JPS6073241U - Semiconductor wafer bump plating equipment - Google Patents
Semiconductor wafer bump plating equipmentInfo
- Publication number
- JPS6073241U JPS6073241U JP16508183U JP16508183U JPS6073241U JP S6073241 U JPS6073241 U JP S6073241U JP 16508183 U JP16508183 U JP 16508183U JP 16508183 U JP16508183 U JP 16508183U JP S6073241 U JPS6073241 U JP S6073241U
- Authority
- JP
- Japan
- Prior art keywords
- plating
- semiconductor wafer
- plating equipment
- semiconductor wafers
- wafer bump
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title claims description 12
- 239000004065 semiconductor Substances 0.000 title claims description 6
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 claims 3
- 239000007788 liquid Substances 0.000 claims 2
- 238000007664 blowing Methods 0.000 claims 1
- 239000007921 spray Substances 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来による半導体ウェハーのバンプめつき装置
であり、めっき槽の概略図、第２図は本考案による半導
体ウェハーのバンプめつき装置のめつき槽上端の概略図
である。
図中、１・・・・・・共通の導管、２・・・・・・容器
、３・・・・・・アダプタ、４・・・・・・通路、５：
・・・・・めっき槽、６・・・・・・陽極の導線及び導
体片、−７・・・・・・陽極、８・・・・・・陰極の導
体片及びつ呈バー接点電極、９・・・１・・・樹脂系ア
ミ。FIG. 1 is a schematic view of a plating tank of a conventional semiconductor wafer bump plating apparatus, and FIG. 2 is a schematic view of the upper end of the plating tank of the semiconductor wafer bump plating apparatus according to the present invention. In the figure, 1... common conduit, 2... container, 3... adapter, 4... passage, 5:
...Plating tank, 6...Anode conductor wire and conductor piece, -7...Anode, 8...Cathode conductor piece and bar contact electrode, 9...1...Resin-based aluminum.
Claims (1)
しめつき液を下方より吹上げる型式の半導体ウェハーの
バンプめつき装置において、複数筒の各めつき槽中！こ
おかれた中央部に大きな穴を設けた溶解性陽極と底部中
央に共通のめつき液の導管に連動した下方より吹上げる
際の通路との間に樹脂系アミを設けたことを特徴とする
半導体ウェハのバンプめつキ装置。In a bump plating device for semiconductor wafers that sprays plating liquid from below onto semiconductor wafers set horizontally in each plating tank, each plating tank has multiple cylinders! The feature is that a resin-based wire is provided between the dissolvable anode, which has a large hole in the center of the plate, and the passageway for blowing up from below, which is connected to a common plating liquid conduit in the center of the bottom. A device for bump-plating semiconductor wafers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16508183U JPS6073241U (en) | 1983-10-25 | 1983-10-25 | Semiconductor wafer bump plating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16508183U JPS6073241U (en) | 1983-10-25 | 1983-10-25 | Semiconductor wafer bump plating equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6073241U true JPS6073241U (en) | 1985-05-23 |
| JPS6350852Y2 JPS6350852Y2 (en) | 1988-12-27 |
Family
ID=30361752
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16508183U Granted JPS6073241U (en) | 1983-10-25 | 1983-10-25 | Semiconductor wafer bump plating equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6073241U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5443974U (en) * | 1977-09-01 | 1979-03-26 |
-
1983
- 1983-10-25 JP JP16508183U patent/JPS6073241U/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5443974U (en) * | 1977-09-01 | 1979-03-26 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6350852Y2 (en) | 1988-12-27 |
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