JPS6194358U - - Google Patents

Info

Publication number
JPS6194358U
JPS6194358U JP1984179109U JP17910984U JPS6194358U JP S6194358 U JPS6194358 U JP S6194358U JP 1984179109 U JP1984179109 U JP 1984179109U JP 17910984 U JP17910984 U JP 17910984U JP S6194358 U JPS6194358 U JP S6194358U
Authority
JP
Japan
Prior art keywords
heat sink
resin
semiconductor chip
notch
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984179109U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984179109U priority Critical patent/JPS6194358U/ja
Publication of JPS6194358U publication Critical patent/JPS6194358U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例による放熱板の平面
図であり、第２図は従来の樹脂封止半導体装置の
断面図、第３図は従来の樹脂封止半導体装置の平
面図である。 １……放熱板、２……半導体チツプ、３……リ
ード端子、４……金属細線、５……封止樹脂、６
……取りつけ穴、７……切欠部。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体チツプを取りつけた放熱板と、該半導体
    チツプおよび放熱板の主要部の全面を封止した樹
    脂とを有し、前記放熱板には切欠部を備えた取り
    つけ用ネジ穴部を有することを特徴とする樹脂封
    止半導体装置。
JP1984179109U 1984-11-26 1984-11-26 Pending JPS6194358U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984179109U JPS6194358U (ja) 1984-11-26 1984-11-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984179109U JPS6194358U (ja) 1984-11-26 1984-11-26

Publications (1)

Publication Number Publication Date
JPS6194358U true JPS6194358U (ja) 1986-06-18

Family

ID=30736672

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984179109U Pending JPS6194358U (ja) 1984-11-26 1984-11-26

Country Status (1)

Country Link
JP (1) JPS6194358U (ja)

Similar Documents

Publication Publication Date Title
JPS6194358U (ja)
JPS5977241U (ja) 樹脂封止型半導体装置
JPS61102048U (ja)
JPS6196547U (ja)
JPS6163849U (ja)
JPS6172857U (ja)
JPH0233442U (ja)
JPS5895641U (ja) 樹脂封止半導体装置
JPS585347U (ja) 樹脂封止型半導体装置
JPH01120343U (ja)
JPS61102039U (ja)
JPS61102055U (ja)
JPS6183046U (ja)
JPS60169843U (ja) 絶縁型半導体装置
JPS6081652U (ja) 樹脂封止型半導体装置
JPH01176946U (ja)
JPS6364050U (ja)
JPS5834742U (ja) 樹脂封止形半導体装置の放熱構造
JPS6142853U (ja) 樹脂封止型半導体装置
JPS6016553U (ja) 樹脂封止型半導体装置
JPH0428449U (ja)
JPS61100147U (ja)
JPS6188252U (ja)
JPS6240842U (ja)
JPS625644U (ja)