JPS6049639U - Cooling fins for semiconductor devices - Google Patents

Cooling fins for semiconductor devices

Info

Publication number
JPS6049639U
JPS6049639U JP14180183U JP14180183U JPS6049639U JP S6049639 U JPS6049639 U JP S6049639U JP 14180183 U JP14180183 U JP 14180183U JP 14180183 U JP14180183 U JP 14180183U JP S6049639 U JPS6049639 U JP S6049639U
Authority
JP
Japan
Prior art keywords
semiconductor device
cooling fin
nut
semiconductor devices
cooling fins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14180183U
Other languages
Japanese (ja)
Other versions
JPS6325742Y2 (en
Inventor
勇 加藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shindengen Electric Manufacturing Co Ltd
Original Assignee
Shindengen Electric Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shindengen Electric Manufacturing Co Ltd filed Critical Shindengen Electric Manufacturing Co Ltd
Priority to JP14180183U priority Critical patent/JPS6049639U/en
Publication of JPS6049639U publication Critical patent/JPS6049639U/en
Application granted granted Critical
Publication of JPS6325742Y2 publication Critical patent/JPS6325742Y2/ja
Granted legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

Claims (2)

【実用新案登録請求の範囲】[Scope of utility model registration request] （１）冷却フィンの半導体装置固定部に該半導体装置の
ネジ部を貫通させナツトにより該半導体装置を固着せし
めるように構成された半導体装置用冷却フィンにおいて
前記半導体装置固定部の前記ネジ部突出面にナツト挿入
用の袋状溝を設けると共に前記袋状溝を前記ナツトが回
動しない範囲に設定したことを特徴とする半導体装置用
冷却フィン。(1) In a cooling fin for a semiconductor device configured such that a screw portion of the semiconductor device passes through the semiconductor device fixing portion of the cooling fin and the semiconductor device is fixed with a nut, the screw portion protruding surface of the semiconductor device fixing portion 1. A cooling fin for a semiconductor device, characterized in that a bag-shaped groove for inserting a nut is provided in the cooling fin, and the bag-shaped groove is set within a range in which the nut does not rotate. （２）袋状溝の一端にナツトの下落阻止部を設けたこと
を特徴とする実用新案登録請求の範囲第１項記載の半導
体装置用冷却フィン。(2) The cooling fin for a semiconductor device according to claim 1, which is characterized in that a nut fall prevention part is provided at one end of the bag-shaped groove.
JP14180183U 1983-09-13 1983-09-13 Cooling fins for semiconductor devices Granted JPS6049639U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14180183U JPS6049639U (en) 1983-09-13 1983-09-13 Cooling fins for semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14180183U JPS6049639U (en) 1983-09-13 1983-09-13 Cooling fins for semiconductor devices

Publications (2)

Publication Number Publication Date
JPS6049639U true JPS6049639U (en) 1985-04-08
JPS6325742Y2 JPS6325742Y2 (en) 1988-07-13

Family

ID=30317043

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14180183U Granted JPS6049639U (en) 1983-09-13 1983-09-13 Cooling fins for semiconductor devices

Country Status (1)

Country Link
JP (1) JPS6049639U (en)

Also Published As

Publication number Publication date
JPS6325742Y2 (en) 1988-07-13

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