JPS6419630A - Manufacture of enameled wire - Google Patents
Manufacture of enameled wireInfo
- Publication number
- JPS6419630A JPS6419630A JP17487887A JP17487887A JPS6419630A JP S6419630 A JPS6419630 A JP S6419630A JP 17487887 A JP17487887 A JP 17487887A JP 17487887 A JP17487887 A JP 17487887A JP S6419630 A JPS6419630 A JP S6419630A
- Authority
- JP
- Japan
- Prior art keywords
- die
- sensing
- specified
- coating device
- enameled wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000011248 coating agent Substances 0.000 abstract 5
- 238000000576 coating method Methods 0.000 abstract 5
- 230000005856 abnormality Effects 0.000 abstract 3
- 210000003298 dental enamel Anatomy 0.000 abstract 3
- 239000002966 varnish Substances 0.000 abstract 3
- 230000001105 regulatory effect Effects 0.000 abstract 1
Landscapes
- Processes Specially Adapted For Manufacturing Cables (AREA)
Abstract
PURPOSE:To provide possibility of changing the sensing preciseness of appearance abnormality to any desired level by installing a coating device other than specified at a stage prior to the final coating device, adjusting the dia. of a throat die of device, sensing thereupon any appearance abnormality on an enameled wire, and thereby regulating the film thickness of enameled wire as specified. CONSTITUTION:A coating device 3 with surface sensing die other than specified is installed before an enameled wire 1 coated and baked repeatedly by coating devices is introduced to the final coating device 2, and varnish 4 is coated on this enamel wire 1 with the aid of a varnish roll 10. This is passed through a sensing die 5 adjusted into a specified dia., and excessive varnish is removed. Eventually existing lumps due to bubbles on the surface of enamel wire 1 touch the inner surface of the die 5, and a tensile force is applied to the die. Accordingly a die holder 6 is mounted at the sensing die and a limit switch 7 is installed, and the die holder 6 is inclined by the tensile force to actuate the limit switch 7 and give alarm, and thus abnormality on enamel wire can be sensed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17487887A JPS6419630A (en) | 1987-07-15 | 1987-07-15 | Manufacture of enameled wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17487887A JPS6419630A (en) | 1987-07-15 | 1987-07-15 | Manufacture of enameled wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6419630A true JPS6419630A (en) | 1989-01-23 |
Family
ID=15986238
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17487887A Pending JPS6419630A (en) | 1987-07-15 | 1987-07-15 | Manufacture of enameled wire |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6419630A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0355955A3 (en) * | 1988-07-25 | 1991-12-27 | Hitachi, Ltd. | Connection for semiconductor devices or integrated circuits by coated wires and method of manufacturing the same |
| US6352654B1 (en) | 1997-03-17 | 2002-03-05 | General Electric Company | Conductive polyphenylene ether-polyamide compositions and method for their preparation |
| CN104021890A (en) * | 2014-06-24 | 2014-09-03 | 湖州天洋线缆有限公司 | Enameled wire paint breaking alarming method and mechanism of enameling machine |
| AT522368A1 (en) * | 2019-07-01 | 2020-10-15 | Asta Elektrodraht Gmbh | Varnishing machine for wire with wiper arrangement |
-
1987
- 1987-07-15 JP JP17487887A patent/JPS6419630A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0355955A3 (en) * | 1988-07-25 | 1991-12-27 | Hitachi, Ltd. | Connection for semiconductor devices or integrated circuits by coated wires and method of manufacturing the same |
| US6352654B1 (en) | 1997-03-17 | 2002-03-05 | General Electric Company | Conductive polyphenylene ether-polyamide compositions and method for their preparation |
| CN104021890A (en) * | 2014-06-24 | 2014-09-03 | 湖州天洋线缆有限公司 | Enameled wire paint breaking alarming method and mechanism of enameling machine |
| AT522368A1 (en) * | 2019-07-01 | 2020-10-15 | Asta Elektrodraht Gmbh | Varnishing machine for wire with wiper arrangement |
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