JPS644052A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS644052A
JPS644052A JP62159314A JP15931487A JPS644052A JP S644052 A JPS644052 A JP S644052A JP 62159314 A JP62159314 A JP 62159314A JP 15931487 A JP15931487 A JP 15931487A JP S644052 A JPS644052 A JP S644052A
Authority
JP
Japan
Prior art keywords
leads
semiconductor chip
parts
metallic layers
island
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62159314A
Other languages
Japanese (ja)
Inventor
Shoichi Yamana
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP62159314A priority Critical patent/JPS644052A/en
Publication of JPS644052A publication Critical patent/JPS644052A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To prevent aluminum on peds of a semiconductor chip from being removed, by forming metallic layers, larger in ionization tendency than a metal which forms leads, partially on the leads. CONSTITUTION:This device is composed of the following parts: an island 2 with a semiconductor chip 4 mounted on its central part, a lead frame 1a with a plurality of leads 3a formed spirally on the periphery of the island 2, sealing resin 6 formed for armoring the lead frame 1a and the semiconductor chip 4 other than tip parts of the leads 3a. Metallic layers 8 larger in ionization tendency than the lead 3a's metal are disposed on the leads 3a and in the vicinity of the bonding parts of the leads 3a by a coating method. Water, which invades gaps between the leads 3a and the sealing resin 6 and penetrates stepped parts 7, is made to chemically react to the metallic layers 8 and completely consumed. Since no water is thus carried through bonding wires 5 to reach the pads on a chip 4, aluminum on the pads can be prevented from being removed.
JP62159314A 1987-06-25 1987-06-25 Semiconductor device Pending JPS644052A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62159314A JPS644052A (en) 1987-06-25 1987-06-25 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62159314A JPS644052A (en) 1987-06-25 1987-06-25 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS644052A true JPS644052A (en) 1989-01-09

Family

ID=15691089

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62159314A Pending JPS644052A (en) 1987-06-25 1987-06-25 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS644052A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017063105A (en) * 2015-09-24 2017-03-30 トヨタ自動車株式会社 Semiconductor module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017063105A (en) * 2015-09-24 2017-03-30 トヨタ自動車株式会社 Semiconductor module

Similar Documents

Publication Publication Date Title
US4894752A (en) Lead frame for a semiconductor device
MY126696A (en) Structure and method of direct chip attach
TW369710B (en) Semiconductor apparatus and its producing method
JPS56122156A (en) Lead frame for semiconductor device
JPS644052A (en) Semiconductor device
JPS5727050A (en) Lead frame and semiconductor device using said lead frame
JPS57114265A (en) Ic lead frame and transistor comb and manufacture thereof
JPS6437043A (en) Resin-sealed semiconductor device
JPS5694753A (en) Correction method of semiconductor ic chip mounted substrate
JPS57143848A (en) Semiconductor device
TW230271B (en) Leadframe processing for molded package arrangements
JPS57173948A (en) Manufacture of semiconductor device
JPS57211762A (en) Lead frame for semiconductor
JPS642399A (en) Semiconductor device
JPS54112167A (en) Manufacture of semiconductor device
JPS5730353A (en) Semiconductor device
JPS57114263A (en) Semiconductor device
JPS54102971A (en) Semiconductor device
JPS57139949A (en) Resin sealing type semiconductor device
JPS5739557A (en) Semiconductor device
JPS6441252A (en) Semiconductor device
JPS5324268A (en) Pro duction of semiconductor device and bonding wire for the same
JPS57192037A (en) Semiconductor device
JPS556862A (en) Mounting structure of ic for electronic timepiece
JPS5771139A (en) Semiconductor device