JPS6354785A - Hetero-junction magnetic sensor - Google Patents
Hetero-junction magnetic sensorInfo
- Publication number
- JPS6354785A JPS6354785A JP61198508A JP19850886A JPS6354785A JP S6354785 A JPS6354785 A JP S6354785A JP 61198508 A JP61198508 A JP 61198508A JP 19850886 A JP19850886 A JP 19850886A JP S6354785 A JPS6354785 A JP S6354785A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- magnetic sensor
- heterojunction
- doped
- electron gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims abstract description 11
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 claims abstract description 9
- 230000005533 two-dimensional electron gas Effects 0.000 claims description 11
- 239000012535 impurity Substances 0.000 claims description 3
- 229910001218 Gallium arsenide Inorganic materials 0.000 abstract description 19
- 239000010409 thin film Substances 0.000 abstract description 5
- 239000000758 substrate Substances 0.000 abstract description 3
- 125000005842 heteroatom Chemical group 0.000 abstract 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 16
- 230000035945 sensitivity Effects 0.000 description 11
- 239000013078 crystal Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 5
- 239000010408 film Substances 0.000 description 5
- 230000004907 flux Effects 0.000 description 5
- 239000000969 carrier Substances 0.000 description 4
- WPYVAWXEWQSOGY-UHFFFAOYSA-N indium antimonide Chemical compound [Sb]#[In] WPYVAWXEWQSOGY-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 229910017401 Au—Ge Inorganic materials 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000005355 Hall effect Effects 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004943 liquid phase epitaxy Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 125000002524 organometallic group Chemical group 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 238000000927 vapour-phase epitaxy Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N52/00—Hall-effect devices
- H10N52/101—Semiconductor Hall-effect devices
Landscapes
- Hall/Mr Elements (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、電子・機械工業分野における各種の計測・制
御に用いられている磁気センサに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a magnetic sensor used for various measurements and controls in the electronic and mechanical industry fields.
(従来の技術〕 従来、磁気センサ用半導体材料としては、Si。(Conventional technology) Conventionally, Si has been used as a semiconductor material for magnetic sensors.
Ge又は化合物半扉体であるInSb、InA、s、G
aAsなどの単結晶薄板、蒸着膜、エピタキシャル膜、
イオン注入層が一般に用いられている。Ge or compound half-doors InSb, InA, s, G
Single crystal thin plates such as aAs, vapor deposited films, epitaxial films,
Ion implanted layers are commonly used.
しかし、上記の半導体材料にはそれぞれ欠点があった。However, each of the above semiconductor materials had drawbacks.
即ち、磁気センサの高性能化のためには、高移動度の極
薄膜材料が必要であるが、高移動度が得られるインジウ
ムアンチモン(InSb)では極薄膜化が難しく、ガリ
ウムヒ素(G a A s )やシリコン(Si)では
極薄膜の高移動度化が困難なため、高性能化には技術的
に限界があった。That is, in order to improve the performance of magnetic sensors, ultra-thin film materials with high mobility are required, but indium antimony (InSb), which provides high mobility, is difficult to make into ultra-thin films, and gallium arsenide (G a Since it is difficult to increase the mobility of ultrathin films with silicon (Si) and silicon (Si), there is a technical limit to achieving high performance.
本発明は上記点に鑑み、高移動度を有し、かつ極薄膜が
可能な磁気センサを提供することを目的としてなされた
ものである。In view of the above points, the present invention has been made with the object of providing a magnetic sensor that has high mobility and can be made into an extremely thin film.
一般に、半導体磁気センサの高性能化には、ホール効果
の大きい材料やデバイス構造が不可欠であるから、基本
的な磁気センサであるホール素子の設計原理を考える。In general, to improve the performance of semiconductor magnetic sensors, materials and device structures with a large Hall effect are essential, so we will consider the design principle of the Hall element, which is a basic magnetic sensor.
畏方形ホール素子において、電流駆動、電圧駆動、電力
駆動のそれぞれに対するホール出力電圧は、次の式で表
される。In a rectangular Hall element, the Hall output voltage for each of current drive, voltage drive, and power drive is expressed by the following formula.
■□=に、BI ■KH・・・(1)−(
W/り)μHBV”μ、 ・・・(2)= <wK
n μ / 7り l/28 P l/2”(KHμ
) l/2 ・・・(3)ここで、J、w及びtは、
素子の長さ、幅、厚I、V及びPは、入力電流、入力電
圧、入力電力。■□=to, BI ■KH...(1)-(
W/ri)μHBV"μ, ... (2) = <wK
n μ / 7ri l/28 P l/2” (KHμ
) l/2...(3) Here, J, w and t are
The length, width, thickness I, V, and P of the element are the input current, input voltage, and input power.
Bは、磁束密度。K□は、積感度(=Ro/l=1/n
s e i PHは、ホール係数。n、は、キャリヤ面
密度。eは、電子電荷)、μmは、ホール移動度。B is magnetic flux density. K□ is the product sensitivity (=Ro/l=1/n
s e i PH is the Hall coefficient. n is the carrier surface density. e is electron charge), μm is hole mobility.
最大出力は、最大入力に対して得られるから、(3)式
から感度の性能指数M S F (Magnetic−
fieldSensitive Figure of
merit )を定義すると、MSF−(KNμ )
l/2
=+’H(ρ/e)”2 ocμ8 ・・・(4)こ
こで、ρ−1/ n eμ。素子と外部回路の整合性を
考えると、特性インピーダンスρ/lは、通常、10Ω
から10にΩの範囲にあることが望ましい。ホール素子
の高感度化には、この条件の下で、移動度と積感度が大
きい方が良い。積感度は、キャリヤ面密度(キャリヤ密
度と厚さの積)の逆数に比例するから、高感度化には薄
い能動層が必要である。Since the maximum output is obtained for the maximum input, the sensitivity figure of merit M S F (Magnetic-
fieldSensitive figure of
MSF−(KNμ)
l/2 = +'H(ρ/e)"2 ocμ8 ... (4) Here, ρ-1/ne eμ. Considering the compatibility between the element and the external circuit, the characteristic impedance ρ/l is usually , 10Ω
It is desirable that the resistance is in the range of 10 to 10Ω. In order to increase the sensitivity of the Hall element, it is better to have higher mobility and product sensitivity under these conditions. Since the product sensitivity is proportional to the reciprocal of the carrier areal density (product of carrier density and thickness), a thin active layer is required for high sensitivity.
一方、磁気センサが、微小な磁界の検出に用いられる場
合には、信号対雑音比(S / N )が大きいことが
不可欠である。ホール出力と熱雑音v9をとって、S/
N比を定義すると、
S/N=Vo/VM
= (w/j2)ps B (P/4kT)””
xμH・・・(5)
となる。ここで、kは、ボルツマン定数。Tは、素子温
度。S/Nを大きくするには、μイが大きいことが第1
条件である。On the other hand, when a magnetic sensor is used to detect a minute magnetic field, it is essential that the signal-to-noise ratio (S/N) be high. Taking Hall output and thermal noise v9, S/
Defining the N ratio, S/N=Vo/VM = (w/j2) ps B (P/4kT)""
xμH...(5) Here, k is Boltzmann's constant. T is the element temperature. In order to increase the S/N, the first thing to do is to have a large μI.
It is a condition.
以上をまとめると、ある範囲の内部抵抗(例えば、外部
回路との整合性を考慮すると、望ましい素子の内部抵抗
は10ΩからIOKΩ)を有する条件の下で、磁気セン
サを高性能化するには、高移動度のキャリヤを極めて薄
い能動層に閉じ込めた構造が必要であるこ上が判明した
。To summarize the above, in order to improve the performance of a magnetic sensor under the condition that the internal resistance is within a certain range (for example, considering the compatibility with the external circuit, the desirable internal resistance of the element is 10Ω to IOKΩ), It has been found that a structure in which high-mobility carriers are confined in an extremely thin active layer is required.
そこで、本発明では、バンドギャップの異なる二種類の
半導体、例えば、AlGaAsとGaAsのヘテロ接合
構造を設けることにより、その境界の狭い領域に電子を
閉じ込めた二次元電子ガス層が形成し、これを磁気セン
サの能動層として利用するとともに、このセンサの入出
力電極を二次元電子ガス層と複数箇所でオーム性接触を
有するように形成するという技術手段を採用する。Therefore, in the present invention, by providing a heterojunction structure of two types of semiconductors with different band gaps, for example, AlGaAs and GaAs, a two-dimensional electron gas layer is formed in which electrons are confined in a narrow region of the boundary. In addition to using it as an active layer of a magnetic sensor, a technical means is adopted in which the input and output electrodes of this sensor are formed to have ohmic contact with the two-dimensional electron gas layer at multiple locations.
以下、本発明を図に示す実施例に基づいて詳細に説明す
る。Hereinafter, the present invention will be explained in detail based on embodiments shown in the drawings.
第1図は、本発明を特にホール素子用として適用した場
合のその概略構成図を示す。この場合、バンドギャップ
の異なる2種類の半導体層4と5のヘテロ接合部分には
、高移動度の二次元電子ガス層6が形成される。なお、
第1図において2a。FIG. 1 shows a schematic configuration diagram when the present invention is applied particularly to a Hall element. In this case, a two-dimensional electron gas layer 6 with high mobility is formed at the heterojunction between the two types of semiconductor layers 4 and 5 having different band gaps. In addition,
2a in FIG.
2bはホール素子Hに電流を流すための電流端子、3a
、3bは、ホール素子Hに磁束密度Bの磁界を加えた時
、発生するホール起電力■□を取り出すためのホール端
子である。2b is a current terminal for flowing current to the Hall element H, 3a
, 3b are Hall terminals for extracting the Hall electromotive force ■□ generated when a magnetic field of magnetic flux density B is applied to the Hall element H.
次に上記ホール素子Hの具体的な構造およびその製造方
法について説明する。Next, the specific structure of the Hall element H and its manufacturing method will be explained.
第2図は、A I G a A s / G a A
s ヘテロ接合半導体の構造を示しており、半絶縁性S
、1.−GaAs基手反7の上に、ノンドープGaAs
4、ノンドープAffQaAs5a、SiドープAl
GaAs 5 b、S iドープGaAs5cを順次分
子線結晶成長法(MBE)を用いて形成した。Figure 2 shows A I G a A s / G a A
s shows the structure of a heterojunction semiconductor, semi-insulating S
, 1. - Non-doped GaAs on the GaAs base plate 7
4. Non-doped AffQaAs5a, Si-doped Al
GaAs 5b and Si-doped GaAs 5c were sequentially formed using molecular beam crystal growth (MBE).
なお、他に有機金属気相成長法、液相成長法等を用いて
もよい。Note that other methods such as organometallic vapor phase epitaxy, liquid phase epitaxy, etc. may also be used.
この第2図かられかるように、二次元電子ガス層2DE
G6は、ノンドープGaAs層4のノンドープ AlG
aAs層5の側の境界面上に形成される。なお、ノンド
ープAj!GaAs層5を設けた理由は、n型のSiが
ドープされたAlGaAsSb中のSiがノンドープG
aAs d中に侵入するのを防止するためであ。As can be seen from this figure 2, the two-dimensional electron gas layer 2DE
G6 is non-doped AlG of non-doped GaAs layer 4
It is formed on the boundary surface on the aAs layer 5 side. In addition, non-dope Aj! The reason for providing the GaAs layer 5 is that the Si in the n-type Si-doped AlGaAsSb is
This is to prevent entry into the aAsd.
また、上述した、電流端子2a、2bおよびホール端子
3a、3bの電極として機能するAu−Geオーム性電
極200が上記各層4. 5a、 5b、5’cとオ
ーム性接触を有するように形成されている。Further, the Au-Ge ohmic electrodes 200 functioning as electrodes of the current terminals 2a, 2b and the hall terminals 3a, 3b are provided in each layer 4. It is formed to have ohmic contact with 5a, 5b, and 5'c.
なお結晶成長用の半絶縁性GaAs基板のクリーニング
は、濃硫酸、過酸化水素水、純水の混合液(容積比が4
: 1 : 1、液温摂氏60度)中で約1分間エツ
チングし、結晶成長用真空槽の中でヒ素の蒸気をあてな
がら熱エツチングを行った。For cleaning semi-insulating GaAs substrates for crystal growth, use a mixed solution of concentrated sulfuric acid, hydrogen peroxide, and pure water (with a volume ratio of 4
Etching was carried out for about 1 minute in a liquid temperature of 60 degrees Celsius), and thermal etching was carried out in a vacuum chamber for crystal growth while applying arsenic vapor.
結晶成長条件の代表例は以下の通りである。Representative examples of crystal growth conditions are as follows.
1、Gaフラックス: 6 X 10−’ Torr
2、Asフランクス: 1.2 X 10−’ To
rr3、A1フランクス: 1.4 X 10−’
Torr4、結晶成長温度 :摂氏630度
5、結晶成長速度 :1.2μ m / h r (
CaAs)1.65μm/hr
(A I G a A s )
6、第1層:ノンドープGaAs (500nm)第2
層:ノンドープAlGaAs (15nm)第3層;S
iドープA’ffGaAs (100nm)第4層:S
iドープGaAs (10nm)ここで、Stドープ濃
度は1×1018cm弓。1. Ga flux: 6 x 10-' Torr
2, As Franks: 1.2 X 10-' To
rr3, A1 Franks: 1.4 X 10-'
Torr4, crystal growth temperature: 630 degrees Celsius5, crystal growth rate: 1.2 μm/hr (
CaAs) 1.65 μm/hr (A I Ga As ) 6, 1st layer: Non-doped GaAs (500 nm) 2nd layer
Layer: Non-doped AlGaAs (15 nm) 3rd layer; S
i-doped A'ffGaAs (100 nm) 4th layer: S
i-doped GaAs (10 nm) where the St doping concentration is 1 x 10 cm arch.
7、オーミック電極はAuGe (7%から12%)
/ N t / A u蒸着膜の合金化による。7. Ohmic electrode is AuGe (7% to 12%)
/ N t / Au due to alloying of the deposited film.
試作したヘテロ接合ホール素子のエネルギーバンドを第
3図に示す。2次元電子ガス層は、SiドープしたA6
GaAsから供給される電子で満たされるが、AffG
aAs層中のキャリヤが多すぎると、すなわち、不純物
量が多すぎるか、またはAlGaAs層が厚過ぎると、
電子移動度の小さい余剰キャリヤをもつAlGaAs層
にも電流が流れる。これによって、ホール出力が低下す
る。Figure 3 shows the energy band of the prototype heterojunction Hall element. The two-dimensional electron gas layer is made of Si-doped A6
Filled with electrons supplied from GaAs, AffG
If there are too many carriers in the aAs layer, that is, if the amount of impurities is too large or if the AlGaAs layer is too thick,
Current also flows through the AlGaAs layer having surplus carriers with low electron mobility. This reduces the Hall output.
従って、AJGaAs層中の余剰キャリヤを無くすよう
にヘテロ接合半導体を作製することが重要である。Therefore, it is important to fabricate a heterojunction semiconductor so as to eliminate excess carriers in the AJGaAs layer.
第7図および第8図は、上記構成のホール素子を具体的
な磁気センサに適用する具体例を示し、本例では、電流
端子2a、2b及びホール端子3a、3bに形成するA
u−Geオーム性電極2゜Oに多数のメサ型孔201を
設け、この金属薄膜200を直接二次元電子ガス層6に
接触させ、鷹移動度を確保することにより電流電圧特性
の線形性を向上させることができる。また、上記のよう
な構造にすることによって、オーム性電極200と半導
体層4,5との境界に凹凸が多数できるため、従来の均
一な電極構造に比べるとホール素子の形状効果は小さく
なり、大きなホール出力が得られる。7 and 8 show a specific example in which the Hall element having the above configuration is applied to a specific magnetic sensor. In this example, the A
A large number of mesa-shaped holes 201 are provided in the u-Ge ohmic electrode 2°O, and the metal thin film 200 is brought into direct contact with the two-dimensional electron gas layer 6 to ensure hawk mobility, thereby improving the linearity of the current-voltage characteristics. can be improved. Furthermore, by adopting the above structure, many irregularities are created at the boundary between the ohmic electrode 200 and the semiconductor layers 4 and 5, so the shape effect of the Hall element becomes smaller compared to the conventional uniform electrode structure. Large hall output can be obtained.
従って本実施例によれば、ヘテロ接合半窩体[R気セン
サでは、単結晶バルクInSbにおいて達成できる最大
の性能指数と同等の値が容易に得られる。これはGaA
sのエピタキシャル単結晶の2倍、同イオン注入膜の3
倍以上、さらに、Siに較べて約10倍以上の優れた性
能である。また、本発明の特徴の一つは、磁気センサ用
ヘテロ接合半窩体が高速トランジスタ(例えば、HEM
T)用材料として類似しており、同一基板上でのセンサ
と信号処理用トランジスタの集禎化が可能であることで
ある。雑音レベルが小さく、温度特性も良いため、従来
の半導体材料モは得られなかった高性能な磁気センサI
Cの開発が期待され、利用の拡大が見込まれる。Therefore, according to this embodiment, a value equivalent to the maximum figure of merit achievable in single-crystal bulk InSb can be easily obtained in the heterojunction hemisofavage [R air sensor]. This is GaA
twice that of the epitaxial single crystal of S, and three times that of the same ion-implanted film.
The performance is more than twice that of Si, and about 10 times more excellent than that of Si. In addition, one of the features of the present invention is that the heterojunction hemisphere for magnetic sensors can be used for high-speed transistors (for example, HEM).
T) is similar as a material, and it is possible to integrate a sensor and a signal processing transistor on the same substrate. Due to its low noise level and good temperature characteristics, it is a high-performance magnetic sensor I that cannot be obtained using conventional semiconductor materials.
C is expected to be developed, and its use is expected to expand.
ここで、本実施例の磁気センサの特性について、本発明
者等が測定した測定値に基づいて説明する。Here, the characteristics of the magnetic sensor of this example will be explained based on measured values measured by the inventors.
第4図及び第5図は、長さが346μmで幅が200μ
mの十字形ヘテロ接合ホール素子の電気特性を示す。磁
界比例性は良く、極めて大きい積感度1000V/AT
が得られた。しかも、5.7V/T (7,5mA)の
最大磁束密度感度は、従来の磁気センサでは得られなか
った値である。Figures 4 and 5 have a length of 346μm and a width of 200μm.
The electrical characteristics of a cruciform heterojunction Hall element of m are shown. Good magnetic field proportionality, extremely large product sensitivity 1000V/AT
was gotten. Moreover, the maximum magnetic flux density sensitivity of 5.7 V/T (7.5 mA) is a value that cannot be obtained with conventional magnetic sensors.
第6図は、本発明のヘテロ接合磁気センサ(2DEG)
と現在使われている(n気センサの性能を積感度KH、
キャリヤ移動度μm、感度の性能指数(KM μ )
l/2、特性インピーダンスρ/Lの関係を用いて比較
したものである。本実施例によると、従来の半寡体材料
では達成できなかった高性能化の条件を満足しており、
予測通りの試作結果を得ている。Figure 6 shows a heterojunction magnetic sensor (2DEG) of the present invention.
(The performance of the n-air sensor is expressed as the product sensitivity KH,
Carrier mobility μm, sensitivity figure of merit (KM μ)
The comparison is made using the relationship of l/2 and characteristic impedance ρ/L. According to this example, the conditions for high performance that could not be achieved with conventional semi-oligolytic materials are satisfied,
The prototype results are as expected.
雑音特性と温度特性を調べた結果、雑音は約1kH,で
熱雑音レベルになり、温度特性もかなり良い結果を得て
いる。また、A /! G a A s / G aA
sシステムにおいては、/lの組成比の小さいものを製
作するか、又は、スーパードーピングによりGaAsと
同等の小さい温度依存性が見込まれる。As a result of examining the noise characteristics and temperature characteristics, the noise reached the thermal noise level at approximately 1 kHz, and the temperature characteristics were also found to be quite good. Also, A/! G a As / G a A
In the s system, a small temperature dependence equivalent to that of GaAs can be expected by manufacturing a material with a small composition ratio of /l or by superdoping.
第1表は、代表的な試作ホール素子の特性をまとめたも
のである。Table 1 summarizes the characteristics of typical prototype Hall elements.
以下余白
第1表
〔発明の効果〕
以上述べたように本発明によれば、極3領域に高移動度
の二次元電子ガス層を形成と共に、入出力電極をこの二
次元電子ガス層と複数箇所でオーム性接触を有するよう
に形成しているため、非常に高感度でかつ薄型の磁気セ
ンサが得られ、計測、制御の高精度、高速化に大きく貢
献することができるという優れた効果が得られる。Table 1 with blank space below [Effects of the Invention] As described above, according to the present invention, a two-dimensional electron gas layer with high mobility is formed in the three pole regions, and a plurality of input/output electrodes are connected to this two-dimensional electron gas layer. Since it is formed to have ohmic contact at certain points, it is possible to obtain an extremely sensitive and thin magnetic sensor, which has the excellent effect of greatly contributing to high accuracy and speeding up of measurement and control. can get.
以下の図面は全て本発明の実施例を示し、第1図はヘテ
ロ接合ホール素子の概略構成図、第2図及び第3図は、
それぞれヘテロ接合ホール素子の模式断面図及びエネル
ギーバンド図、第4図及び第5図はヘテロ接合ホール素
子の磁束密度−ホール電圧特性図、及び入力電流−ホー
ル電圧特性図、第6図は、従来素子に対する本発明ヘテ
ロ接合ホール素子のキャリヤ移動度−積感度の性能を示
す特性図、第7図は第1図〜第3図に示すホール素子を
磁気センサに通用した場合の斜視図、第8図は第7図の
部分断面図である。
2a、2b・・・電流端子、3a、3b・・・ホール端
子、4・・・ノンドープGaAs、5a・・・ノンドー
プAI!’GaAs、5b・=St ドープAj2Ga
As。
5C・・・SiドープGaAs、6・・・二次元電子ガ
ス層、200−Au−Geオーム性電極、201・・・
メサ型孔。
代理人弁理士 岡 部 隆
第1図
第2図 第3図
キャリヤ枠動度 s(m/v、s)
第6図
ホール電圧 v、(v)The following drawings all show embodiments of the present invention, and FIG. 1 is a schematic configuration diagram of a heterojunction Hall element, and FIGS. 2 and 3 are
4 and 5 are magnetic flux density-Hall voltage characteristic diagrams and input current-Hall voltage characteristic diagrams of the heterojunction Hall element, and FIG. 6 is the conventional one. 7 is a characteristic diagram showing the carrier mobility-product sensitivity performance of the heterojunction Hall element of the present invention with respect to the element, FIG. 7 is a perspective view when the Hall element shown in FIGS. 1 to 3 is applied to a magnetic sensor, and FIG. The figure is a partial sectional view of FIG. 7. 2a, 2b... Current terminal, 3a, 3b... Hall terminal, 4... Non-doped GaAs, 5a... Non-doped AI! 'GaAs, 5b・=St doped Aj2Ga
As. 5C...Si-doped GaAs, 6...Two-dimensional electron gas layer, 200-Au-Ge ohmic electrode, 201...
Mesa-shaped hole. Attorney: Takashi Okabe Figure 1 Figure 2 Figure 3 Carrier frame movement s (m/v, s) Figure 6 Hall voltage v, (v)
Claims (2)
高移動度の二次元電子ガス層を形成せしめるヘテロ接合
構造を包含するヘテロ接合磁気センサにおいて、 このヘテロ接合磁気センサには、前記二次元電子ガス層
と複数箇所でオーム性接触を有する入出力電極が形成さ
れていることを特徴とするヘテロ接合磁気センサ。(1) At the junction of different types of semiconductors with different band gaps,
In a heterojunction magnetic sensor including a heterojunction structure that forms a two-dimensional electron gas layer with high mobility, this heterojunction magnetic sensor includes input and output electrodes that have ohmic contact with the two-dimensional electron gas layer at multiple locations A heterojunction magnetic sensor characterized in that:
s層を不純物を含まないAlGaAs層に接合し、かつ
このAlGaAs層にn型不純物を含むAlGaAs層
を接合するように構成されていることを特徴とする特許
請求の範囲第1項記載のヘテロ接合磁気センサ。(2) The heterojunction structure is made of impurity-free CaA
The heterojunction according to claim 1, characterized in that the s-layer is bonded to an AlGaAs layer containing no impurities, and the AlGaAs layer containing n-type impurities is bonded to this AlGaAs layer. magnetic sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61198508A JPS6354785A (en) | 1986-08-25 | 1986-08-25 | Hetero-junction magnetic sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61198508A JPS6354785A (en) | 1986-08-25 | 1986-08-25 | Hetero-junction magnetic sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6354785A true JPS6354785A (en) | 1988-03-09 |
| JPH0342707B2 JPH0342707B2 (en) | 1991-06-28 |
Family
ID=16392301
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61198508A Granted JPS6354785A (en) | 1986-08-25 | 1986-08-25 | Hetero-junction magnetic sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6354785A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4912451A (en) * | 1988-03-28 | 1990-03-27 | Nippon Soken, Inc. | Heterojunction magnetic field sensor |
| FR2691839A1 (en) * | 1992-05-27 | 1993-12-03 | Schlumberger Ind Sa | Hall Effect Sensor. |
| JP2010512017A (en) * | 2006-12-07 | 2010-04-15 | 韓國電子通信研究院 | Method of manufacturing light emitting diode including current spreading layer |
| US8035927B2 (en) | 2008-01-28 | 2011-10-11 | Hitachi Global Storage Technologies Netherlands B.V. | EMR magnetic sensor having its active quantum well layer extending beyond an over-lying semiconductor layer end with tab and lead structure for improved electrical contact |
| US8059373B2 (en) | 2006-10-16 | 2011-11-15 | Hitachi Global Storage Technologies Netherlands, B.V. | EMR sensor and transistor formed on the same substrate |
| CN115207207A (en) * | 2022-09-14 | 2022-10-18 | 深圳市柯雷科技开发有限公司 | Method for manufacturing pressure sensor with composite structure of nitride and magnetostrictive material |
-
1986
- 1986-08-25 JP JP61198508A patent/JPS6354785A/en active Granted
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4912451A (en) * | 1988-03-28 | 1990-03-27 | Nippon Soken, Inc. | Heterojunction magnetic field sensor |
| FR2691839A1 (en) * | 1992-05-27 | 1993-12-03 | Schlumberger Ind Sa | Hall Effect Sensor. |
| US5442221A (en) * | 1992-05-27 | 1995-08-15 | Schlumberger Industries, S.A. | Hall effect sensor |
| US8059373B2 (en) | 2006-10-16 | 2011-11-15 | Hitachi Global Storage Technologies Netherlands, B.V. | EMR sensor and transistor formed on the same substrate |
| JP2010512017A (en) * | 2006-12-07 | 2010-04-15 | 韓國電子通信研究院 | Method of manufacturing light emitting diode including current spreading layer |
| US8035927B2 (en) | 2008-01-28 | 2011-10-11 | Hitachi Global Storage Technologies Netherlands B.V. | EMR magnetic sensor having its active quantum well layer extending beyond an over-lying semiconductor layer end with tab and lead structure for improved electrical contact |
| CN115207207A (en) * | 2022-09-14 | 2022-10-18 | 深圳市柯雷科技开发有限公司 | Method for manufacturing pressure sensor with composite structure of nitride and magnetostrictive material |
| CN115207207B (en) * | 2022-09-14 | 2023-02-24 | 深圳市柯雷科技开发有限公司 | Method for manufacturing high-sensitivity pressure sensor based on composite nitride and magnetostrictive material structure |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0342707B2 (en) | 1991-06-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5883564A (en) | Magnetic field sensor having high mobility thin indium antimonide active layer on thin aluminum indium antimonide buffer layer | |
| US5184106A (en) | Magnetic field sensor with improved electron mobility | |
| US4978938A (en) | Magnetoresistor | |
| JP3376078B2 (en) | High electron mobility transistor | |
| CN110890457A (en) | High-temperature Hall sensor integrating back vertical type and front horizontal type three-dimensional magnetic field detection functions and manufacturing method thereof | |
| JP3177951B2 (en) | Field effect transistor and method of manufacturing the same | |
| JPS6354785A (en) | Hetero-junction magnetic sensor | |
| Sugiyama et al. | Highly-sensitive Hall element with quantum-well superlattice structures | |
| KR930000793B1 (en) | Improved position sensor | |
| EP0375107B1 (en) | Improved magnetoresistors | |
| JP3404815B2 (en) | GaInAs two-dimensional electron Hall element | |
| RU2262777C1 (en) | Magnetic field sensor | |
| JPH0687509B2 (en) | Heterojunction magnetic sensor | |
| JP3399053B2 (en) | Heterojunction Hall element | |
| JPH0297075A (en) | Heterojunction magnetic sensor | |
| JPH0870146A (en) | Magnetic sensor | |
| JPS62144365A (en) | Laminated structure | |
| JPH11186631A (en) | Electronic device having a ball element, a semiconductor device and a rotation mechanism | |
| JP3395277B2 (en) | Magnetoelectric conversion element | |
| JP2597774Y2 (en) | Hall element | |
| JP3438294B2 (en) | Hall element | |
| JP3287054B2 (en) | Magnetoelectric conversion element | |
| JP2718511B2 (en) | Compound semiconductor device | |
| JPH05291644A (en) | Gaas hall element and its fabrication | |
| JP3399046B2 (en) | Hall element |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |