JPS6447020A - Heat treatment device for manufacturing semiconductor - Google Patents

Heat treatment device for manufacturing semiconductor

Info

Publication number
JPS6447020A
JPS6447020A JP20349987A JP20349987A JPS6447020A JP S6447020 A JPS6447020 A JP S6447020A JP 20349987 A JP20349987 A JP 20349987A JP 20349987 A JP20349987 A JP 20349987A JP S6447020 A JPS6447020 A JP S6447020A
Authority
JP
Japan
Prior art keywords
heat retaining
cylinders
frame body
sealed
cylinder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP20349987A
Other languages
Japanese (ja)
Other versions
JPH063795B2 (en
Inventor
Hiroshi Kimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Quartz Products Co Ltd
Original Assignee
Shin Etsu Quartz Products Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Quartz Products Co Ltd filed Critical Shin Etsu Quartz Products Co Ltd
Priority to JP62203499A priority Critical patent/JPH063795B2/en
Publication of JPS6447020A publication Critical patent/JPS6447020A/en
Publication of JPH063795B2 publication Critical patent/JPH063795B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PURPOSE:To keep breakdown strength high enough for bearing a larger diameter structure by a method wherein a heat retaining cylinder is formed of an assembly of a plurality of small diameter cylinders sealed with heat retaining material while the group of small cylinders are arranged in alignment with the space between heated region and non-heated region through the intermediary of a cylinder group containing frame body. CONSTITUTION:A heat retaining cylinder 5 formed of quartz glass material is composed of small diameter cylinders 10 sealed with heat retaining material 10a and a frame body unit 20 containing the cylinders 10 which are filled with quartz glass wool 10a to keep the inside thereof in vacuum state. The frame body unit 20 is composed of a unit main body connecting an upper sheet 22 to a bottom side member 23 through the intermediary of a central cylindrical tubes 21 and a cylindrical wall 24 enclosing the outer periphery of the unit main body. The multiple cylinders 10 are mounted on the discs positioned inside and around the cylindrical tube 21 and then the cylindrical wall 24 is inserted in a ring manner into the multiple cylinders 10 from the heat retaining cylinder 5. In such a constitution, the multiple cylinders 10 sealed with the heat retaining material 10a are evenly arranged in the frame body unit 20 so that the furnace tube 2 heating region A positioned above the heat retaining cylinder 5 may evenly retain the heat in the region A.
JP62203499A 1987-08-18 1987-08-18 Heat treatment equipment for semiconductor manufacturing Expired - Fee Related JPH063795B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62203499A JPH063795B2 (en) 1987-08-18 1987-08-18 Heat treatment equipment for semiconductor manufacturing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62203499A JPH063795B2 (en) 1987-08-18 1987-08-18 Heat treatment equipment for semiconductor manufacturing

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP19519393A Division JPH0773103B2 (en) 1993-07-12 1993-07-12 Semiconductor heat treatment structure

Publications (2)

Publication Number Publication Date
JPS6447020A true JPS6447020A (en) 1989-02-21
JPH063795B2 JPH063795B2 (en) 1994-01-12

Family

ID=16475169

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62203499A Expired - Fee Related JPH063795B2 (en) 1987-08-18 1987-08-18 Heat treatment equipment for semiconductor manufacturing

Country Status (1)

Country Link
JP (1) JPH063795B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0382016A (en) * 1989-08-24 1991-04-08 Tokyo Electron Sagami Ltd Vertical type vapor growth device
JPH1053498A (en) * 1996-08-07 1998-02-24 Yamagata Shinetsu Sekiei:Kk Semiconductor wafer reaction vessel and heat treatment apparatus using the vessel
JP2016084879A (en) * 2014-10-27 2016-05-19 東京エレクトロン株式会社 Thermal insulation member and heat treatment apparatus using the same
CN110729981A (en) * 2019-11-11 2020-01-24 四川省三台水晶电子有限公司 Preparation method of quartz wafer based on filter

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61110425A (en) * 1984-11-05 1986-05-28 Wakomu:Kk Jig for semiconductor diffusion furnace
JPS61100141U (en) * 1984-12-07 1986-06-26

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61110425A (en) * 1984-11-05 1986-05-28 Wakomu:Kk Jig for semiconductor diffusion furnace
JPS61100141U (en) * 1984-12-07 1986-06-26

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0382016A (en) * 1989-08-24 1991-04-08 Tokyo Electron Sagami Ltd Vertical type vapor growth device
JPH1053498A (en) * 1996-08-07 1998-02-24 Yamagata Shinetsu Sekiei:Kk Semiconductor wafer reaction vessel and heat treatment apparatus using the vessel
JP2016084879A (en) * 2014-10-27 2016-05-19 東京エレクトロン株式会社 Thermal insulation member and heat treatment apparatus using the same
CN110729981A (en) * 2019-11-11 2020-01-24 四川省三台水晶电子有限公司 Preparation method of quartz wafer based on filter
CN110729981B (en) * 2019-11-11 2023-03-14 四川省三台水晶电子有限公司 Preparation method of quartz wafer based on filter

Also Published As

Publication number Publication date
JPH063795B2 (en) 1994-01-12

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