JPS64794A - Multilayer interconnection board - Google Patents

Multilayer interconnection board

Info

Publication number
JPS64794A
JPS64794A JP3036488A JP3036488A JPS64794A JP S64794 A JPS64794 A JP S64794A JP 3036488 A JP3036488 A JP 3036488A JP 3036488 A JP3036488 A JP 3036488A JP S64794 A JPS64794 A JP S64794A
Authority
JP
Japan
Prior art keywords
electric source
board
layers
interconnection
ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3036488A
Other languages
English (en)
Other versions
JPH01794A (ja
JP2611304B2 (ja
Inventor
Jun Inasaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP63030364A priority Critical patent/JP2611304B2/ja
Publication of JPH01794A publication Critical patent/JPH01794A/ja
Publication of JPS64794A publication Critical patent/JPS64794A/ja
Application granted granted Critical
Publication of JP2611304B2 publication Critical patent/JP2611304B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP63030364A 1987-02-26 1988-02-12 多層配線基板 Expired - Lifetime JP2611304B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63030364A JP2611304B2 (ja) 1987-02-26 1988-02-12 多層配線基板

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP4154587 1987-02-26
JP62-41545 1987-02-26
JP63030364A JP2611304B2 (ja) 1987-02-26 1988-02-12 多層配線基板

Publications (3)

Publication Number Publication Date
JPH01794A JPH01794A (ja) 1989-01-05
JPS64794A true JPS64794A (en) 1989-01-05
JP2611304B2 JP2611304B2 (ja) 1997-05-21

Family

ID=26368696

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63030364A Expired - Lifetime JP2611304B2 (ja) 1987-02-26 1988-02-12 多層配線基板

Country Status (1)

Country Link
JP (1) JP2611304B2 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0417951U (ja) * 1990-06-01 1992-02-14
JPH0613533A (ja) * 1992-06-24 1994-01-21 Toshiba Corp マルチチップモジュール
JP2009158761A (ja) * 2007-12-27 2009-07-16 Ngk Spark Plug Co Ltd 電子部品検査装置用配線基板

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59500032A (ja) * 1982-01-13 1984-01-05 エルクシイ バックプレーンパワ接続システム及びそのシステムを製造する方法
JPS63284898A (ja) * 1987-05-15 1988-11-22 Ibiden Co Ltd 表面実装部品用シ−ルドパッケ−ジ

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59500032A (ja) * 1982-01-13 1984-01-05 エルクシイ バックプレーンパワ接続システム及びそのシステムを製造する方法
JPS63284898A (ja) * 1987-05-15 1988-11-22 Ibiden Co Ltd 表面実装部品用シ−ルドパッケ−ジ

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0417951U (ja) * 1990-06-01 1992-02-14
JPH0613533A (ja) * 1992-06-24 1994-01-21 Toshiba Corp マルチチップモジュール
JP2009158761A (ja) * 2007-12-27 2009-07-16 Ngk Spark Plug Co Ltd 電子部品検査装置用配線基板

Also Published As

Publication number Publication date
JP2611304B2 (ja) 1997-05-21

Similar Documents

Publication Publication Date Title
TW370764B (en) Method for producing an apparatus that includes a print circuit board
DE59400691D1 (de) Widerstand in SMD-Bauweise und Verfahren zu seiner Herstellung
AU569186B2 (en) High density multilayer printed circuit board
EP0243507A4 (en) FLEXIBLE LAMINATE FOR BOARD FOR PRINTED CIRCUITS AND METHOD FOR THE PRODUCTION THEREOF.
AU501204B2 (en) Multilayer printed circuit boards
CA2073911A1 (en) Stepped multilayer interconnection apparatus and method of making the same
EP0147014A3 (en) Multilayer printed circuit board structure
TW236070B (ja)
KR900004722B1 (en) Hybrid intergrated circuit
EP0245770A3 (en) Multilayer ceramic substrate with circuit patterns
DE3280409D1 (de) Mehrschichtige gedruckte leiterplatte und verfahren zu ihrer herstellung.
MY118245A (en) Multilayer printed circuit boards
EP0157261A3 (en) Printed circuit board laminating apparatus
CA2073211A1 (en) Method of manufacturing a rigid-flex printed wiring board
IE46109L (en) Printed circuit board
EP0169530A3 (en) Multilayer printed circuit board
JPS56153797A (en) Method of manufacturing multilayer printed circuit board substrate
DE69026341D1 (de) Verfahren zur Herstellung von Mehrschichtleiterplatten
IT1184408B (it) Processo per la fabbricazione di piastre e circuiti stampati,e prodotti relativi
EP0335679A3 (en) Bonded ceramic-metal composite substrate, circuit board constructed therewith and methods for production thereof
MY116494A (en) Copper foils and high-density multilayer printed circuit board using the copper foils for inner-layer circuit
JPS64794A (en) Multilayer interconnection board
AU1566076A (en) Multilayer printed circuit board
AU5193786A (en) Multi-layer substrate for printed circuit
GR872040B (en) Methods for removing stringers appearing in plated through holes in copper containing multi layer printed wiring boards

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term