JPS61164033U - - Google Patents

Info

Publication number
JPS61164033U
JPS61164033U JP1985032450U JP3245085U JPS61164033U JP S61164033 U JPS61164033 U JP S61164033U JP 1985032450 U JP1985032450 U JP 1985032450U JP 3245085 U JP3245085 U JP 3245085U JP S61164033 U JPS61164033 U JP S61164033U
Authority
JP
Japan
Prior art keywords
tab
pellet
mounting
lead frame
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985032450U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985032450U priority Critical patent/JPS61164033U/ja
Publication of JPS61164033U publication Critical patent/JPS61164033U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)

Description

【図面の簡単な説明】
第１図Ａ及びＢは本考案によるリードフレーム
の断面図及び平面図、第２図乃至第５図は従来の
リードフレーム及びそれを用いたパツケージの断
面図である。 ２：内部リード、３：ペレツト、４：ボンデイ
ングワイヤ、９：タブ、１０：ペレツトマウント
面、１１：凹部。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体ペレツトをマウントするタブが、タブリ
    ードよりも下方に位置するように成形されたリー
    ドフレームにおいて、前記タブのペレツト・マウ
    ント面にマウント時のペレツト位置ずれを防止す
    るための凹部を設けたことを特徴とするリードフ
    レーム。
JP1985032450U 1985-03-06 1985-03-06 Pending JPS61164033U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985032450U JPS61164033U (ja) 1985-03-06 1985-03-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985032450U JPS61164033U (ja) 1985-03-06 1985-03-06

Publications (1)

Publication Number Publication Date
JPS61164033U true JPS61164033U (ja) 1986-10-11

Family

ID=30533974

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985032450U Pending JPS61164033U (ja) 1985-03-06 1985-03-06

Country Status (1)

Country Link
JP (1) JPS61164033U (ja)

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