JPS6441231A - Die bonder - Google Patents
Die bonderInfo
- Publication number
- JPS6441231A JPS6441231A JP62197930A JP19793087A JPS6441231A JP S6441231 A JPS6441231 A JP S6441231A JP 62197930 A JP62197930 A JP 62197930A JP 19793087 A JP19793087 A JP 19793087A JP S6441231 A JPS6441231 A JP S6441231A
- Authority
- JP
- Japan
- Prior art keywords
- main body
- applying unit
- nozzle main
- adhesive
- adhesive applying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/011—Apparatus therefor
- H10W72/0113—Apparatus for manufacturing die-attach connectors
Landscapes
- Die Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
PURPOSE:To improve the reproducibility of the position of an adhesive applying unit by installing a position control section specifying the position of a nozzle main body in the adhesive applying unit in the direction vertical to an adhesive surface to a holding member and mounting a section, a position of which is controlled, abutted against the position control section to the nozzle main body. CONSTITUTION:With an adhesive applicator 5 for a die bonder 1, position control sections 5D1-5D3 specifying the position of a nozzle main body 5B in an adhesive applying unit 5C in the direction of rotation and the direction of a plane in the surface parallel with the surface of a cavity in a package member 11 are set up to a holding member 5D, and sections 5B1-5B3, positions of which are controlled, abutted against the position control section 5D3 are fitted to the nozzle main body 5B in the adhesive applying unit 5C. Accordingly, the reproducibility of the position of the nozzle main body 5B of the adhesive applying unit 5C can be improved in the direction vertical to an adhesive surface, thus shortening the time of the exchange work of a syringe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62197930A JP2519257B2 (en) | 1987-08-06 | 1987-08-06 | Die bonder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62197930A JP2519257B2 (en) | 1987-08-06 | 1987-08-06 | Die bonder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6441231A true JPS6441231A (en) | 1989-02-13 |
| JP2519257B2 JP2519257B2 (en) | 1996-07-31 |
Family
ID=16382648
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62197930A Expired - Lifetime JP2519257B2 (en) | 1987-08-06 | 1987-08-06 | Die bonder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2519257B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0329391A (en) * | 1989-06-27 | 1991-02-07 | Sanyo Electric Co Ltd | Coating device |
| JPH045639U (en) * | 1990-04-28 | 1992-01-20 | ||
| JP2013111628A (en) * | 2011-11-30 | 2013-06-10 | Akim Kk | Temporary fitting apparatus for welding ring, and temporary fitting method for the same |
-
1987
- 1987-08-06 JP JP62197930A patent/JP2519257B2/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0329391A (en) * | 1989-06-27 | 1991-02-07 | Sanyo Electric Co Ltd | Coating device |
| JPH045639U (en) * | 1990-04-28 | 1992-01-20 | ||
| JP2013111628A (en) * | 2011-11-30 | 2013-06-10 | Akim Kk | Temporary fitting apparatus for welding ring, and temporary fitting method for the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2519257B2 (en) | 1996-07-31 |
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