JPS60248768A - Resin composition for laminated board - Google Patents
Resin composition for laminated boardInfo
- Publication number
- JPS60248768A JPS60248768A JP10363684A JP10363684A JPS60248768A JP S60248768 A JPS60248768 A JP S60248768A JP 10363684 A JP10363684 A JP 10363684A JP 10363684 A JP10363684 A JP 10363684A JP S60248768 A JPS60248768 A JP S60248768A
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- resin
- amount
- reactive
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 title claims description 15
- 229920005989 resin Polymers 0.000 claims abstract description 27
- 239000011347 resin Substances 0.000 claims abstract description 27
- 239000003208 petroleum Substances 0.000 claims abstract description 14
- 150000003014 phosphoric acid esters Chemical class 0.000 claims abstract description 12
- -1 melamine compound Chemical class 0.000 claims abstract description 9
- 229920000877 Melamine resin Polymers 0.000 claims abstract description 8
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical class O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 22
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 11
- 235000019256 formaldehyde Nutrition 0.000 claims description 4
- 150000007974 melamines Chemical class 0.000 claims description 3
- 125000000217 alkyl group Chemical group 0.000 claims description 2
- 125000004432 carbon atom Chemical group C* 0.000 claims description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 2
- 229910019142 PO4 Inorganic materials 0.000 claims 1
- 239000010452 phosphate Substances 0.000 claims 1
- 239000003063 flame retardant Substances 0.000 abstract description 14
- 239000000203 mixture Substances 0.000 abstract description 9
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 abstract description 8
- 150000002989 phenols Chemical class 0.000 abstract description 5
- 238000013329 compounding Methods 0.000 abstract 2
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 abstract 2
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 10
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 9
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 7
- 239000002966 varnish Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 238000001879 gelation Methods 0.000 description 6
- 229910052698 phosphorus Inorganic materials 0.000 description 6
- 239000011574 phosphorus Substances 0.000 description 6
- 239000007787 solid Substances 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 5
- 230000018044 dehydration Effects 0.000 description 5
- 238000006297 dehydration reaction Methods 0.000 description 5
- 150000002148 esters Chemical class 0.000 description 5
- 238000010992 reflux Methods 0.000 description 5
- 239000002383 tung oil Substances 0.000 description 5
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 4
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 4
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- GJYCVCVHRSWLNY-UHFFFAOYSA-N 2-butylphenol Chemical compound CCCCC1=CC=CC=C1O GJYCVCVHRSWLNY-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 230000002542 deteriorative effect Effects 0.000 description 2
- 239000002655 kraft paper Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N 1,4a-dimethyl-7-propan-2-yl-2,3,4,4b,5,6,10,10a-octahydrophenanthrene-1-carboxylic acid Chemical compound C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical class [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- WRUXMAOGSQNDLH-UHFFFAOYSA-N P(=O)(O)(O)OC1=CC(O)=C(C=C1C1=CC=CC=C1)C1=CC=CC=C1 Chemical compound P(=O)(O)(O)OC1=CC(O)=C(C=C1C1=CC=CC=C1)C1=CC=CC=C1 WRUXMAOGSQNDLH-UHFFFAOYSA-N 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- NJYZCEFQAIUHSD-UHFFFAOYSA-N acetoguanamine Chemical compound CC1=NC(N)=NC(N)=N1 NJYZCEFQAIUHSD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002366 halogen compounds Chemical class 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical class C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910017464 nitrogen compound Inorganic materials 0.000 description 1
- 150000002830 nitrogen compounds Chemical class 0.000 description 1
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 150000003739 xylenols Chemical class 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Phenolic Resins Or Amino Resins (AREA)
Abstract
Description
【発明の詳細な説明】
[発明の技術分野]
本発明は、電気特性、加工性に優れた耐燃性の積層板用
樹脂組成物に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a flame-resistant resin composition for laminates that has excellent electrical properties and processability.
[発明の技術的背景とその問題点]
近年、電子産業の著しい発展により印刷配線板の使用条
件が苛酷になり、従って印刷配線板の素材であるプリン
ト基板に要求される特性もますます厳しいものとなって
きている。[Technical background of the invention and its problems] In recent years, with the remarkable development of the electronics industry, the usage conditions for printed wiring boards have become harsher, and the characteristics required of the printed circuit boards that are the material for printed wiring boards have also become more severe. It is becoming.
即ち、搭載部品のチップ化、搭載部品の自動挿入化、配
線パターンの高密度化等のため、より優れた電気特性、
物理特性、加工性の優れた積層板が必要となってくると
同時に、火災等の安全性重視の点から、積層板の難燃化
が不可欠な条件となっできた。 これらの要求を満足さ
せるということは、積層板として低温打抜性、寸法安定
性(低膨張、低収縮)、電気特性(耐トラツキング性、
耐アーク性、耐湿特性)、耐熱性かつ耐燃性に優れたも
のでなければならないということであるが、従来の難燃
性積層板用樹脂には次のような問題があった。In other words, better electrical characteristics are achieved due to the use of chips for mounted components, automatic insertion of mounted components, higher density wiring patterns, etc.
At the same time as the need for laminates with excellent physical properties and workability increased, fire-retardant laminates became an indispensable condition due to the emphasis on fire safety. Satisfying these requirements means that the laminate has low-temperature punchability, dimensional stability (low expansion, low shrinkage), electrical properties (tracking resistance,
However, conventional resins for flame-retardant laminates have the following problems.
従来積層板の難燃化のために樹脂に添加される難燃剤は
大別して添加形と反応形のものがあり、それぞれ−長一
知がある。 添加形は難燃剤が樹脂と反応しないもので
、その代表的なものであるトリフェニルフォスフェート
などリン酸エステルでは可塑効果を付与させるが電気特
性、機械特性の低下をまねく欠点がある。 一方、反応
形は難燃剤が樹脂と反応するもので、その代表的なもめ
であるブロム化エポキシ樹脂では優れた電気特性を付与
するが加工性を悪化させる欠点がある。Flame retardants conventionally added to resins to make laminates flame retardant can be roughly divided into additive types and reactive types, each of which has its own length. Additive flame retardants are those in which the flame retardant does not react with the resin, and phosphoric acid esters such as triphenyl phosphate, a typical example, impart a plasticizing effect but have the drawback of deteriorating electrical and mechanical properties. On the other hand, in the reactive type, the flame retardant reacts with the resin, and brominated epoxy resin, which is a typical example of this, provides excellent electrical properties but has the drawback of deteriorating processability.
これらの難燃剤の欠点は低温打抜性を要求され高度に可
塑化された場合、さらに大きくなる。The disadvantages of these flame retardants become even greater when they are highly plasticized and require low-temperature punchability.
また積層板の難燃化は窒素化合物、ハロゲン化合物、リ
ン化合物等の難燃剤を併用することによって実現してい
るが、難燃“剤元素の種類により特性に与える影響も大
きい。 例えばハロゲンの導入は難燃性向上の効果は大
きいが耐アーク性、耐トラツキング性、耐熱性を低下さ
せ、また燃焼時にハロゲン化水素のような有害ガスを発
生させる欠点がある。 リンの導入による難燃化は耐ア
ーク性、耐トラツキング性を向上させ、有害ガスの発生
の危険もないが、リン単独による十分な難燃化は困難で
ある等の欠点を持っている。In addition, flame retardant laminates are achieved by using flame retardants such as nitrogen compounds, halogen compounds, and phosphorus compounds in combination, but the type of flame retardant element has a large effect on the properties. For example, the introduction of halogen Although it has a great effect on improving flame retardancy, it has the disadvantage of decreasing arc resistance, tracking resistance, and heat resistance, and generating harmful gases such as hydrogen halides when burned. Although it improves arc resistance and tracking resistance, and there is no risk of generating harmful gases, it has drawbacks such as the difficulty of achieving sufficient flame retardancy using phosphorus alone.
[発明の目的]
本発明は、前記の欠点を解消するためになされたもので
、電気特性、低温打抜加工性に優れた耐燃性の積層板用
樹脂組成物を提供することを目的としている。[Object of the Invention] The present invention was made in order to eliminate the above-mentioned drawbacks, and an object of the present invention is to provide a flame-resistant resin composition for laminates that has excellent electrical properties and low-temperature punching workability. .
[発明の概要]
本発明は、上記の目的を達成すべく鋭意研究を重ねた結
果、反応性リン酸エステルをメラミン変性フェノール樹
脂の骨格内に組み込み、石油樹脂を可塑性助剤として使
用することにより上記目的を達成できることを見いだし
、本発明をなすに至ったものである。[Summary of the Invention] As a result of extensive research to achieve the above object, the present invention has been developed by incorporating a reactive phosphoric acid ester into the skeleton of a melamine-modified phenolic resin and using a petroleum resin as a plasticizing aid. It was discovered that the above object can be achieved, and the present invention was completed.
即ち、本発明は、
(A)一般式
(式中、R’ 、R2は水素原子又は炭素数1〜20の
アルキル基を表わす)で示される反応性リン酸エステル
類と、
(B)フェノール類と、(C)メラミン類と、(D)ホ
ルムアルデヒド類と、(E)石油樹脂とからなることを
特徴とする積層板用樹脂組成物である。 そして好まし
い実施態様は、反応性リン酸エステルの量が全体の量に
対して20〜60重量%、また石油樹脂の量が同じ<
2−120重量%含有する積層板用樹脂組成物である。That is, the present invention provides: (A) reactive phosphoric esters represented by the general formula (wherein R' and R2 represent a hydrogen atom or an alkyl group having 1 to 20 carbon atoms); and (B) phenols. A resin composition for a laminate comprising: (C) melamines; (D) formaldehydes; and (E) petroleum resin. In a preferred embodiment, the amount of reactive phosphoric acid ester is 20 to 60% by weight based on the total amount, and the amount of petroleum resin is the same.
This is a resin composition for a laminate containing 2 to 120% by weight.
本発明により、従来技術におけるリン系難燃剤を骨格内
に組み込む反応形に転換して添加形難燃剤の欠点である
電気特性の低下を防ぐことができ、また反応形への転換
によ2て起る可塑効果の低減を石油樹脂によって補ない
、反応形であるブロム化エポキシ樹脂等を用いないこと
によって加工性の悪化を防ぐことができる。According to the present invention, it is possible to convert the phosphorus-based flame retardant in the prior art to a reactive type that is incorporated into the skeleton, thereby preventing the deterioration of electrical properties, which is a drawback of additive type flame retardants. Deterioration in processability can be prevented by compensating for the reduction in plasticizing effect that occurs with petroleum resins and by not using reactive brominated epoxy resins.
本発明に用いる(A)反応性リン酸エステル類としてば
、
等が挙げられ、これらの1種又は2種以上の混合系とし
て用いる。 この反応性リン酸エステル類は、常法によ
るリン酸エステルの製造法により作る場合、他のリン酸
エステルとの反応物となる。Examples of the (A) reactive phosphoric acid esters used in the present invention include the following, and these are used alone or as a mixture of two or more. When these reactive phosphoric esters are produced by a conventional method for producing phosphoric esters, they become reactants with other phosphoric esters.
反応性リン酸エステル類の含有率は70%以上であるこ
とが望ましい。It is desirable that the content of the reactive phosphoric esters is 70% or more.
本発明に用いる(B)フェノール類としては、フェノー
ル、クレゾール、キシレノール、ブチルフェノール、ノ
ニルフェノール、桐油のフェノール付加物、キシレン樹
脂・フェノール混合物等が挙げられ、これらの1種又は
2種以上の混合系として使用される。Examples of the phenols (B) used in the present invention include phenol, cresol, xylenol, butylphenol, nonylphenol, phenol adducts of tung oil, xylene resin/phenol mixtures, and mixtures of one or more of these. used.
本発明に用いる(C)メラミン類としては、メラミン、
ベンゾグアナミン、アセトグアナミン、ホルムグアナミ
ン等が挙げられ、これらの1種又は2種以上の混合系と
して使用される。Melamines (C) used in the present invention include melamine,
Examples include benzoguanamine, acetoguanamine, and formguanamine, and these may be used alone or as a mixture of two or more thereof.
本発明に用いる([))ホルムアルデヒド類としては、
ホルマリン、パラホルムアルデヒド等が挙げられる。Formaldehydes ([)) used in the present invention include:
Examples include formalin and paraformaldehyde.
本発明に用いる(E)石油樹脂としては、例えばフィン
トン1500.フィントン1700 (日本ゼオン社製
商品名)等が挙げられる。As the petroleum resin (E) used in the present invention, for example, Finton 1500. Examples include Finton 1700 (trade name manufactured by Nippon Zeon Co., Ltd.).
本発明の積層板用樹脂組成物の製造法は、前述の各成分
を反応させて製造すればよいので反応順序に特に限定さ
れないが、フェノール類とメラミン類とホルムアルデヒ
ド類とを反応させ、次いで反応性リン酸エステル類とホ
ルムアルデヒド類とを加えて反応させた後、さらに石油
樹脂を加えて積層板用樹脂組成物を製造することが望ま
しい。The method for producing the resin composition for laminates of the present invention is not particularly limited to the reaction order since it can be produced by reacting each of the above-mentioned components. It is desirable to add a petroleum resin and a petroleum resin to produce a resin composition for a laminate after adding and reacting a phosphoric acid ester and a formaldehyde.
次に各成分の配合割合については、全体に対して反応性
リン酸エステル類が20〜60重量%であることが必要
である。 20重量%未満では十分な耐層性が得られず
、また60重量%を超え−ると電気特性の低下が起こり
好ましくない。 また石油樹脂の配合割合は、全体に対
して2〜20重量%であることが必要である。 2重量
%未満では可塑化に効果なく、また20重量%を超える
と電気特性が低トし好ましくない。Next, regarding the blending ratio of each component, it is necessary that the amount of reactive phosphoric acid esters is 20 to 60% by weight based on the total weight. If it is less than 20% by weight, sufficient layer resistance cannot be obtained, and if it exceeds 60% by weight, electrical properties may deteriorate, which is not preferable. Further, the blending ratio of petroleum resin needs to be 2 to 20% by weight based on the total weight. If it is less than 2% by weight, it has no effect on plasticization, and if it exceeds 20% by weight, the electrical properties deteriorate, which is not preferable.
こうして得られた積層板用樹脂組成物を有機溶剤に溶解
希釈し、これをクラフト紙等の紙基材に含浸させてプリ
プレグを作り、このプリプレグを複数枚積層した後、加
熱加圧成形して積層板を得ることができる。The resin composition for laminates obtained in this way is dissolved and diluted in an organic solvent, and a paper base material such as kraft paper is impregnated with this to make a prepreg. After laminating a plurality of sheets of this prepreg, the prepreg is molded under heat and pressure. A laminate can be obtained.
[発明の実施例]
以下本発明の実施例を具体的に説明する。 本発明はこ
れらの実施例に限定されるものではない。[Embodiments of the Invention] Examples of the present invention will be specifically described below. The present invention is not limited to these examples.
反応性リン酸エステルの製造
常法のリン酸エステルの製造方法によってジフェニルレ
ゾルシンホスフェート75%含有の反応性リン酸エステ
ルを製造した(以下リン化合物という)。Preparation of Reactive Phosphoric Acid Ester A reactive phosphoric acid ester containing 75% diphenylresorcinol phosphate was produced by a conventional method for producing a phosphoric acid ester (hereinafter referred to as a phosphorus compound).
実施例 1
コンデンサ付四つロフラスコにメラミン126g、フェ
ノール188(] 、および337%ホルマリン551
を仕込み、90℃で2時間反応させた。 次いでリン化
合物239G 、 37%ホルマリン130g、および
ジメチルアミン6gを加え還流反応で2時間反応させ、
減圧脱水した後、フィントン1500(日本ゼオン社製
石油樹脂商品名)35Qを加えて積層板用樹脂組成物を
得た。 これをメチルエチルケトン:メタノール−1=
1溶剤で希釈し、樹脂固形分55重量%、粘度1.5ポ
アズ(25℃)、ゲル化時間3分40秒(150℃)の
ワニスを調製した。Example 1 126 g of melamine, phenol 188 (), and 337% formalin 551 were placed in a four-loaf flask with a condenser.
was charged and reacted at 90°C for 2 hours. Next, 239G of phosphorus compound, 130g of 37% formalin, and 6g of dimethylamine were added and reacted under reflux for 2 hours.
After dehydration under reduced pressure, Finton 1500 (trade name of petroleum resin manufactured by Nippon Zeon Co., Ltd.) 35Q was added to obtain a resin composition for a laminate. This is methyl ethyl ketone:methanol-1=
A varnish having a resin solid content of 55% by weight, a viscosity of 1.5 poise (at 25°C), and a gelation time of 3 minutes and 40 seconds (at 150°C) was prepared by diluting with 1 solvent.
実施例 2
コンデンサ付四つロフラスコにフェノール200Q、桐
油100g、およびパラトルエンスルホン酸0.3gを
仕込み、100℃で1時間反応させた後、40%アンモ
ニア水で中和した。 次いでベンゾグアナミン250g
、リン化合物400(] 、337%ホルマリン660
1 、およびジメチルアミン8gを加え還流反応で2時
間30分反応さゼた後、減圧脱水し、フィントン150
0(日本ゼオン社製石油樹脂商品名)50gを加えて積
層板用樹脂組成物を得た。Example 2 Phenol 200Q, 100 g of tung oil, and 0.3 g of p-toluenesulfonic acid were charged into a four-hole flask with a condenser, and the mixture was reacted at 100° C. for 1 hour, and then neutralized with 40% aqueous ammonia. Then 250g of benzoguanamine
, phosphorus compound 400 (] , 337% formalin 660
1, and 8 g of dimethylamine were added and the reaction was carried out under reflux for 2 hours and 30 minutes, followed by dehydration under reduced pressure.
0 (trade name of petroleum resin manufactured by Nippon Zeon Co., Ltd.) was added to obtain a resin composition for a laminate.
これをメチルエチルケトン:メタノール−1:1溶剤で
希釈し、樹脂固形分55重量%、粘度2.8ポアズ(2
5℃)、ゲル化時間3分50秒(150℃)のワニスを
調製した。This was diluted with methyl ethyl ketone:methanol-1:1 solvent, and the resin solid content was 55% by weight and the viscosity was 2.8 poise (2.
A varnish with a gelation time of 3 minutes and 50 seconds (150°C) was prepared.
実施例 3
コンデンサ付四つ目フラスコに二カノールH(三菱ガス
化学社製商品名)15g、フェノール125iJ 1桐
油100gおよびパラトルエンスルホン酸0.27f)
を仕込み、110℃で1時間反応させた後、40%アン
モニア水で中和した。 次いでベンゾグアナミン250
(] 、リン化合物400(] 、 337%ホルマリ
ン550、およびジメチルアミン6gを加え還流反応で
2時間反応させ、減圧脱水した後、フィントン1500
(前出)50gを加えて積層板用樹脂組成物を得た。
これをメチルエチルケトン:メタノール−1=1溶剤で
希釈し、樹脂固形分55重量%、粘度3.2ポアズ(2
5℃)、ゲル化時間3分10秒(150℃)のワニスを
調製した。Example 3 In a four-eye flask with a condenser, 15 g of dicanol H (trade name manufactured by Mitsubishi Gas Chemical Co., Ltd.), 100 g of phenol 125 iJ 1 tung oil, and 0.27 f of p-toluenesulfonic acid)
was charged, reacted at 110°C for 1 hour, and then neutralized with 40% aqueous ammonia. Then benzoguanamine 250
(], phosphorus compound 400 (), 337% formalin 550, and 6 g of dimethylamine were added and reacted under reflux for 2 hours. After dehydration under reduced pressure, Finton 1500
(mentioned above) was added to obtain a resin composition for a laminate.
This was diluted with methyl ethyl ketone:methanol-1=1 solvent, the resin solid content was 55% by weight, and the viscosity was 3.2 poise (2
A varnish with a gelation time of 3 minutes and 10 seconds (150°C) was prepared.
比較例 1
コンデンサ付四つロフラスコにメラミン126g、フェ
ノール1881111および37%ホルマリン551g
を仕込み、90℃で2時間反応させた。 次いで減圧脱
水を行い、トルエン:メタノール−1:9溶剤で希釈し
、これにトリフェニルホスフェート209gを加えて樹
脂固形分55重量%、粘度1.0ポアズ(25℃)、ゲ
ル化時間6分10秒(150℃)のワニスを調製した。Comparative Example 1 126 g of melamine, 1881111 phenol and 551 g of 37% formalin in a four-loop flask with a condenser
was charged and reacted at 90°C for 2 hours. Next, dehydration was performed under reduced pressure, diluted with toluene:methanol-1:9 solvent, and 209 g of triphenyl phosphate was added to this to give a resin solid content of 55% by weight, a viscosity of 1.0 poise (25°C), and a gelation time of 6 minutes. A second (150°C) varnish was prepared.
比較例 2
コンデンサ付四つロフラスコにフェノール2009、桐
油100g、およびパラトルエンスルボン酸0.3(]
を仕込み、100℃で1時間反応させた後、40%アン
モニア水で中和した。 次にベンゾグアナミン250Q
、フェノール127137%ホルマリン460(1、
およびジメチルアミン5gを加え還流反応で2時間反応
させ、減圧脱水した後、トルエン:メタノール−1:1
溶剤で希釈し、これにトリフェニルホスフェート341
gを加えて樹脂固形分55重量%、粘度1,8ポアズ(
25℃)、ゲル化時間6分20秒(150℃)のワニス
を調製した。Comparative Example 2 Phenol 2009, 100 g of tung oil, and 0.3 p-toluenesulfonic acid were placed in a four-loaf flask with a condenser.
was charged, reacted at 100°C for 1 hour, and then neutralized with 40% aqueous ammonia. Next, benzoguanamine 250Q
, phenol 127137% formalin 460 (1,
and 5 g of dimethylamine were added and reacted for 2 hours under reflux reaction. After dehydration under reduced pressure, toluene:methanol-1:1
Dilute with solvent and add triphenyl phosphate 341 to this.
g to give a resin solid content of 55% by weight and a viscosity of 1.8 poise (
A varnish with a gelation time of 6 minutes and 20 seconds (150°C) was prepared.
比較例 3
コンデンサ付四つロフラスコに二カノールH(前出)
75a 、フェノール125g、桐油100(+ iよ
びパラトルエンスルホン酸0.27i7を仕込み、11
0℃で1時間反応させた後、40%アンモニア水で中和
した。 次いでベンゾグアナミン200Q、フェノール
1217.37%ホルマリン350(J 、およびジメ
チルアミン4gを加え還流反応で2時間反応させ、減圧
脱水した後、トルエン:メタノール−1=1溶剤で希釈
し、これにトリフェニルホスフェート341gを加えて
樹脂固形分55重量%、粘度1.5ポアズ(25℃)、
ゲル化時間5分30秒(150℃)のワニスを調製した
。Comparative example 3 Two canol H in a four-loop flask with a condenser (described above)
75a, 125g of phenol, 100g of tung oil (+i) and 0.27i7 of para-toluenesulfonic acid,
After reacting at 0°C for 1 hour, the mixture was neutralized with 40% aqueous ammonia. Next, benzoguanamine 200Q, phenol 1217.37% formalin 350 (J), and dimethylamine 4g were added and reacted for 2 hours under reflux, dehydrated under reduced pressure, diluted with toluene:methanol-1=1 solvent, and triphenyl phosphate was added to this. 341g was added to give a resin solid content of 55% by weight, a viscosity of 1.5 poise (25°C),
A varnish with a gelation time of 5 minutes and 30 seconds (150°C) was prepared.
以上の実施例1〜3におよび比較例1〜3で調製したワ
ニスを10ミルスのクラフト紙に含浸塗布し、樹脂含有
量50重量%、レジンフロー8%のプリプレグを得に0
このプリプレグ8枚と接着剤材−箔1枚を重ね合せ1
70℃、 100 kMcm2の条件で75分間加熱加
圧成形して厚さ1.6mmの銅張積層板を製造した。
製造した銅張積層板について特性を試験したのでその結
果を第1表に示した。The varnishes prepared in Examples 1 to 3 and Comparative Examples 1 to 3 above were impregnated and coated on 10 mils kraft paper to obtain a prepreg with a resin content of 50% by weight and a resin flow of 8%.
Layer 8 sheets of this prepreg and 1 sheet of adhesive material-foil 1
A copper-clad laminate having a thickness of 1.6 mm was manufactured by heat-pressing molding at 70° C. and 100 kmcm2 for 75 minutes.
The properties of the manufactured copper-clad laminates were tested and the results are shown in Table 1.
[発明の効果]
以上の説明および第1表から明らかなように、本発明の
積層板用樹脂組成物は電気特性、低温打抜加工性に優れ
、かつ耐燃性を有しているため、積層板またはプリント
基板として用いた場合、苛酷な使用条件にも十分耐えら
れるものである。[Effects of the Invention] As is clear from the above explanation and Table 1, the resin composition for laminates of the present invention has excellent electrical properties and low-temperature punching workability, and has flame resistance. When used as a board or printed circuit board, it can withstand harsh usage conditions.
Claims (1)
アルキル基を表わす)で示される反応性リン酸エステル
類と、 (B)フェノール類と、(C)メラミン類と、(D)ホ
ルムアルデヒド類と、(E)。 石油樹脂と からなることを特徴とする積層板用樹脂組成物。 2 (A)反応性リン酸エステルの量が全体[<A)+
(B)+(C>+(D)+(E)]の量に対して20
〜60重量%である特許請求の範囲第1項記載の積層板
用樹脂組成物。 3 (E)石油樹脂の量が全体[(A> +(B)+(
C)+ (D)+ (E)]の量に対して2〜20重量
%である特許請求の範囲第1項又は第2項記載の積層板
用樹脂組成物。[Scope of Claims] 1 (A) a reactive phosphoric acid ester represented by the general formula (wherein R' and R2 represent a hydrogen atom or an alkyl group having 1 to 20 carbon atoms); and (B) phenol. (C) melamines, (D) formaldehydes, and (E). A resin composition for a laminate, comprising a petroleum resin. 2 (A) The amount of reactive phosphate ester is the total [<A)+
20 for the amount of (B) + (C > + (D) + (E))
60% by weight of the resin composition for a laminate according to claim 1. 3 (E) The amount of petroleum resin is the whole [(A> +(B)+(
The resin composition for a laminate according to claim 1 or 2, wherein the amount is 2 to 20% by weight based on the amount of C) + (D) + (E)].
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10363684A JPS60248768A (en) | 1984-05-24 | 1984-05-24 | Resin composition for laminated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10363684A JPS60248768A (en) | 1984-05-24 | 1984-05-24 | Resin composition for laminated board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60248768A true JPS60248768A (en) | 1985-12-09 |
| JPH058220B2 JPH058220B2 (en) | 1993-02-01 |
Family
ID=14359252
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10363684A Granted JPS60248768A (en) | 1984-05-24 | 1984-05-24 | Resin composition for laminated board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60248768A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01223158A (en) * | 1988-03-02 | 1989-09-06 | Ajinomoto Co Inc | Flame-retardant phenolic resin composition |
-
1984
- 1984-05-24 JP JP10363684A patent/JPS60248768A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01223158A (en) * | 1988-03-02 | 1989-09-06 | Ajinomoto Co Inc | Flame-retardant phenolic resin composition |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH058220B2 (en) | 1993-02-01 |
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