JPS6435794U - - Google Patents

Info

Publication number
JPS6435794U
JPS6435794U JP1987129483U JP12948387U JPS6435794U JP S6435794 U JPS6435794 U JP S6435794U JP 1987129483 U JP1987129483 U JP 1987129483U JP 12948387 U JP12948387 U JP 12948387U JP S6435794 U JPS6435794 U JP S6435794U
Authority
JP
Japan
Prior art keywords
cooling
cooling plate
flange portion
ring
refrigerant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987129483U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0530394Y2 (
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987129483U priority Critical patent/JPH0530394Y2/ja
Publication of JPS6435794U publication Critical patent/JPS6435794U/ja
Application granted granted Critical
Publication of JPH0530394Y2 publication Critical patent/JPH0530394Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/851Dispositions of multiple connectors or interconnections
    • H10W72/874On different surfaces
    • H10W72/877Bump connectors and die-attach connectors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1987129483U 1987-08-26 1987-08-26 Expired - Lifetime JPH0530394Y2 ( )

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987129483U JPH0530394Y2 ( ) 1987-08-26 1987-08-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987129483U JPH0530394Y2 ( ) 1987-08-26 1987-08-26

Publications (2)

Publication Number Publication Date
JPS6435794U true JPS6435794U ( ) 1989-03-03
JPH0530394Y2 JPH0530394Y2 ( ) 1993-08-03

Family

ID=31383799

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987129483U Expired - Lifetime JPH0530394Y2 ( ) 1987-08-26 1987-08-26

Country Status (1)

Country Link
JP (1) JPH0530394Y2 ( )

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5737258U ( ) * 1980-08-11 1982-02-27
JPS6267844A (ja) * 1985-09-20 1987-03-27 Fujitsu Ltd 冷却構造

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5737258U ( ) * 1980-08-11 1982-02-27
JPS6267844A (ja) * 1985-09-20 1987-03-27 Fujitsu Ltd 冷却構造

Also Published As

Publication number Publication date
JPH0530394Y2 ( ) 1993-08-03

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