JPS6441231A - Die bonder - Google Patents

Die bonder

Info

Publication number
JPS6441231A
JPS6441231A JP62197930A JP19793087A JPS6441231A JP S6441231 A JPS6441231 A JP S6441231A JP 62197930 A JP62197930 A JP 62197930A JP 19793087 A JP19793087 A JP 19793087A JP S6441231 A JPS6441231 A JP S6441231A
Authority
JP
Japan
Prior art keywords
main body
applying unit
nozzle main
adhesive
adhesive applying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62197930A
Other languages
Japanese (ja)
Other versions
JP2519257B2 (en
Inventor
Shuichi Ito
Yoshihisa Watanabe
Toshio Nakano
Haruo Sasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Japan Display Inc
Original Assignee
Hitachi Device Engineering Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Device Engineering Co Ltd, Hitachi Ltd filed Critical Hitachi Device Engineering Co Ltd
Priority to JP62197930A priority Critical patent/JP2519257B2/en
Publication of JPS6441231A publication Critical patent/JPS6441231A/en
Application granted granted Critical
Publication of JP2519257B2 publication Critical patent/JP2519257B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/01Manufacture or treatment
    • H10W72/011Apparatus therefor
    • H10W72/0113Apparatus for manufacturing die-attach connectors

Landscapes

  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PURPOSE:To improve the reproducibility of the position of an adhesive applying unit by installing a position control section specifying the position of a nozzle main body in the adhesive applying unit in the direction vertical to an adhesive surface to a holding member and mounting a section, a position of which is controlled, abutted against the position control section to the nozzle main body. CONSTITUTION:With an adhesive applicator 5 for a die bonder 1, position control sections 5D1-5D3 specifying the position of a nozzle main body 5B in an adhesive applying unit 5C in the direction of rotation and the direction of a plane in the surface parallel with the surface of a cavity in a package member 11 are set up to a holding member 5D, and sections 5B1-5B3, positions of which are controlled, abutted against the position control section 5D3 are fitted to the nozzle main body 5B in the adhesive applying unit 5C. Accordingly, the reproducibility of the position of the nozzle main body 5B of the adhesive applying unit 5C can be improved in the direction vertical to an adhesive surface, thus shortening the time of the exchange work of a syringe.
JP62197930A 1987-08-06 1987-08-06 Die bonder Expired - Lifetime JP2519257B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62197930A JP2519257B2 (en) 1987-08-06 1987-08-06 Die bonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62197930A JP2519257B2 (en) 1987-08-06 1987-08-06 Die bonder

Publications (2)

Publication Number Publication Date
JPS6441231A true JPS6441231A (en) 1989-02-13
JP2519257B2 JP2519257B2 (en) 1996-07-31

Family

ID=16382648

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62197930A Expired - Lifetime JP2519257B2 (en) 1987-08-06 1987-08-06 Die bonder

Country Status (1)

Country Link
JP (1) JP2519257B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0329391A (en) * 1989-06-27 1991-02-07 Sanyo Electric Co Ltd Coating device
JPH045639U (en) * 1990-04-28 1992-01-20
JP2013111628A (en) * 2011-11-30 2013-06-10 Akim Kk Temporary fitting apparatus for welding ring, and temporary fitting method for the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0329391A (en) * 1989-06-27 1991-02-07 Sanyo Electric Co Ltd Coating device
JPH045639U (en) * 1990-04-28 1992-01-20
JP2013111628A (en) * 2011-11-30 2013-06-10 Akim Kk Temporary fitting apparatus for welding ring, and temporary fitting method for the same

Also Published As

Publication number Publication date
JP2519257B2 (en) 1996-07-31

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