JPS6190254U - - Google Patents

Info

Publication number
JPS6190254U
JPS6190254U JP1984175219U JP17521984U JPS6190254U JP S6190254 U JPS6190254 U JP S6190254U JP 1984175219 U JP1984175219 U JP 1984175219U JP 17521984 U JP17521984 U JP 17521984U JP S6190254 U JPS6190254 U JP S6190254U
Authority
JP
Japan
Prior art keywords
island
lead frame
exposed
view
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984175219U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984175219U priority Critical patent/JPS6190254U/ja
Publication of JPS6190254U publication Critical patent/JPS6190254U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図a,bは各々本考案の一実施例によるリ
ードフレームの平面図およびそのX―X′断面図
で同図cはプラスチツク封止後の回路基板上への
実装側面図、第2図a,bは各々従来例のリード
フレームの平面図およびX―X′断面図で同図c
は回路基板上への実装側面図である。 1…リードフレームアイランド、2…リードフ
レーム連結ピン、3…リードフレームリード、4
…リードフレームタブリード、5…半導体プラス
チツク封止部、6…プリント基板。
1A and 1B are a plan view and a cross-sectional view taken along the line X-X' of a lead frame according to an embodiment of the present invention, FIG. 1C is a side view of the lead frame mounted on a circuit board after sealing with plastic, and FIG. a and b are a plan view and a sectional view taken along line X-X' of the conventional lead frame, respectively;
is a side view of mounting on a circuit board. 1... Lead frame island, 2... Lead frame connecting pin, 3... Lead frame lead, 4
... Lead frame tab lead, 5... Semiconductor plastic sealing part, 6... Printed circuit board.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] アイランド部から連続して延び封止体の一部か
ら露出しているピンの液露出部が前記アイランド
よりも上方に位置していることを特徴とする半導
体装置。
A semiconductor device characterized in that a liquid exposed portion of a pin extending continuously from the island portion and exposed from a part of the sealing body is located above the island.
JP1984175219U 1984-11-19 1984-11-19 Pending JPS6190254U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984175219U JPS6190254U (en) 1984-11-19 1984-11-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984175219U JPS6190254U (en) 1984-11-19 1984-11-19

Publications (1)

Publication Number Publication Date
JPS6190254U true JPS6190254U (en) 1986-06-12

Family

ID=30732823

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984175219U Pending JPS6190254U (en) 1984-11-19 1984-11-19

Country Status (1)

Country Link
JP (1) JPS6190254U (en)

Similar Documents

Publication Publication Date Title
JPS6190254U (en)
JPS63167746U (en)
JPS6252968U (en)
JPS6457641U (en)
JPS635647U (en)
JPS62168652U (en)
JPS61100149U (en)
JPS61195054U (en)
JPS61188362U (en)
JPS6278751U (en)
JPS6190271U (en)
JPH0334228U (en)
JPS62122354U (en)
JPS6289154U (en)
JPS6274336U (en)
JPH0412680U (en)
JPS62152451U (en)
JPS62101265U (en)
JPS61111160U (en)
JPS6287483U (en)
JPS63124754U (en)
JPH0345U (en)
JPS61102074U (en)
JPS6316455U (en)
JPS63132433U (en)