JPS6445194A - Electronic equipment - Google Patents

Electronic equipment

Info

Publication number
JPS6445194A
JPS6445194A JP20079087A JP20079087A JPS6445194A JP S6445194 A JPS6445194 A JP S6445194A JP 20079087 A JP20079087 A JP 20079087A JP 20079087 A JP20079087 A JP 20079087A JP S6445194 A JPS6445194 A JP S6445194A
Authority
JP
Japan
Prior art keywords
conductor pattern
pattern sections
compensation member
sections
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP20079087A
Other languages
Japanese (ja)
Other versions
JPH044759B2 (en
Inventor
Seiji Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nihon Inter Electronics Corp
Original Assignee
Nihon Inter Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Inter Electronics Corp filed Critical Nihon Inter Electronics Corp
Priority to JP20079087A priority Critical patent/JPS6445194A/en
Publication of JPS6445194A publication Critical patent/JPS6445194A/en
Publication of JPH044759B2 publication Critical patent/JPH044759B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

PURPOSE:To improve the reliability by laminating a compensation member such an insulating tape or an insulating sheet to one surface of the conductor patterns of a circuit substrate so as to span the conductor patterns, and performing a powder molding, thereby eliminating appearance defects. CONSTITUTION:A lead frame connecting section 20 and conductor pattern sections 22 for mounting electronic parts extending from the connecting section 20 through lead sections 21 are formed, and to a predetermined part of one surface of the conductor pattern sections 22, a compensation member 24 such as an insulating tape or insulating sheet is laminated so as to span the gap between the conductor pattern sections 22, 22. After the lamination of the compensation member 24, the circuit substrate is heated to a predetermined temperature and inserted into a powdered resin, and this is repeated several times to perform the powder molding of the conductor pattern sections 22 and the electronic parts 22. Since the compensation member 24 is interposing in the gap 23 between the conductor pattern sections 22, 22 as described above, a recess or cavity part is prevented from being formed.
JP20079087A 1987-08-13 1987-08-13 Electronic equipment Granted JPS6445194A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20079087A JPS6445194A (en) 1987-08-13 1987-08-13 Electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20079087A JPS6445194A (en) 1987-08-13 1987-08-13 Electronic equipment

Publications (2)

Publication Number Publication Date
JPS6445194A true JPS6445194A (en) 1989-02-17
JPH044759B2 JPH044759B2 (en) 1992-01-29

Family

ID=16430234

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20079087A Granted JPS6445194A (en) 1987-08-13 1987-08-13 Electronic equipment

Country Status (1)

Country Link
JP (1) JPS6445194A (en)

Also Published As

Publication number Publication date
JPH044759B2 (en) 1992-01-29

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