JPS644325B2 - - Google Patents
Info
- Publication number
- JPS644325B2 JPS644325B2 JP58134634A JP13463483A JPS644325B2 JP S644325 B2 JPS644325 B2 JP S644325B2 JP 58134634 A JP58134634 A JP 58134634A JP 13463483 A JP13463483 A JP 13463483A JP S644325 B2 JPS644325 B2 JP S644325B2
- Authority
- JP
- Japan
- Prior art keywords
- glass layer
- resistor
- trimming
- resistance value
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011521 glass Substances 0.000 claims description 31
- 238000009966 trimming Methods 0.000 claims description 14
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 6
- 238000010304 firing Methods 0.000 description 5
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 2
- 239000004327 boric acid Substances 0.000 description 2
- 238000002835 absorbance Methods 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Description
【発明の詳細な説明】
この発明は、トリミング工程を改善したチツプ
抵抗器の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a chip resistor with an improved trimming process.
従来、チツプ抵抗器は抵抗値トリミングを施し
た後、抵抗体表面にガラスコートを印刷、焼成し
ている。このため、ガラスコートを焼成する際
に、抵抗体が加熱されるため、調整後の抵抗値が
変化し、抵抗値精度が低下する欠点があつた。 Conventionally, chip resistors are manufactured by trimming the resistance value, then printing and baking a glass coat on the surface of the resistor. For this reason, when firing the glass coat, the resistor is heated, resulting in a change in the resistance value after adjustment, resulting in a decrease in resistance accuracy.
そこで、この発明は、レーザトリミングによる
トリミング効率を高めるとともに、ガラスコート
を焼成する際に生じる抵抗値変化を抑制したチツ
プ抵抗器の製造方法の提供を目的とする。 SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a method for manufacturing a chip resistor that increases trimming efficiency by laser trimming and suppresses changes in resistance value that occur when firing a glass coat.
即ち、この発明のチツプ抵抗器の製造方法は、
基板に形成された抵抗体の表面にグリーンの第１
のガラス層を形成し、このガラス層上から前記抵
抗体にレーザトリミングを施して抵抗値を調整し
た後、第２のガラス層を形成するようにしたもの
である。 That is, the method for manufacturing a chip resistor of the present invention is as follows:
A green first layer is applied to the surface of the resistor formed on the substrate.
A second glass layer is formed after a second glass layer is formed, and the resistor is laser trimmed from above the glass layer to adjust the resistance value.
以下、この発明を図面に示した実施例を参照し
て詳細に説明する。 Hereinafter, the present invention will be described in detail with reference to embodiments shown in the drawings.
第１図及び第２図は、この発明のチツプ抵抗器
の製造方法の実施例を製造工程順に示す。 1 and 2 show an embodiment of the method for manufacturing a chip resistor according to the present invention in the order of manufacturing steps.
第１図Ａに示すように、長方形状の基板２は、
アルミナ等の絶縁性材料によつて成形され、この
基板２の表面の対向する縁部に一対の１次電極
４，６を形成する。 As shown in FIG. 1A, the rectangular substrate 2 is
The substrate 2 is formed of an insulating material such as alumina, and a pair of primary electrodes 4 and 6 are formed on opposing edges of the surface of the substrate 2 .
次に、第１図Ｂに示すように、電極４，６の間
の基板２の表面に電極４，６の表面の一部を被つ
て抵抗体８を焼成する。この抵抗体８は電極４，
６間に電気的に接続され、電極４，６は外部端子
となる。 Next, as shown in FIG. 1B, a resistor 8 is fired by covering part of the surface of the electrodes 4 and 6 on the surface of the substrate 2 between the electrodes 4 and 6. This resistor 8 is connected to the electrode 4,
The electrodes 4 and 6 serve as external terminals.
次に、第１図Ｃに示すように、抵抗体８を覆う
第１のガラス層１０を印刷し、焼成処理を施して
形成する。このガラス層１０は、硼酸系ガラス等
で形成し、レーザー吸収を良好にするため、半透
明グリーン等に設定する。 Next, as shown in FIG. 1C, a first glass layer 10 covering the resistor 8 is printed and fired. This glass layer 10 is formed of boric acid glass or the like, and is set to a translucent green color or the like in order to improve laser absorption.
次に、第１図Ｄに示すように、ガラス層１０の
上から抵抗体８にレーザートリミングを施し、抵
抗値を所定値に調整する。抵抗体８及びガラス層
１０に形成された切欠き１２は、トリミング跡を
示す。 Next, as shown in FIG. 1D, the resistor 8 is laser trimmed from above the glass layer 10 to adjust the resistance value to a predetermined value. Notches 12 formed in the resistor 8 and the glass layer 10 show trimming marks.
次に、第２図に示すように、第１のガラス層１
０及び抵抗体８を全面的に被う保護膜としての第
２のガラス層１４を印刷、焼成処理で形成する。
このとき、前記切欠き１２には第２のガラス層１
４が形成される。なお、第２のガラス層１４も硼
酸系ガラス等を使用し、黒色等に設定する。 Next, as shown in FIG.
A second glass layer 14 as a protective film that completely covers the resistor 8 and the resistor 8 is formed by printing and firing.
At this time, the second glass layer 1 is placed in the notch 12.
4 is formed. Note that the second glass layer 14 is also made of boric acid glass or the like, and is set to black or the like.
そして、基板２の端面部には、１次電極４，６
に電気的に接続される２次電極１６，１８が印刷
等の手段で形成されてチツプ抵抗器が製造され
る。なお、２次電極１６，１８はプリント配線板
等への半田付け処理の便宜のために形成される。 Primary electrodes 4 and 6 are provided on the end surface of the substrate 2.
The chip resistor is manufactured by forming secondary electrodes 16 and 18 electrically connected to the chip resistor by printing or other means. Note that the secondary electrodes 16 and 18 are formed for convenience in soldering to a printed wiring board or the like.
以上のように、抵抗値トリミングの後に第２の
ガラス層１４を焼成する場合、抵抗体８は第１の
ガラス層１０で被覆されているため、ガラス層１
０はガラス層１４の形成上、熱遮蔽として機能す
る。この結果、ガラス層１４の焼成は、従来の場
合と比較すると、抵抗値変化を小さくすることが
できる。従つて、抵抗値精度を高めることがで
き、歩留りが向上し、抵抗値の管理が容易にな
る。なお、第１のガラス層１０では従来の場合と
同様に抵抗体８に抵抗値変化を生じさせることに
なるが、第１のガラス層１０の形成はトリミング
前であり、その変化は製造途上であるため、何等
不都合を生じない。 As described above, when firing the second glass layer 14 after resistance value trimming, since the resistor 8 is covered with the first glass layer 10, the glass layer 1
0 functions as a heat shield due to the formation of the glass layer 14. As a result, firing the glass layer 14 can reduce the change in resistance value compared to the conventional case. Therefore, resistance value accuracy can be improved, yield can be improved, and resistance value management can be facilitated. Note that the first glass layer 10 causes a change in the resistance value of the resistor 8 as in the conventional case, but the first glass layer 10 is formed before trimming, and the change occurs during the manufacturing process. Therefore, it will not cause any inconvenience.
また、第１のガラス層１０で抵抗体８の大部分
が被覆されているため、第２のガラス層１４の形
成は薄く設定でき、抵抗器の厚さは従来品と同様
となる。 Further, since most of the resistor 8 is covered with the first glass layer 10, the second glass layer 14 can be formed thinly, and the thickness of the resistor is the same as that of conventional products.
以上説明したように、この発明によれば、抵抗
値トリミング前にグリーンの第１のガラス層を形
成したので、レーザの吸光度係数が大でトリミン
グ効率が最も高く、他の色に比較して低エネルギ
でトリミングができるとともに、同エネルギでは
より早い速度でトリミングを行うことができ、ま
た、トリミング後に第２のガラス層を形成するの
で、抵抗値変化を抑制することができ、抵抗値精
度を高め、その管理が容易になるとともに、歩留
りの向上を図ることができる。 As explained above, according to the present invention, since the green first glass layer is formed before resistance value trimming, the laser has a large absorbance coefficient, the trimming efficiency is the highest, and the trimming efficiency is low compared to other colors. Trimming can be done with energy, and trimming can be done at a faster speed with the same energy. Also, since a second glass layer is formed after trimming, it is possible to suppress changes in resistance value and improve resistance accuracy. , its management becomes easier and the yield can be improved.
第１図はこの発明のチツプ抵抗器の製造方法の
実施例を示す斜視図、第２図は第１図に示した製
造方法によつて製造されたチツプ抵抗器を示す縦
断面図である。
２……基板、８……抵抗体、１０……グリーン
の第１のガラス層、１４……第２のガラス層。
FIG. 1 is a perspective view showing an embodiment of the method for manufacturing a chip resistor according to the present invention, and FIG. 2 is a longitudinal sectional view showing the chip resistor manufactured by the manufacturing method shown in FIG. 2... Substrate, 8... Resistor, 10... Green first glass layer, 14... Second glass layer.
Claims (1)
第１のガラス層を形成し、このガラス層上から前
記抵抗体にレーザトリミングを施して抵抗値を調
整した後、第２のガラス層を形成することを特徴
とするチツプ抵抗器の製造方法。1. Form a green first glass layer on the surface of a resistor formed on a substrate, perform laser trimming on the resistor from above this glass layer to adjust the resistance value, and then form a second glass layer. A method for manufacturing a chip resistor, characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58134634A JPS6027104A (en) | 1983-07-22 | 1983-07-22 | Method of producing chip resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58134634A JPS6027104A (en) | 1983-07-22 | 1983-07-22 | Method of producing chip resistor |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1326853A Division JPH02191304A (en) | 1989-12-16 | 1989-12-16 | Manufacture of chip resistor |
| JP3198379A Division JPH0618121B2 (en) | 1991-07-12 | 1991-07-12 | Chip resistor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6027104A JPS6027104A (en) | 1985-02-12 |
| JPS644325B2 true JPS644325B2 (en) | 1989-01-25 |
Family
ID=15132954
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58134634A Granted JPS6027104A (en) | 1983-07-22 | 1983-07-22 | Method of producing chip resistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6027104A (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2517952B2 (en) * | 1987-03-28 | 1996-07-24 | ソニー株式会社 | Method of manufacturing printed resistance board |
| JPH0770365B2 (en) * | 1987-12-10 | 1995-07-31 | ローム株式会社 | Chip type electronic parts |
| JP2737893B2 (en) * | 1995-04-10 | 1998-04-08 | ローム 株式会社 | Chip resistor |
| JPH09171905A (en) * | 1996-10-04 | 1997-06-30 | Rohm Co Ltd | Chip resistor |
| GB2320620B (en) * | 1996-12-20 | 2001-06-27 | Rohm Co Ltd | Chip type resistor and manufacturing method thereof |
| JP3756612B2 (en) * | 1997-03-18 | 2006-03-15 | ローム株式会社 | Structure of chip resistor and manufacturing method thereof |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52128912A (en) * | 1976-04-23 | 1977-10-28 | Nippon Glass | Method of manufacturing green glass |
| JPS54132758A (en) * | 1978-04-07 | 1979-10-16 | Hitachi Ltd | Method of producing resistance element |
| JPS55120123A (en) * | 1979-03-09 | 1980-09-16 | Hitachi Ltd | Method of trimming thick film capacitor |
| JPS55135694A (en) * | 1979-04-12 | 1980-10-22 | Nec Corp | Laser beam recording method of image |
| JPS56129357A (en) * | 1980-03-14 | 1981-10-09 | Fujitsu Ltd | Laser trimming |
| JPS5771160A (en) * | 1980-10-22 | 1982-05-01 | Sony Corp | Manufacture of thick film printed circuit substrate |
| JPS58101A (en) * | 1981-06-25 | 1983-01-05 | 三洋電機株式会社 | Method of trimming thick film resistor |
| JPS589139A (en) * | 1981-07-10 | 1983-01-19 | Fujitsu Ltd | Resist film |
| JPS598302A (en) * | 1982-07-06 | 1984-01-17 | 松下電器産業株式会社 | Method of producing square chip resistor |
-
1983
- 1983-07-22 JP JP58134634A patent/JPS6027104A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6027104A (en) | 1985-02-12 |
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