JPS6033122B2 - Method for producing phenolic resin - Google Patents
Method for producing phenolic resinInfo
- Publication number
- JPS6033122B2 JPS6033122B2 JP6500782A JP6500782A JPS6033122B2 JP S6033122 B2 JPS6033122 B2 JP S6033122B2 JP 6500782 A JP6500782 A JP 6500782A JP 6500782 A JP6500782 A JP 6500782A JP S6033122 B2 JPS6033122 B2 JP S6033122B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- weight
- phenolic
- phenol
- polyacetal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000005011 phenolic resin Substances 0.000 title claims description 17
- 229920001568 phenolic resin Polymers 0.000 title claims description 12
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 title claims description 9
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 229920006324 polyoxymethylene Polymers 0.000 claims description 19
- 229930182556 Polyacetal Natural products 0.000 claims description 18
- 229920005989 resin Polymers 0.000 claims description 14
- 239000011347 resin Substances 0.000 claims description 14
- 230000002378 acidificating effect Effects 0.000 claims description 11
- 150000002989 phenols Chemical class 0.000 claims description 11
- 239000003054 catalyst Substances 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 9
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 150000003839 salts Chemical class 0.000 claims description 3
- 150000007522 mineralic acids Chemical group 0.000 claims description 2
- 150000007524 organic acids Chemical group 0.000 claims description 2
- -1 phenol compound Chemical class 0.000 claims description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 26
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 6
- 229930040373 Paraformaldehyde Natural products 0.000 description 6
- 239000002699 waste material Substances 0.000 description 6
- 229920002866 paraformaldehyde Polymers 0.000 description 5
- 239000002253 acid Substances 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 235000021355 Stearic acid Nutrition 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- ZOIORXHNWRGPMV-UHFFFAOYSA-N acetic acid;zinc Chemical compound [Zn].CC(O)=O.CC(O)=O ZOIORXHNWRGPMV-UHFFFAOYSA-N 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 239000012772 electrical insulation material Substances 0.000 description 2
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 description 2
- 229920001519 homopolymer Polymers 0.000 description 2
- 239000012778 molding material Substances 0.000 description 2
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 2
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 2
- 235000006408 oxalic acid Nutrition 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 239000004576 sand Substances 0.000 description 2
- 239000008117 stearic acid Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000004246 zinc acetate Substances 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- DEXFNLNNUZKHNO-UHFFFAOYSA-N 6-[3-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperidin-1-yl]-3-oxopropyl]-3H-1,3-benzoxazol-2-one Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C1CCN(CC1)C(CCC1=CC2=C(NC(O2)=O)C=C1)=O DEXFNLNNUZKHNO-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- 238000004566 IR spectroscopy Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 150000004292 cyclic ethers Chemical class 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- 239000004312 hexamethylene tetramine Substances 0.000 description 1
- 235000010299 hexamethylene tetramine Nutrition 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 1
- NFMWFGXCDDYTEG-UHFFFAOYSA-N trimagnesium;diborate Chemical compound [Mg+2].[Mg+2].[Mg+2].[O-]B([O-])[O-].[O-]B([O-])[O-] NFMWFGXCDDYTEG-UHFFFAOYSA-N 0.000 description 1
- 239000013638 trimer Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 125000002256 xylenyl group Chemical class C1(C(C=CC=C1)C)(C)* 0.000 description 1
Landscapes
- Phenolic Resins Or Amino Resins (AREA)
Description
【発明の詳細な説明】
本発明は、フェノール樹脂を製造するための新規方法に
関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a new process for producing phenolic resins.
さらに詳しくいえば本発明は、ホルムアルデヒド源とし
てポリアセタール樹脂を用いる新規なフェノール樹脂の
製造方法に関するものである。フェノール樹脂は、熱硬
化性樹脂の代表的なものであり、低価格で寸法安定性が
あり、かつ高強度及び耐久性を有するので、電気絶縁材
、成形材料、金属の表面仕上剤、接着剤などとして広い
分野に用いられている。More specifically, the present invention relates to a novel method for producing phenolic resins using polyacetal resins as a formaldehyde source. Phenolic resin is a typical thermosetting resin and is low-priced, dimensionally stable, and has high strength and durability, so it is used as electrical insulation materials, molding materials, metal surface finishing agents, and adhesives. It is used in a wide range of fields.
このフェノール樹脂は、酸や塩基を触媒として用い、フ
ェノールとホルムアルデヒドとを反応させることによっ
て製造されるが、これまでホルムアルデヒドの供給源と
しては、その水溶液であるホルマリンやその三量体であ
るパラホルムアルデヒドが使用されていた。This phenolic resin is produced by reacting phenol with formaldehyde using an acid or base as a catalyst. Up until now, the sources of formaldehyde have been formalin, which is an aqueous solution, and paraformaldehyde, which is a trimer of formaldehyde. was used.
他方、ポリアセタール樹脂は、電気絶縁性、機械的強度
、位定性の良好な熱可塑性樹脂で、電気絶縁材、各種成
形材料として使用されているが、この製造工程中で発生
する不良品や使用済の廃品については再利用の道がなく
焼却等により廃棄されているのが実情である。On the other hand, polyacetal resin is a thermoplastic resin with good electrical insulation properties, mechanical strength, and positioning properties, and is used as electrical insulation materials and various molding materials. The reality is that there is no way to reuse the waste products, so they are disposed of by incineration, etc.
本発明者らは、このように従来無為に廃棄されていたポ
リアセタール樹脂を有効利用することについて鋭意研究
を重ねた結果、ポリアセタール樹脂が水と酸性物質の共
存下で浸食されストレスクラックを生じるという欠点を
有することに着目し、この現象を積極的に助長して分解
を行わせれば、ホルムアルデヒドの発生源となしうろこ
と、この分解はフェノール系化合物の存在により著しく
促進されること見出し、これらの知見に基づいて本発明
をなすに至った。As a result of extensive research into the effective use of polyacetal resin, which had previously been wasted in the past, the inventors of the present invention discovered that polyacetal resin has the drawback that it erodes in the coexistence of water and acidic substances, causing stress cracks. They focused on the fact that scales have phenolic compounds, and discovered that if this phenomenon is actively encouraged to decompose, scales become a source of formaldehyde, and that this decomposition is significantly accelerated by the presence of phenolic compounds. The present invention has been made based on this.
すなわち、本発明は、フェノール系化合物とポリアセタ
ール樹脂とを、水及び酸性触媒の存在下に加熱すること
を特徴とするフェノール樹脂の製造方法を提供するもの
である。That is, the present invention provides a method for producing a phenolic resin, which is characterized by heating a phenolic compound and a polyacetal resin in the presence of water and an acidic catalyst.
本発明方法において用いられるフェノ−ル系化合物とし
ては、フェノールのほか、クレソール、キシレノールの
ようなアルキル化フェノールを挙げることができる。The phenolic compounds used in the method of the present invention include, in addition to phenol, alkylated phenols such as cresol and xylenol.
また、ポリアセタール樹脂としては、ホモポリマーのみ
でなく、ホルムアルデヒドと酸化エチレン等の環状エー
テル類とのコポリマ−、末端基にエーテル結合、ェステ
ル結合又はウレタン結合をもつポリオキシメチレン誘導
体なども用いることができる。In addition, as the polyacetal resin, not only homopolymers but also copolymers of formaldehyde and cyclic ethers such as ethylene oxide, polyoxymethylene derivatives having ether bonds, ester bonds, or urethane bonds in the terminal groups can be used. .
これらの原料成分は、フェノール類10の重量部当り、
ポリアセタール樹脂20〜32重量部、好ましくは22
〜2り重量部の割合で用いられる。These raw material components are per 10 parts by weight of phenols,
20 to 32 parts by weight of polyacetal resin, preferably 22 parts by weight
~2 parts by weight.
次に、本発明で用いられる酸性触媒の例としては、塩酸
、硫酸のような無機酸、シュウ酸、酢酸、パラトルェン
スルホン酸のような有機酸、酢酸亜鉛、ホウ酸マグネシ
ウムのような酸性の塩を挙げることができる。これらの
酸性触媒は、ポリァセタール樹脂10の重量部当り1〜
1の重量部の割合で用いられる。この酸性触媒と共に添
加される水の量は、フェノール系化合物10の重量部当
り、2〜20重量部好ましくは5〜1の重量部の範囲内
で選択するのが適当である。Next, examples of acidic catalysts used in the present invention include inorganic acids such as hydrochloric acid and sulfuric acid, organic acids such as oxalic acid, acetic acid, and para-toluenesulfonic acid, and acidic acids such as zinc acetate and magnesium borate. salt. These acidic catalysts are used in an amount of 1 to 10 parts by weight of polyacetal resin.
It is used in a proportion of 1 part by weight. The amount of water added together with the acidic catalyst is suitably selected within the range of 2 to 20 parts by weight, preferably 5 to 1 part by weight, per 10 parts by weight of the phenolic compound.
本発明方法を好適に実施するには、フェノール系化合物
、ポリアセタール樹脂、水及び酸性触媒を所定の割合で
混合した混合物をを加熱溶融し、かきまぜながら1〜1
加持間加熱還流させたのち、減圧脱水する。In order to suitably carry out the method of the present invention, a mixture of a phenolic compound, a polyacetal resin, water and an acidic catalyst in a predetermined ratio is heated and melted, and while stirring,
After heating under reflux during the holding period, dehydration is performed under reduced pressure.
この際の加熱温度は、通常100〜20000の範囲内
である。このようにして得られたフェノール樹脂中には
、ポリアセタール樹脂は実質的に残存していない。The heating temperature at this time is usually within the range of 100 to 20,000. Substantially no polyacetal resin remains in the phenol resin thus obtained.
このようにして、従来のホルマリン、パラホルムアルデ
ヒドを使用した場合と化学的、物理的性質においてなん
ら差異のない良質のフェノール樹脂を得ることができる
。これまで、酸性水溶液中でのポリアセタール樹脂の分
解には非常に長時間(例えば5%酢酸水溶液中では1年
以上)を要することが知られていたにもかかわらず、フ
ェノールの共存により数時間という短時間で反応が完了
するということ、またこれまで酸に対する安定性が高い
とされていたポリアセタールのコボリマーがホモボリマ
ーと同様短時間で分解し、反応が完結するということは
、全く予想外のことであった。In this way, it is possible to obtain a high-quality phenol resin that has no difference in chemical and physical properties from conventional formalin and paraformaldehyde. Until now, it was known that decomposition of polyacetal resin in an acidic aqueous solution takes a very long time (for example, more than a year in a 5% acetic acid aqueous solution), but due to the coexistence of phenol, it takes only a few hours. It was completely unexpected that the reaction completed in a short time, and that the copolymer of polyacetal, which had been thought to have high stability against acids, decomposed and completed the reaction in a short time just like a homopolymer. there were.
本発明方法は、これまでなんら利用されることなく廃棄
されていたポリアセタール樹脂の不良品や使用済廃品を
用いて、ホルマリンやパラホルムアルデヒドを原料とし
て用いて得られるものと全く同じ品質のフェノール樹脂
を得ることができるので、省資源の面及び製造原価の低
廉化の面で非常に有利な工業的方法であるということが
できる。The method of the present invention uses defective and used waste polyacetal resins that have been discarded without being used in any way to produce phenolic resins of exactly the same quality as those obtained using formalin or paraformaldehyde as raw materials. Therefore, it can be said that this is a very advantageous industrial method in terms of resource saving and low manufacturing cost.
次に実施例により本発明をさらに詳細に説明する。Next, the present invention will be explained in more detail with reference to Examples.
実施例 1
5ク客の三つロフラスコ中に、フェノール3000夕、
ベレット状の廃棄ポリアセタールコポリマー(ホルムア
ルデヒド成分2.18%)7669、水150夕及びシ
ュウ酸30夕を加え、102〜11500の温度に加熱
熔融し、かきまぜながら4時間還流させたのち、さらに
圧力73仇奴Hgに減圧しながら、2時間で180oo
まで昇縞し、脱水させた。Example 1 In a three-bottomed flask with five customers, 3,000 ml of phenol,
Add pellet-shaped waste polyacetal copolymer (formaldehyde content 2.18%) 7669, 150 ml of water and 30 ml of oxalic acid, heat and melt at a temperature of 102 to 11,500 ml, reflux for 4 hours with stirring, and then increase the pressure to 73 ml. 180oo in 2 hours while decompressing to Hg
It was dried until it reached the point where it was boiled and then dehydrated.
このようにして、融点(JIS−K−6910)74℃
、フロー7仇舷、ゲルタィム72砂のフェノール樹脂3
090夕を得た。In this way, melting point (JIS-K-6910) 74℃
, Flow 7, Geltime 72 Sand Phenolic Resin 3
Got 090 evening.
実施例 2
5そ客の三つ口フラスコ中に、フェノール3000夕、
ベレット状の廃棄ポリアセタール715夕、水300夕
及び酢酸亜鉛15夕を加え、102〜10500におい
て6時間かきまぜながら還流させた。Example 2 5 In the customer's three-necked flask, 3000 g of phenol was added.
715 tons of pellet-shaped waste polyacetal, 300 tons of water, and 15 tons of zinc acetate were added, and the mixture was refluxed at 102 to 10,500 degrees Celsius while stirring for 6 hours.
次いで圧力73&肋Hgのもとで、1800Cまで昇溢
しながら1時間3び分脱水することによりフェノール樹
脂2940夕を得た。このフェノール樹脂は、融点(J
IS−K−6910)68ごC、フロー52側、ゲルタ
イム3現砂、オルソーパラ比(o/p)3.5(赤外線
吸収スペクトル法による)であった。Next, the mixture was dehydrated for 1 hour and 3 minutes under a pressure of 73 Hg and overflowing to 1800 C, to obtain a phenol resin of 2940 kg. This phenolic resin has a melting point (J
IS-K-6910) 68 C, flow 52 side, gel time 3 present sand, ortho-para ratio (o/p) 3.5 (according to infrared absorption spectroscopy).
このものは、廃棄ポリアセタールの代物こ、ホルマリン
又はパラホルムアルデヒドを用いて得た/・ィオルソタ
ィプのフェノール樹脂と特性上特に差異は認められなか
った。No particular difference in properties was observed between this product and the phenol resin of the ``ortho-type'' obtained using formalin or paraformaldehyde as a substitute for waste polyacetal.
比較例
実施例1における廃棄ポリアセタールコポリマー766
夕の代りに、92%粒状パラホルムアルデヒド833夕
を用い、水の量を83夕とする以外は、全く実施例1と
同様に処理してフェノール樹脂を製造した。Comparative Example Waste Polyacetal Copolymer 766 in Example 1
A phenol resin was produced in the same manner as in Example 1, except that 92% granular paraformaldehyde 833% was used instead of 83% water, and the amount of water was changed to 833%.
このものは融点(JIS−K−6910)75oo、フ
ロー6物肋、ゲルタイム7の秒、であった。This product had a melting point (JIS-K-6910) of 75 oo, a flow of 6, and a gel time of 7 seconds.
実施例1で得たフェノール樹脂とこの例で得たフェノー
ル樹脂のそれぞれ5の重量部に、木粉3の重量部、炭酸
カルシウム2の重量部、ヘキサメチレンテトラミン7.
5重量部、ステアリン酸2重量部を配合し、ロールで濠
練したのち、成形して試料(SF50仇肋)を作成した
。To 5 parts by weight of each of the phenolic resin obtained in Example 1 and this example, 3 parts by weight of wood flour, 2 parts by weight of calcium carbonate, and 7 parts by weight of hexamethylenetetramine.
5 parts by weight of stearic acid and 2 parts by weight of stearic acid were blended, kneaded with a roll, and then molded to prepare a sample (SF50 Rib).
これらの試料についてJIS−K−6911に従って物
理的、機械的特性を測定し、その結果を次表に示す。The physical and mechanical properties of these samples were measured according to JIS-K-6911, and the results are shown in the table below.
この表から明らかなように、本発明方法で得られたフェ
ノール樹脂の成形品は、従来のものとほとんど差がない
。As is clear from this table, the phenolic resin molded products obtained by the method of the present invention have almost no difference from conventional molded products.
Claims (1)
酸性触媒の存在下に加熱することを特徴とするフエノー
ル樹脂の製造方法。 2 フエノール化合物がフエノールである特許請求の範
囲第1項記載の方法。 3 フエノール系化合物がアルキル化フエノールである
特許請求の範囲第1項記載の方法。 4 酸性触媒が無機酸又はその塩である特許請求の範囲
第1項記載の方法。 5 酸性触媒が有機酸又はその塩である特許請求の範囲
第1項記載の方法。[Scope of Claims] 1. A method for producing a phenolic resin, which comprises heating a phenolic compound, a polyacetal resin, water, and an acidic catalyst in the presence of the mixture. 2. The method according to claim 1, wherein the phenol compound is phenol. 3. The method according to claim 1, wherein the phenolic compound is an alkylated phenol. 4. The method according to claim 1, wherein the acidic catalyst is an inorganic acid or a salt thereof. 5. The method according to claim 1, wherein the acidic catalyst is an organic acid or a salt thereof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6500782A JPS6033122B2 (en) | 1982-04-19 | 1982-04-19 | Method for producing phenolic resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6500782A JPS6033122B2 (en) | 1982-04-19 | 1982-04-19 | Method for producing phenolic resin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58180515A JPS58180515A (en) | 1983-10-22 |
| JPS6033122B2 true JPS6033122B2 (en) | 1985-08-01 |
Family
ID=13274496
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6500782A Expired JPS6033122B2 (en) | 1982-04-19 | 1982-04-19 | Method for producing phenolic resin |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6033122B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USH1339H (en) * | 1992-06-03 | 1994-07-05 | Blair Leslie M | Aqueous process for recycling acetal polymer and moldings thereof |
-
1982
- 1982-04-19 JP JP6500782A patent/JPS6033122B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58180515A (en) | 1983-10-22 |
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