JPS61124594A - 帯状メツキ物の部分メツキ装置 - Google Patents

帯状メツキ物の部分メツキ装置

Info

Publication number: JPS61124594A
Authority: JP; Japan
Prior art keywords: plating; band; shaped; nozzle body; liquid jet
Prior art date: 1984-11-17
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

JP24162084A

Other languages

English (en)

Japanese (ja)

Other versions

JPH0425354B2 (2

Inventor

Yasuto Murata

康人村田

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

EEJA Ltd

Original Assignee

Electroplating Engineers of Japan Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1984-11-17

Filing date

1984-11-17

Publication date

1986-06-12

1984-11-17 Application filed by Electroplating Engineers of Japan Ltd filed Critical Electroplating Engineers of Japan Ltd

1984-11-17 Priority to JP24162084A priority Critical patent/JPS61124594A/ja

1986-06-12 Publication of JPS61124594A publication Critical patent/JPS61124594A/ja

1992-04-30 Publication of JPH0425354B2 publication Critical patent/JPH0425354B2/ja

Status Granted legal-status Critical Current

Links

238000007747 plating Methods 0.000 title claims abstract description 85
239000007788 liquid Substances 0.000 claims abstract description 19
230000000873 masking effect Effects 0.000 claims abstract description 13
238000002347 injection Methods 0.000 claims description 20
239000007924 injection Substances 0.000 claims description 20
239000000243 solution Substances 0.000 description 19
239000000463 material Substances 0.000 description 12
150000002500 ions Chemical class 0.000 description 5
230000000694 effects Effects 0.000 description 4
238000010586 diagram Methods 0.000 description 3
238000000034 method Methods 0.000 description 3
238000005516 engineering process Methods 0.000 description 2
238000004519 manufacturing process Methods 0.000 description 2
239000011248 coating agent Substances 0.000 description 1
238000000576 coating method Methods 0.000 description 1
230000008602 contraction Effects 0.000 description 1
238000005553 drilling Methods 0.000 description 1
238000012423 maintenance Methods 0.000 description 1
229920003002 synthetic resin Polymers 0.000 description 1
239000000057 synthetic resin Substances 0.000 description 1
230000007704 transition Effects 0.000 description 1

Landscapes

Electroplating Methods And Accessories (AREA)

JP24162084A 1984-11-17 1984-11-17 帯状メツキ物の部分メツキ装置 Granted JPS61124594A (ja)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP24162084A JPS61124594A (ja)	1984-11-17	1984-11-17	帯状メツキ物の部分メツキ装置

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP24162084A JPS61124594A (ja)	1984-11-17	1984-11-17	帯状メツキ物の部分メツキ装置

Publications (2)

Publication Number	Publication Date
JPS61124594A true JPS61124594A (ja)	1986-06-12
JPH0425354B2 JPH0425354B2 (2)	1992-04-30

Family

ID=17077031

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP24162084A Granted JPS61124594A (ja)	1984-11-17	1984-11-17	帯状メツキ物の部分メツキ装置

Country Status (1)

Country	Link
JP (1)	JPS61124594A (2)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2006225677A (ja) *	2005-02-15	2006-08-31	Sanyu Engineering Kk	連続部分めっき装置
JP2011021226A (ja) *	2009-07-15	2011-02-03	Mitomo Semicon Engineering Kk	連続部分めっき装置及びそれを用いた連続部分めっき方法
CN109853015A (zh) *	2017-11-30	2019-06-07	Ykk株式会社	电镀用导轮及具有其的电镀用设备

1984
- 1984-11-17 JP JP24162084A patent/JPS61124594A/ja active Granted

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2006225677A (ja) *	2005-02-15	2006-08-31	Sanyu Engineering Kk	連続部分めっき装置
JP2011021226A (ja) *	2009-07-15	2011-02-03	Mitomo Semicon Engineering Kk	連続部分めっき装置及びそれを用いた連続部分めっき方法
CN109853015A (zh) *	2017-11-30	2019-06-07	Ykk株式会社	电镀用导轮及具有其的电镀用设备
CN109853015B (zh) *	2017-11-30	2021-10-22	Ykk株式会社	电镀用导轮及具有其的电镀用设备

Also Published As

Publication number	Publication date
JPH0425354B2 (2)	1992-04-30

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