in the direction of the axial center. 49 is a screw for fixing the housing 12 to the boss 11.

Reference numeral 50 is a lever fixed to the holder 16 at one end and has a cam follower 51 at the other end, and 52 is a camshaft to which a cam 53 is fixed, which is rotatably supported by the mount 10 and a bearing holder 54 fixed to the mount 10. , is driven by a drive device (not shown).

Reference numeral 55 denotes a tension spring that presses the cam follower 51 against the cam 53, and has one end hung on the lever 50 and the other end hung on a spring hook 56 fixed to the frame 10.

57 is a Z direction fine adjustment screw that sets the upper limit in the height direction (Z-Z7) of the needle 27, and is screwed into a holder 58 fixed to the center of the lever 50.
A stopper 59 is fixed to the pedestal 10 opposite to the stopper 7.

60 is a pellet, 61 is a wafer sheet to which the pellet 60 is adhered, 62 is a frame for fixing the wafer sheet 61, 63
is a suction nozzle that suctions the pellet 60 and transfers it to the bonding position.

Next, the operation of the apparatus according to the present invention will be explained.

First, various fine adjustment screws 40, 43, 53 and eccentric pin 46
Adjustments are made in the X, Y, and Z directions so that the needle 27 and the suction body 28 are located at the center of the suction nozzle 63.
Adjustment in the X-~ direction (see Figures 1, 2, and 4) Eccentric pin 46
When the housing 12 is turned, the housing 12 moves in the axis (X-V) direction together with the shaft 13.

A holder 16 is fixed to the shaft 13, and this holder 16
An arm 26 is attached to the arm 26 via the sleeve 18, and a pin 2 is attached to the holder 20 fixed to the sleeve 18.
Since the piece 22 to which the pipe 23 is fixed via the shaft 13 is attached, the pipe 23 and the arm 26 also move in the X- to direction as the shaft 13 moves. In this way the needle 27
Then, the adsorbent 28 is finely adjusted in the X direction. After adjustment, tighten the screws 48 and 49, and remove the eccentric pin 46 and housing 12.
to be fixed. Adjustment in the Y-Z direction (see Figures 1, 2, and 5)
When the Y-direction fine adjustment screw 40 is turned, the arm 26 moves the sleeve 18 to the holder 16 in the Y direction via the stopper 42.
- Slide in direction.

A holder 20 is fixed to the sleeve 18, and a piece 2 has a pipe 23 fixed to the holder 20 via a pin 24.
2 is attached, the pipe 23 also moves in the Y-Z direction together with the arm 26 due to the sliding of the sleeve 18.
Thereby, the needle 27 and the suction body 28 can be adjusted in the Y-Y direction. Adjustment in the Z-Z' direction (see Figures 1 and 2) The Z-Z' direction is an adjustment to determine the upper limit position of the needle 27,
There are two adjustments for the adsorbent 28 in the Z-Z' direction.

The upper limit position of the needle 27 is adjusted by a Z-direction fine adjustment screw 57.

If the Z-direction fine adjustment screw 57 is not turned against the stopper 59 when the concave portion of the cam 53 comes into contact with the cam follower 51, the lever 50 to which the adjustment screw 57 is attached swings about the shaft 13 together with the holder 16. As a result, the arm 26 held by the holder 16 also moves in the Z-Z' direction, and the upper limit position at which the needle 27 protrudes from the back side of the wafer sheet 61 and pushes up the pellet 60 can be set.
Z-Z of adsorbent 28! To adjust the direction, use the Z direction fine adjustment screw 4
Perform according to 3.

Pipe 23 and arm 26 are repelled by spring 31, and Z
When the direction fine adjustment screw 43 is turned to move the stopper 45 fixed to the pipe 23 up and down, the pipe 23 is moved up and down by the pin 24.
Since the suction body 28 swings around the center, the adsorption body 28 moves in the Z-Z' direction. As a result, the suction body 28 is attached to the wafer sheet 61.
You can adjust the position in close contact with the back side of the screen. After completing the fine adjustment in the X, Y, and Z directions in this way,
A wafer sheet 61 with pellets 60 adhered to it is fixed to a frame 63 on an XY table of a Y drive mechanism, and the pellets 60 to be attracted are positioned above the needles 27.

Then start the device. As the cam 53 rotates, the lever 50 rotates the shaft 13 clockwise in FIG. do. The suction body 28 rises and comes into close contact with the back side of the wafer sheet 61, and the suction from the vacuum pump causes the wafer sheet 61 to be moved up.
adsorbs. Even when the cam 53 further rotates, the suction body 28 does not rise due to the relationship between the stopper 45 and the adjustment screw 43, but the needle 27 rises until the adjustment screw 57 comes into contact with the stopper 59, and the needle 27 moves toward the back side of the wafer sheet 61. One pellet 60 is pushed up closer to the suction nozzle 63, and the pellet 60 is adsorbed by the suction nozzle 63. When the cam 53 further rotates, the lever 50 rotates in the opposite direction, the shaft 13 and the holder 16 also rotate counterclockwise in FIG. 1, and the hand 27 first descends. A long hole 30a provided in the guide holder 330 while the needle 27 is descending
The pipe 23 is lowered together with the inner wall 30b. As a result, the adsorbent 28 is separated from the back side of the wafer sheet 61. As is clear from the above description, according to the device according to the present invention, the position of the needle that pushes up the pellet is adjusted by the fine adjustment mechanisms in the X, Y, and Z directions that are independently provided. Positioning can be done easily.

[Brief explanation of the drawing]

FIG. 1 is a front view showing one embodiment of the pellet thrust fine adjustment mechanism of the pellet bonding apparatus according to the present invention, and FIG.
The figure is a top view of Fig. 1, Fig. 3 is a view taken along the line 3-3 in Fig. 1, Fig. 4 is a sectional view taken along the line 4-4 in Fig. 1, and Fig. 5 is a sectional view taken along the line 4-4 in Fig. 1.
The figure is a sectional view taken along the line 5--5 in FIG. 4, and FIG. 6 is a sectional view of the conventional example. 10... Frame, 12... Housing,
13...Shaft, 16...Holder, 26
...Arm, 27...Needle, 40...
...Y direction fine adjustment screw, 42...Stopper 1, 46...X force direction fine adjustment screw, 50...
・Lever, 53...Cam, 57...Z
Direction fine adjustment screw, 59...Stopper one, 60.
... Pellet, 61 ... Wafer sheet,
63...Suction nozzle.

Claims (1)

[Scope of Claims] 1. In a pellet bonding apparatus in which pellets stuck on a wafer sheet are pushed up with a needle from the back side of the wafer sheet, each pellet is sucked up one by one with a suction nozzle, and transferred to a semiconductor substrate for bonding, a mount is used. A housing provided to be slidable in a horizontal direction, a shaft rotatably provided to the housing, a driving means for rotating this shaft, a holder for holding an arm fixed to the shaft, and this holder. an arm that is slidably biased in one direction and holds the needle at one end; a holder for holding a pipe fixed to the arm; and a pipe that is swingably provided to the holder; A suction body fixed to one end of the pipe and into which the needle is inserted so as to be vertically movable; an X-direction adjustment member for sliding the housing; and a Y-direction adjustment member for sliding the arm. Pellet bonding equipment featuring: 2. In a pellet bonding device that pushes up pellets stuck on a wafer sheet from the back side of the wafer sheet with a needle, picks them up one by one with a suction nozzle, and transfers them to a semiconductor substrate for bonding, the pellets are slid horizontally onto a pedestal. A housing freely provided, a shaft rotatably provided on the housing, a driving means for rotating the shaft, a holder for holding an arm fixed to the shaft, and a shaft rotatably provided on the holder. An arm that is biased in one direction and holds the needle at one end, a pipe holding holder fixed to this arm, a pipe swingably provided to this holder, and fixed to one end of this pipe. an adsorbent into which the needle is inserted so as to be vertically movable; an X-direction adjustment member for sliding the housing; a Y-direction adjustment member for sliding the arm; and a Y-direction adjustment member for determining the upper limit position of the needle. Z of the needle provided corresponding to the vertical movement mechanism of the needle
A pellet characterized by comprising a direction adjustment member and an adsorbent Z-direction adjustment member provided corresponding to an adsorbent holding mechanism section that holds the adsorbent in order to determine the upper limit position of the adsorbent. bonding equipment.