JPS60589A - Ic card - Google Patents

Abstract

PURPOSE:To erase data written in an EPROM by ultraviolet-ray irradiation and inspects all IC cards by forming an opaque layer as part of the substrate of the IC module of an IC card, and forming a window for ultraviolet-ray removal in the opaque layer. CONSTITUTION:A recessed part 13 is formed in the IC card base material 12 of the IC card 15, and the IC module 1 is fitted in the recessed part with a filler 14. An IC chip 2 including the EPROM is arranged in this module 1, the opaque layer 4 is formed at part of the substrate of the module 1, and the window 11 for ultraviolet-ray removal is formed in the opaque layer 4. This opaque layer 4 is adhered to a transparent layer 3 made of a transparent polyester film, which is fitted in the window 11 formed in the opaque layer 4. Then, the module 1 is irradiated with ultraviolet-rays to erase data written in the EPROM, thus inspecting all IC cards 15.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an IC card embedded with an EPROM, and more particularly to an IC card in which data in an EFROM can be erased by irradiating ultraviolet rays from the surface of the card having a terminal with an EFROM. .

In this specification, 1PROM refers to a PROM in which written data can be erased by irradiation with ultraviolet rays.

In recent years, ID cards have been used in many fields such as credit cards, bank cards, driver's licenses, and identification cards, but in the past, data was written magnetically in order to perform automatic verification by terminals. However, magnetically written data can be demagnetized or changed by nearby magnets or alternating magnetic fields, and is also easy to read, so it is easily forged or tampered with and lacks safety and reliability. Therefore, recently, attempts have been made to manufacture IC cards with built-in IC circuits to improve safety and reliability.

However, the data written on an IC card is
Naturally, some information is different for each individual, and since it is written by the IC card issuer (for example, the bank for a bank card), the IC card manufacturer cannot write it at the time of manufacture. The manufacturer writes no data that identifies an individual (this state is called a "blank state").
The card is sold as a card (including the state written in the OM circuit), and the purchaser (bank, etc.) writes various necessary data including identification into it and uses it as a work zero card.

On the other hand, FROM elements that are normally used in various fields use EPROM to erase with ultraviolet rays.
As shown in FIG. 1 (IC module 10), an erasing window 11 is provided on the top surface of the cage.

Reference numeral 2 designates a manufacturing chip, 6 an external terminal, 9 a wire, 10 an insulating layer, 16 a substrate, and 17 a covering layer.

In contrast, the IC module is embedded in the card material.
In the case of an OIC card, as shown in Figure 2, the ultraviolet irradiation surface 18 is the opposite side to the surface 19 of the card with the external terminal 6, so a transparent card material must be used on the back of the IC card. Moreover, irradiating ultraviolet rays from the back side of the card is inconvenient in manufacturing. In Figure 2, 1 is an IC module, 2 is a 10 chip, and 5
1 is a through hole, 7 is a lead, 8 is a wire, 9 is a wire, 10 is an insulating layer, 12 is an IC card composite material 14 is a filler, and 15 is an IC card.

In IC cards, in order to prevent mischief, forgery, and tampering, it is desirable that the positions of the 10 circuits in the 10 cards and the positions of external terminals be hidden from the outside. Therefore, it is not desirable to provide a transparent erasing window that allows the location of the CIO circuit to be seen from the outside, and the front and back surfaces of the 10 circuits are covered with an opaque layer.For this reason, the written data is erased using ultraviolet light. I couldn't.

Therefore, the manufacturer's inspection method is forced to carry out a sampling inspection (=destructive inspection) as described below, and it is not possible to carry out a complete inspection. That is, to test the functionality of 10 circuits, after writing specific data for testing,
This is read and compared with specific data, and the quality of the writing and reading functions is determined based on whether or not they match. However, as mentioned above, the written data cannot be erased, and the manufacturer must leave the memory blank at the time of sale, so it is difficult to inspect the product by writing or reading specific data as described above. It was not possible to test all the samples, and sampling tests had to be carried out.

In this way, the reliability of the conventional 10 card, which is guaranteed only by sampling inspection, depends only on the reliability of the 10 manufacturing process and the module manufacturing process, and it is not possible to test the reliability of all final products. There wasn't. However, since IC cards are often used in fields such as banks, credit cards, etc., where there is a lot of input/output of money-related data, and where there must be no errors in written data, there is a great need for 100% inspection. In spite of this, conventional products have the drawback that 100% inspection cannot be carried out for the reasons mentioned above, and it is extremely difficult to guarantee product reliability.

An object of the present invention is to provide a zero-processing card in which written data can be erased from the surface of the card using ultraviolet rays after a write/read function test is performed on all products.

The present invention provides an engineered card in which an IC module containing an EPROM is fitted into a recess provided on the surface of the card material so that the substrate and external terminals of the IC module are exposed on the card surface. , an IC card characterized in that at least a part of the substrate of the above-mentioned industrial module is an opaque layer, and the opaque layer is provided with a window for erasing ultraviolet rays.

An embodiment of the present invention will be described with reference to the drawings.

FIG. 3 shows 10 modules 1 fitted into 10 cards. 2 is an IC chip, 3 is a transparent layer, 4 is an opaque layer, 5 is a through hole, 6 is an external terminal, 7 is a lead, 8 is a pad of the processed zero chip, 9 is a bonding wire, 10 is from an insulating sealing resin This is an insulating layer.

The transparent layer 6 is made of a transparent film such as a transparent polyester film through which ultraviolet rays can pass.

The opaque layer 4 is made of a heat-resistant opaque film such as a polyimide film or a glass epoxy sheet, has a window 11 in a portion corresponding to the IC chip 2, and is bonded to the transparent layer 6.

It is preferable that the transparent layer 6 such as a transparent polyester film and the opaque layer 4 such as a polyimide film be laminated in advance to form a laminate substrate. In that case, it goes without saying that windows 11 are provided in the opaque layer 4.

Further, a transparent polyester film having the same shape as the window 11 may be fitted onto the window 11 portion of the opaque layer 4.

The through hole 5 penetrates the transparent layer 6 and the opaque layer 4 to connect the external terminal 6 and the lead 7.

As shown in FIG. 4, the IO module 1 having such a configuration is fitted into the recess 16 previously provided in the card material 12, and the assembled card 15 is assembled by filling it with the filler 14. The IC chip 2 can be irradiated with ultraviolet light from (the surface where the external terminals 6 are located).

Therefore, the EPRO in the IC chip 2 of the 10 card 15
After writing the data for inspection into M, the written data is also read out from the external terminal 6 and inspected.If the data is determined to be good, it is written into the IC chip 20EFROM by irradiating ultraviolet rays from the surface of the IC card 150. Erase data. Thereafter, as shown in FIG. 5, by subjecting the window 11 to sublimation transfer or printing heat treatment with a dye that blocks ultraviolet rays, which has a strong hiding property, the inside of the transparent layer 6 of the transparent polyester film and the insulating layer 1o of the insulating sealing resin are coated. By diffusing the light into the interior, the window 110 portion also becomes an opaque layer 4, resulting in an IC card that cannot be erased by ultraviolet rays.

As another method of shielding the window 110, the shielding layer 21 may be provided by hot stamping as shown in FIG.
As shown in FIG. 7, a shielding sticker 22 that is difficult to peel may be attached, or the shielding may be done with ink such as a marker.

When such a 10 card is used by a user, for example, a bank, if necessary data is written in the IC chip 20EFROM, this data can be erased by UV irradiation since the window 110 is treated to block UV rays. Since the window 11 is colored in the same color as the other parts, the location where the IC chip 2 is embedded is visually unknown, and data tampering can be prevented.

Furthermore, since the portion heated by bonding, pressing, etc. is made of a heat-resistant polyimide film or glass epoxy sheet, heat resistance is also good.

Bonding of the wiring between the hat 8 and the lead 7 is performed using a film carrier method, and for chips that require die bonding, if wire bonding is performed using the wire 9, the IC chip 2 can have only the wire 9 in the insulating layer 10. It is supported in a floating state and has the characteristic of being highly resistant to bending stress.

As another embodiment of the present invention, a transparent layer 6 as shown in FIG.
The transparent layer 6 other than the window 11 is made into an opaque part 26 by sublimation transfer or printing heat treatment with a dye that has a strong hiding property and blocks ultraviolet rays while leaving the window 11 of the transparent layer 6. Then, after erasing the ultraviolet rays, the window 11 may also be subjected to sublimation transfer or printing heat treatment to cover the window 11.

Further, as shown in FIG. 9, only the transparent layer 6 is provided, and the portion of the transparent layer 3 other than the window 11 is provided with a shield l-24 by hot stamping or a difficult-to-peel sticker, and after the ultraviolet rays are erased, the window 11 is further covered. Portions may also be covered by hot stamps or hard-to-peel seals.

Further, the portion of the transparent layer outside the window plate may be shielded with ink such as a marker (not shown), and after the ultraviolet rays are erased, the window portion may be further shielded with ink such as marker.

In the present invention, data written in the EFROM can be erased by irradiating ultraviolet rays through a window provided on the terminal side board after writing to the EPROM with zero chips and performing a read inspection. This is possible, and irradiation with ultraviolet light can be easily performed from the surface of the IC card, which is extremely effective in practice.

[Brief explanation of the drawing]

Fig. 1 is a cross-sectional view of a conventional 0-module, Fig. 2 is an explanatory diagram of a conventional 10-card, Fig. 3 is a sectional view of a 0-module which is a part of an embodiment of the present invention, and Fig. 4 is a sectional view of a conventional 10-card module. 5, 6 and 7 are sectional views of one embodiment of the invention in use, and FIGS. 8 and 9 are sectional views of other embodiments of the invention. FIG. 1...IC module, 2...IOf knob, 3...
・Transparent layer, 4... Opaque layer, 5... Through hole,
6...External terminal, 7...Lead, 8...Pad,
9... Wire, 10... Insulating layer, 11... Window, 1
2...IC card material, 16...recess, 14...
Filler, 15... IC card, 16... Substrate, 17
... Covering layer, 18 ... Ultraviolet irradiation surface, 19 ... Surface, 21 ... Shielding layer, 22 ... Shielding seal, 23.
... Opaque portion, 24... Shielding layer. Patent applicant Kyodo Printing Co., Ltd. Representative Patent Attorney 11) Twisting Patent Attorney Takao Maruyama

Claims (1)

[Claims] In the recess provided on the card surface of the t-card material,
Place the engineering module containing the EPROM on the cart surface.
In a work card inserted so that the board and external terminals of a C module are exposed, at least a part of the board of the work module is an opaque layer, and a window for erasing ultraviolet rays is provided in the opaque layer. A work 0 card that is characterized by one thing. 2. The above-mentioned process module adheres an opaque layer to a transparent layer, arranges 10 chips on the side of the opaque layer, and connects the IO of the opaque layer.
2. The process zero card according to claim 1, wherein a window for erasing ultraviolet rays is provided in a portion corresponding to the chip. 6. The IC card according to claim 1 or 2, wherein the transparent layer is a transparent polyester film. 4. The 10 card according to any one of claims 1 to 3, wherein the opaque layer is a polyimide film or a glass epoxy sheet. 5. The industrial card according to claim 3 or 4, wherein the 10-module substrate is formed of a laminate film of polyester 7/l/m and a polyimide film or a glass epoxy sheet. 6. The 10 card according to claim 5, wherein a transparent polyester film is fitted into the window provided in the opaque layer.