JPS645887Y2 - - Google Patents

Info

Publication number
JPS645887Y2
JPS645887Y2 JP1982085369U JP8536982U JPS645887Y2 JP S645887 Y2 JPS645887 Y2 JP S645887Y2 JP 1982085369 U JP1982085369 U JP 1982085369U JP 8536982 U JP8536982 U JP 8536982U JP S645887 Y2 JPS645887 Y2 JP S645887Y2
Authority
JP
Japan
Prior art keywords
semiconductor
semiconductor chip
present
electrode metal
built
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1982085369U
Other languages
English (en)
Japanese (ja)
Other versions
JPS58191638U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1982085369U priority Critical patent/JPS58191638U/ja
Publication of JPS58191638U publication Critical patent/JPS58191638U/ja
Application granted granted Critical
Publication of JPS645887Y2 publication Critical patent/JPS645887Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Wire Bonding (AREA)
JP1982085369U 1982-06-10 1982-06-10 半導体ペレツト Granted JPS58191638U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982085369U JPS58191638U (ja) 1982-06-10 1982-06-10 半導体ペレツト

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982085369U JPS58191638U (ja) 1982-06-10 1982-06-10 半導体ペレツト

Publications (2)

Publication Number Publication Date
JPS58191638U JPS58191638U (ja) 1983-12-20
JPS645887Y2 true JPS645887Y2 (2) 1989-02-14

Family

ID=30094246

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982085369U Granted JPS58191638U (ja) 1982-06-10 1982-06-10 半導体ペレツト

Country Status (1)

Country Link
JP (1) JPS58191638U (2)

Also Published As

Publication number Publication date
JPS58191638U (ja) 1983-12-20

Similar Documents

Publication Publication Date Title
US7129116B2 (en) Partially patterned lead frames and methods of making and using the same in semiconductor packaging
US6777265B2 (en) Partially patterned lead frames and methods of making and using the same in semiconductor packaging
US7781264B2 (en) Method for fabricating flip-chip semiconductor package with lead frame as chip carrier
JP2522524B2 (ja) 半導体装置の製造方法
EP1500130A1 (en) Partially patterned lead frames and methods of making and using the same in semiconductor packaging
JPH05226564A (ja) 半導体装置
JP2653179B2 (ja) 集積回路装置用バンプ電極の製造方法
JP2001015668A (ja) 樹脂封止型半導体パッケージ
JP2000243887A (ja) 半導体装置とその製造方法
US6153921A (en) Diode device
JPS645887Y2 (2)
TW419756B (en) Process for producing BGA type semiconductor device, TAB tape for BGA type semiconductor device, and BGA type semiconductor device
JPS63124434A (ja) 半導体装置の製造方法
JP2000243880A (ja) 半導体装置とその製造方法
JPH08148623A (ja) 半導体装置
USRE38043E1 (en) Lead frame
KR950006837Y1 (ko) 아웃리드 표면 노출형 반도체 패키지
JPS624364A (ja) シヨツトキ−バリアダイオ−ド
JPS61128548A (ja) 半導体装置
JP2025130666A (ja) 半導体装置
JPH06188285A (ja) 半導体装置
JPH11307483A (ja) 半導体装置の製法および半導体装置
JPH05206216A (ja) テープキャリア、半導体装置実装体及び実装方法
JPS6190452A (ja) 半導体装置用リ−ドフレ−ム
JPS622626A (ja) 半導体装置