JPS6177992A - Ic card - Google Patents

Abstract

PURPOSE:To prevent occurrence of accidents such as falling off, breakage and peeling even when subjected to bending deformation by fitting a projected part formed by projection of a mold layer to nearly the same face with the surface of an outer cover layer to a window provided on the surface outer cover layer. CONSTITUTION:An IC unit 4 made by molding an IC chip 1 having built-in UV-EPROM with an ultraviolet-ray transmitting material is contained in a hole 6 provided in a card substrate 5, and the surface and back of the substrate are covered with outer cover layers 7, 9 made of a material that does not transmit ultraviolet rays. A window 10 is formed at a part right above the chip 1. A projected part 12 formed by projection of a part of a mold layer 8 to nearly the same face with the surface of the outer cover layer 9 is fitted to the window 10, and the window 10 is closed. When bending stress is applied to an IC card of such structure, concentration of stress does not take place at the corner part of the window 10, and breakage can be prevented. As there is no recessed part in the window 10, accumulation of dust and dirt does not occur.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an IC card equipped with an IC incorporating an IJV-EFROM.

[Prior art]

jJ V −1,t P as one of the erase type FROM
I? OM (ultraviolet erasable FROM) is widely used. A conventional example of an IC'J installation is a DIP type package; in this case, ultraviolet rays are
A hole is provided in the upper surface of the main body of the puff cage made of a suitable material, an IC chip is housed in the hole, and a window is formed by covering the hole with quartz or ultraviolet-transparent resin.

As described above, in the past, UV-EFROMs have only been used in DIP-type computers, but there has been a growing desire to incorporate them into cards.

(Problems to be Solved by the Invention) When attempting to accommodate a JV-EFROM in a card, using a structure similar to that of a conventional DIP package will lead to various problems.

For example, in the example shown in FIG. 1, UV-EPI? Attach the IC chip 7 containing the OM to the base 2, and insert the IC unit 2 with the main unit 13 into the 80 provided on the card 9 (temporary 5), so that the moon surface exposes the electric scratcher 3. The mold layer 8 is formed by press-fitting an ultraviolet-transmissive resin from above the IC and solidifying it.

On the other hand, IC cards have the following 90 problems, unlike DIP packages. That is, IC cards are often carried around in pockets, etc., and are susceptible to bending deformation due to being pushed. f
Another problem is that there is a risk that the IC unit 4 and the IC unit 4 may fall off the board 5.

In order to prevent this, as shown in FIG. Outside ml near just above! ! It is conceivable to have a structure in which the window 9 is left open and closed as a window 10 so that ultraviolet rays can be irradiated to erase the memory.

However, in such a one-width structure, there is a large difference in deformability between the part with the window part 10 and the part without it, so when it is subjected to large bending deformation, stress is generated at the corner part 11 of the window part 10. There is one problem: cracks are likely to occur, leading to damage to the card.
Since the mold layer 8 is recessed, it is easy for dust, dirt, etc. to accumulate therein, leading to accidents such as UV rays being emitted in unprotected areas or the adhesion between the mold layer 8 and the outer sheath 189 coming off due to absorption of warm air.

The present invention solves these problems and prevents accidents such as IC cards falling off, windows breaking with shells, and adhesive peeling, even in IC cards that are easily susceptible to bending deformation. The purpose of the present invention is to provide an IC card that does not cause this problem.

[Means for solving problems]

The present invention, as a means for solving the above problems,
An IC unit in which an IC with a built-in UV-EFROM is molded with an ultraviolet-transmissive material is housed in a hole made in a card substrate, and the front and back of the card 4Jff are covered with an outer cover layer to hold the IC unit between them. The outer surface layer 13 is made of a material that is not sensitive to ultraviolet rays, and a surface layer 13 is provided in the vicinity of the portion directly above the tJV-EPnOM.
An IC card characterized in that a window is formed without a window, and the mold layer is fitted into the cough window so as to protrude almost to the same level as the surface of the outer cover layer, so that the window is closed. It provides:

(Example〕 Embodiments of the present invention will be described using the drawings.

In FIG. 4, parts having the same reference numerals as those in FIG. 2 have similar structures and functions. The difference from Fig. 2 is the outer coating layer 9 on the surface.
A protruding part 12 formed by a part of the mold layer 8 protruding almost to the same plane as the surface of the front cover 1i119 is fitted into the protruding part 10 provided in the front cover 1i119, and the window part IO is closed. be. The mold layer 8 and the outer covering layer 9 are also bonded together at the inner edge of the window portion 10 with an adhesive.

When bending stress is applied to an I'C card having such a structure, for example, when the window 10 side becomes the compression side,
The protruding part 12 is also compressed as one body, and when it becomes the tension side, it is also subjected to tension as a whole due to the adhesive, so that the corner part +1 of the window part 10 is prevented from being damaged without causing concentrated stress. I can do it. In addition, the window lO is the outer cover l1 of the surface.
Since the surface is the same as the i9 and there are no dents, there is no chance of dust or dirt accumulating, blocking the transmission of ultraviolet rays, or causing the adhesive to peel off due to moisture absorption.

No ultraviolet rays used for outer coating layer 9! i! As a material,
PVC, polyimide resin, etc. are used.

Ultraviolet 'lA13i1 used for mold layer 8! As the material, silicone resin, polycarbonate resin, etc. are used.

Moreover, since the mold 158 and the IC unit 4 are sandwiched and bonded by the outer cover 117.9 on the front and back sides, even if they are subjected to considerable bending deformation, they will not be easily crushed. There is no risk of the IC chip 1 falling off.

FIG. 5 is a drawing of the entire IC card configured as described above. When erasing the data written in the UV-EPROM, the window 10 is exposed to ultraviolet light of a predetermined specification, for example, 2
+5Wsec/c in the area centered on the wavelength of 537 people
- To prevent the energy of the ultraviolet rays from accumulating and erasing data during normal use, as shown in FIG. Paste violet 9 + 7-ru 13 of ``Tame Unfaucable'' on it, and peel it off when il'i leaves.

(Effects of the Invention) According to the present invention, it is possible to provide an IC card that is free from falling off or breaking at a height of 4 ftM even if subjected to considerable bending deformation, and has a great effect in practical use.

[Brief explanation of drawings]

Figures 1 and 1A2 are cross-sectional views of the conventional example, and Figure 3 is the 21j
412I is a sectional view of the embodiment of the present invention, FIG. 5 is a plan view of the entire C card, and FIG. 6 is its IC.
FIG. 3 is a plan view of a card with ultraviolet-opaque nol pasted on it. + 1c chip, 2 heath, 3 main crosspiece, 41C unit, 5 board, 6 hole, 7 outer cover layer, 8 mold layer,
9 outer covering layer, 10 window, 11 corner, 12 protrusion, 13 knoll. Patent Applicant Kyodo Printing Co., Ltd. Agent Patent Attorney Masayuki Takagi Agent Patent Attorney Yori 1) Takatsugu Department Figure J Figure 3 Figure 4 Figure 5 Figure 8

Claims (1)

[Claims] 1. An IC unit in which an IC with a built-in UV-EPROM is molded with a UV-transparent material is housed in a hole made in a card board, and the front and back of the card board are covered with an outer covering layer. The IC unit is held in a sandwiched state, the surface outer coating layer is made of a UV-impermeable material, and a window portion without the surface outer coating layer is formed in a portion directly above the UV-EPROM; An IC card characterized in that the mold layer protrudes and fits into the window portion up to almost the same surface as the surface of the outer cover layer, thereby closing the window portion.