JPS60234351A - Semiconductor device - Google Patents

Abstract

PURPOSE:To expand the contact surface between a radiating member and a semiconductor chip or a package by holding the sides of radiating member with wavy spring. CONSTITUTION:A substrate 10 and a semiconductor chip 11 are bonded together through the intermediary of a solder bump electrode 12 while the upper end of a radiating member 13 made of a material with high thermal conductivity is provided with bumps 13a to expand the radiating surface. The inside diameter side of a doughnut type spring 14 wavy-formed in the radial direction is fixed on the sides of radiating member 13 while the outside diameter side is fixed on a cover 15. The force exerted on the semiconductor chip 11 may be controlled in the three directions of X, Y, Z by means of said doughnut type spring 14 wavy- formed in the radial direction. Through these procedures, the force exerted on the semiconductor chip 11 may be equalized even if the interface between said chip 11 and the radiating material 13 is flattened. Resultantly any thermal resistance at the contact surface between the semiconductor chip 11 and the radiating member 13 may be reduced since the contact surface may be expanded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to semiconductor devices, and in particular to high-density packaging LSI (Large 5cal) devices that require low thermal resistance.
The present invention relates to a technology that is effective when applied to integrated circuit devices such as e-engineering (integrat, edcluit), etc.

[Background technology]

A conventional high-density-packaged LSI that requires low thermal resistance, as shown in FIG. It has a piston structure that is always in contact with a heat sink (heat dissipation member) 3 such as
6, 1982, PL43-146).

However, according to the studies of the present inventors, the conventional system has the following problems. It is necessary that the semiconductor chip 2 and the P1 sink 3 are always in contact with each other, and
In order to make the weight applied to the semiconductor chip 2 uniform, the tip of the heat sink 3 needs to be rounded. Therefore, the contact area with the semiconductor chip 2 becomes smaller, and the heat dissipation efficiency, which is caused by increased thermal resistance, becomes worse. Further, the weight applied to the semiconductor chip 2 must be accurately controlled by the spring 4.

[Purpose of the invention]

An object of the present invention is to provide a semiconductor device in which heat generated within a semiconductor chip or package is dissipated by a heat dissipating member such as a heat sink, in which the contact area between the semiconductor chip or package and the heat dissipating member is increased, and
The object of the present invention is to provide a technical means for uniformizing the weight applied to a semiconductor chip or package.

Another object of the present invention is to provide a technical means that can freely provide a heat radiating means, for example, a forced cooling means using water, air, etc., a means for enlarging the heat radiating area, etc. on the upper part of the heat radiating member. It is in.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Summary of the invention]

A summary of typical inventions disclosed in this application is as follows.

That is, in a semiconductor device in which heat generated within a semiconductor chip or package is dissipated by a heat dissipating member such as a heat sink, by holding the sides of the heat dissipating member with a wavy spring, heat is dissipated from the semiconductor chip or package. To make the contact area with a member for use as large as possible and to make the weight applied to a semiconductor chip or package uniform.

Also, water.

This makes it possible to provide forced cooling means using air or the like, means for enlarging the heat dissipation area, etc.

Hereinafter, the configuration of the present invention will be explained along with examples. In all the figures of the embodiment, the same parts are denoted by the same reference numerals, and repeated explanations thereof will be omitted.

[Example ■]

Figures 2 to 4 (A), (B), and (C) illustrate the configuration of Example I in which the present invention is applied to a high-density mounting flip-chip type LSI that requires low thermal resistance. Figure 2 is a plan view of the main part, Figure 3 is a diagram for
A sectional view taken along the line XX in FIG. 2, FIG. 4(A),
(B) and (c) are plan views of heat dissipation cross sections of the heat dissipation member shown in FIG. 2;

In FIG. 2 and FIG. 3, 10 is a base, 11 is a semiconductor chip, 12 is a solder bump electrode, and 13 is a heat dissipation member (P1 to sink) made of a material with high thermal conductivity. The upper end surface of the member 13 is arranged as shown in FIGS. 4(A) and 4(B) in order to increase its heat dissipation efficiency.

As shown in (C), the heat dissipation area is expanded due to the unevenness 13A. Reference numeral 14 designates a donut-shaped spring having a wavy shape in the radial direction, and its inner diameter part is fixed to the side part of the heat dissipation member 13, and its outer diameter part is fixed to the cover 15.

With this structure, the force applied to the semiconductor chip 11 can be controlled in the three directions x, y, and z due to the action of the donut-shaped spring 14 formed in the radial direction. As a result, even if the interface between the semiconductor chip 11 and the heat dissipation member 13 is made flat, the force applied to the semiconductor chip 11 can be easily made uniform. Since the contact surface with 13 can be increased, the thermal resistance at the contact surface can be reduced. FIG. 4 is a sectional view of a main part for explaining the configuration of Example H applied to the LS unit of the system.

In FIG. 5, 16 is a package, 17 is a 1-(
pin).

As shown in Figure @5, this embodiment n uses a donut-shaped spring 14 which is wavy in the radial direction like the embodiment f, but the heat generation source is not the semiconductor chip 11 and the package This is the case of 6.

In this way, even when the package 16 is cooled without directly cooling the semiconductor chip, the same effects as in Example I can be obtained.

[Example ■]

In the present embodiment (2), as shown in FIG.
8. The cooling means 18 includes the heat radiation member 13. A cooling pipe is formed by the donut-shaped spring 14° cover 15 whose radial direction is wave-shaped and the tubular member 18A, and water or air is forced to flow into the cooling pipe in the direction of the arrow. ing. With this configuration, the efficiency of dissipating heat generated by the semiconductor chip 11 can be further improved.

[Example ■]

In the present embodiment (2), a cooling means 18 is provided at the upper end of the heat dissipation member 13 as in the above-mentioned embodiment (2), but the cooling means is provided with a separate cooling pipe as shown in FIG. 19,
A hole is made in the side surface of the cooling tube 19, the upper end of the heat radiation member 13 is inserted into the hole, and a gasket 19 is inserted between the two.
It is hermetically sealed by A. Water or air is forced to flow into the cooling pipe 19 in the direction of the arrow. With this configuration, the efficiency of dissipating heat generated by the semiconductor chip 11 can be further improved.

〔effect〕

As explained above, according to the novel technical means disclosed in this application, the following effects can be obtained.

(1) By holding the side portions of the heat dissipation member with wave-shaped springs, it is possible to control the force applied to the semiconductor chip or package in the X, Y, and Z directions. Thereby, the contact surface between the semiconductor chip or package and the heat dissipation member can be made flat, and the contact area can be increased.

(2) According to (1) above, the weight applied to the semiconductor chip or package can be made uniform.

(3) By holding the side portions of the heat dissipation member with wave-shaped springs, it is possible to provide forced cooling means using water, air, etc., means for expanding the heat dissipation area, etc. at the upper end of the heat dissipation member. I can do it.

(4) According to (1) to (3) above, the heat generated in the semiconductor chip or package can be efficiently dissipated, so that the life and reliability of the semiconductor device can be improved.

The present invention has been specifically described above based on examples, but
It goes without saying that the present invention is not limited to the embodiments described above, and can be modified in various ways without departing from the spirit thereof. For example, the donut-shaped spring having a wavy shape in the radial direction may have any shape as long as it is wavy in a direction perpendicular to the side surface of the heat dissipation member.

[Brief explanation of the drawing]

FIG. 1 is a diagram for explaining the problems of high-density packaging LSIs that require low thermal resistance. FIGS. 2 to 4 (A, ), (B), and (C) are diagrams for explaining the configuration of Example (2) in which the present invention is applied to a flip-chip type LSI with high-density packaging. Figure 2 shows
FIG. 3 is a sectional view taken along line XX in FIG. 2; 4(A), (B), and (C) are plan views of the heat dissipation cross section of the heat dissipation member shown in FIG. 2. FIG. FIG. 6 is a sectional view of essential parts for explaining the configuration of embodiment (2) applied to an LSI according to the present invention. FIG. 6 is a sectional view of essential parts for explaining embodiment (2) of the present invention. FIG. 3 is a sectional view of a main part for explaining example (2). In the figure, 10...substrate, 11... semiconductor chip, 12
... solder bump electrode, 13 ... heat dissipation member, 14.
・Doughnut-shaped spring with wavy radial direction,
15...Cover, 16...Package, 17...Lead, 18.Cooling means, 18A...Tubular member, 19...
Cooling tube. Figure 1 Figure 2 Figure No. 4 Figure 4

Claims (1)

[Claims] 18. A semiconductor device in which heat generated within a semiconductor chip or package is radiated by a heat radiating member, characterized in that a side portion of the heat radiating member is held by a wavy spring. . 2. The semiconductor device according to claim 1, wherein the wavy spring is a donut-shaped spring whose radial direction is wave-shaped. 3. Claims 1 and 2, characterized in that the end of the heat dissipating member opposite to the end that contacts the semiconductor chip or package is provided with unevenness to enlarge the surface area.
1. Semiconductor device described in Section 1. 4. The semiconductor device according to any one of claims 1 to 3, characterized in that a forced cooling means is provided at an end of the heat dissipating member opposite to the end that contacts the semiconductor chip or package.