JPS6363761U - - Google Patents
Info
- Publication number
- JPS6363761U JPS6363761U JP15898486U JP15898486U JPS6363761U JP S6363761 U JPS6363761 U JP S6363761U JP 15898486 U JP15898486 U JP 15898486U JP 15898486 U JP15898486 U JP 15898486U JP S6363761 U JPS6363761 U JP S6363761U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor sensor
- hole
- contact
- press
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
Landscapes
- Measuring Fluid Pressure (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
Description
第１図は、この考案の一実施例を用いた計測シ
ステムの断面図、第２図は第１図の基台を取り去
つて示す平面図、第３図は従来の半導体センサー
の絶縁処理の様子を透視的に示す斜視図である。
図において、１は半導体センサー、２は基台、
５はコンタクトパツド、６は絶縁性弾性材、７は
リード線、８は圧接部、９はスルーホール、１４
は感応部である。なお、各図中同一符号は同一又
は相当部分を示す。
Fig. 1 is a sectional view of a measurement system using an embodiment of this invention, Fig. 2 is a plan view with the base removed from Fig. 1, and Fig. 3 is a diagram showing the insulation treatment of a conventional semiconductor sensor. FIG. 3 is a perspective view transparently showing the situation. In the figure, 1 is a semiconductor sensor, 2 is a base,
5 is a contact pad, 6 is an insulating elastic material, 7 is a lead wire, 8 is a pressure contact part, 9 is a through hole, 14
is the sensitive part. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
トパツドを有する半導体センサーおよびこの半導
体センサーの感応部に対応して設けられたスルー
ホールと、上記半導体センサーのコンタクトパツ
ドに当接するように配線されたリード線とを有す
る絶縁性弾性圧接部材を備え、この圧接部材を上
記半導体センサーに圧接することにより、上記感
応部とスルーホールを合わせると共に、上記コン
タクトパツドと上記リード線を圧着接続し、上記
半導体センサーを被覆し絶縁するように構成した
半導体センサーセル。 a base, a semiconductor sensor provided on the base and having a sensitive part and a compact pad; a through hole provided corresponding to the sensitive part of the semiconductor sensor; and a through hole so as to come into contact with the contact pad of the semiconductor sensor. An insulating elastic press-contact member having a wired lead wire is provided, and by press-contacting the press-contact member to the semiconductor sensor, the sensitive portion and the through hole are aligned, and the contact pad and the lead wire are crimped and connected. and a semiconductor sensor cell configured to cover and insulate the semiconductor sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15898486U JPS6363761U (en) | 1986-10-17 | 1986-10-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15898486U JPS6363761U (en) | 1986-10-17 | 1986-10-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6363761U true JPS6363761U (en) | 1988-04-27 |
Family
ID=31082989
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15898486U Pending JPS6363761U (en) | 1986-10-17 | 1986-10-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6363761U (en) |
-
1986
- 1986-10-17 JP JP15898486U patent/JPS6363761U/ja active Pending