JPS6484784A - Printed wiring board and manufacture thereof - Google Patents
Printed wiring board and manufacture thereofInfo
- Publication number
- JPS6484784A JPS6484784A JP24325187A JP24325187A JPS6484784A JP S6484784 A JPS6484784 A JP S6484784A JP 24325187 A JP24325187 A JP 24325187A JP 24325187 A JP24325187 A JP 24325187A JP S6484784 A JPS6484784 A JP S6484784A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- plated layer
- fiber
- composite plated
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000002131 composite material Substances 0.000 abstract 5
- 239000000835 fiber Substances 0.000 abstract 4
- 239000004020 conductor Substances 0.000 abstract 3
- 239000010419 fine particle Substances 0.000 abstract 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 abstract 2
- 238000005530 etching Methods 0.000 abstract 2
- 239000007788 liquid Substances 0.000 abstract 2
- 229910052751 metal Inorganic materials 0.000 abstract 2
- 239000002184 metal Substances 0.000 abstract 2
- 239000000126 substance Substances 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 229910052763 palladium Inorganic materials 0.000 abstract 1
- 238000007747 plating Methods 0.000 abstract 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
PURPOSE:To prevent a drop in a contact bonding force between a conductor and an insulating layer by a method wherein a composite plated layer composed of a metal, at least one kind of fine particles or a metal and at least one kind of fiber is formed on a base material, and is roughened by an etching operation and, after that, the insulating layer is formed. CONSTITUTION:An insulating sheet 1 is activated after palladium has been given; a resist plated layer 7 is formed in a part excluding a part where a conductor is to be formed; after that, this assembly is immersed in a chemical plating liquid containing at least one kind of fine particles and a fiber 4 and is precipitated; a composite plated layer 3 containing at least the fine particles or the fiber is formed. Then, this layer is treated with a chemical liquid used to etch at least the fine articles or the fiber; the surface of the composite plated layer is roughened; an insulating layer is formed in a desired part; a printed wiring board is completed. A conductor layer of the printed wiring board manufactured in this manner is composed of only the composite plated layer whose interface with the insulating layer has been roughened by an etching operation; the circuit board becomes conductive through the composite plated layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24325187A JPS6484784A (en) | 1987-09-28 | 1987-09-28 | Printed wiring board and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24325187A JPS6484784A (en) | 1987-09-28 | 1987-09-28 | Printed wiring board and manufacture thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6484784A true JPS6484784A (en) | 1989-03-30 |
| JPH0480556B2 JPH0480556B2 (en) | 1992-12-18 |
Family
ID=17101090
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24325187A Granted JPS6484784A (en) | 1987-09-28 | 1987-09-28 | Printed wiring board and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6484784A (en) |
-
1987
- 1987-09-28 JP JP24325187A patent/JPS6484784A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0480556B2 (en) | 1992-12-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term | ||
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 15 Free format text: PAYMENT UNTIL: 20071218 |