JPS6454064A - Heat-resistant resin composition - Google Patents
Heat-resistant resin compositionInfo
- Publication number
- JPS6454064A JPS6454064A JP21116587A JP21116587A JPS6454064A JP S6454064 A JPS6454064 A JP S6454064A JP 21116587 A JP21116587 A JP 21116587A JP 21116587 A JP21116587 A JP 21116587A JP S6454064 A JPS6454064 A JP S6454064A
- Authority
- JP
- Japan
- Prior art keywords
- diamine
- aromatic group
- solution
- formula
- acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920006015 heat resistant resin Polymers 0.000 title 1
- 239000011342 resin composition Substances 0.000 title 1
- 125000003118 aryl group Chemical group 0.000 abstract 3
- 239000004962 Polyamide-imide Substances 0.000 abstract 2
- 239000002253 acid Substances 0.000 abstract 2
- 150000004985 diamines Chemical class 0.000 abstract 2
- 239000000203 mixture Substances 0.000 abstract 2
- 239000003960 organic solvent Substances 0.000 abstract 2
- 229920003192 poly(bis maleimide) Polymers 0.000 abstract 2
- 229920002312 polyamide-imide Polymers 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
- 239000011347 resin Substances 0.000 abstract 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 abstract 1
- NGNBDVOYPDDBFK-UHFFFAOYSA-N 2-[2,4-di(pentan-2-yl)phenoxy]acetyl chloride Chemical compound CCCC(C)C1=CC=C(OCC(Cl)=O)C(C(C)CCC)=C1 NGNBDVOYPDDBFK-UHFFFAOYSA-N 0.000 abstract 1
- 239000004135 Bone phosphate Substances 0.000 abstract 1
- 150000008065 acid anhydrides Chemical class 0.000 abstract 1
- 238000007259 addition reaction Methods 0.000 abstract 1
- 125000000962 organic group Chemical group 0.000 abstract 1
- 239000007787 solid Substances 0.000 abstract 1
- 239000002904 solvent Substances 0.000 abstract 1
- -1 tetracarboxylic acid dianhydride Chemical class 0.000 abstract 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
PURPOSE:To obtain the title composition having excellent solubility in a solvent and heat resistance, by dissolving a specified polyamide-imide resin in an organic solvent and dissolving an N,N'-bismaleimide and a diamine-terminated amic acid in this solution. CONSTITUTION:A polyamide-imide resin (A) of formula I (wherein R<1> is a 6-20C trivalent aromatic group; R<2> is a 6-20C divalent aromatic group), prepared from a diamine and an acid chloride of a tribasic acid anhydride is dissolved in an organic solvent to give a solution. An N,N'-bismaleimide (B) of formula II (wherein R<3> is a 2-20C divalent organic group) (e.g., N,N'-4,4'- diphenylmethanebismaleimide) is mixed with a diamine-terminated amic acid (C) of formula III (wherein R<4> is R<3> and R<5> is a 6-20C tetravalent aromatic group) obtained by addition reaction of a tetracarboxylic acid dianhydride with a diamine, the molar ratio of component B to component C being 1-3:1. This mixture is dissolved in the above-mentioned solution so as to provide a weight ratio, on a solid basis, of A to B + C of 0.5-10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21116587A JPS6454064A (en) | 1987-08-25 | 1987-08-25 | Heat-resistant resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21116587A JPS6454064A (en) | 1987-08-25 | 1987-08-25 | Heat-resistant resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6454064A true JPS6454064A (en) | 1989-03-01 |
Family
ID=16601479
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21116587A Pending JPS6454064A (en) | 1987-08-25 | 1987-08-25 | Heat-resistant resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6454064A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05310931A (en) * | 1991-12-24 | 1993-11-22 | Matsushita Electric Works Ltd | Thermosetting polyimide resin composition, thermoset product and its production |
| US20150344731A1 (en) * | 2014-06-03 | 2015-12-03 | Tech Advance Industrial Co., Ltd. | Resin composition and uses of the same |
-
1987
- 1987-08-25 JP JP21116587A patent/JPS6454064A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05310931A (en) * | 1991-12-24 | 1993-11-22 | Matsushita Electric Works Ltd | Thermosetting polyimide resin composition, thermoset product and its production |
| US20150344731A1 (en) * | 2014-06-03 | 2015-12-03 | Tech Advance Industrial Co., Ltd. | Resin composition and uses of the same |
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