JPS6489501A - Chiplike resin-covered electronic component - Google Patents

Chiplike resin-covered electronic component

Info

Publication number
JPS6489501A
JPS6489501A JP62248320A JP24832087A JPS6489501A JP S6489501 A JPS6489501 A JP S6489501A JP 62248320 A JP62248320 A JP 62248320A JP 24832087 A JP24832087 A JP 24832087A JP S6489501 A JPS6489501 A JP S6489501A
Authority
JP
Japan
Prior art keywords
resin
resin body
chiplike
electronic component
covered electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62248320A
Other languages
Japanese (ja)
Inventor
Hideaki Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP62248320A priority Critical patent/JPS6489501A/en
Publication of JPS6489501A publication Critical patent/JPS6489501A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Details Of Resistors (AREA)

Abstract

PURPOSE:To prevent deterioration of electric properties by coating the upper surface of an outer covering resin body with a metal foil. CONSTITUTION:The circumference of a portion of an electrode lead 2 which comes out from a device 4 is press-formed together with the device 4 by using insulating resin for armoring. Then the remaining electrode lead 2 which exposes from the insulating resin body 3 is bended along the resin body 3 to form a chiplike resin-covered electronic component. The upper surface of the resin body 3 is coated with a metal foil 1. Therefore, it is possible to reduce absorption of heat from the resin body 3 at reflow of near or far infrared radiation at packaging to a circuit substrate and to prevent deterioration of electric properties.
JP62248320A 1987-09-30 1987-09-30 Chiplike resin-covered electronic component Pending JPS6489501A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62248320A JPS6489501A (en) 1987-09-30 1987-09-30 Chiplike resin-covered electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62248320A JPS6489501A (en) 1987-09-30 1987-09-30 Chiplike resin-covered electronic component

Publications (1)

Publication Number Publication Date
JPS6489501A true JPS6489501A (en) 1989-04-04

Family

ID=17176327

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62248320A Pending JPS6489501A (en) 1987-09-30 1987-09-30 Chiplike resin-covered electronic component

Country Status (1)

Country Link
JP (1) JPS6489501A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5420745A (en) * 1991-09-30 1995-05-30 Matsushita Electric Industrial Co., Ltd. Surface-mount type ceramic capacitor
EP0750325A1 (en) * 1995-06-21 1996-12-27 Illinois Tool Works Inc. Infrared shielded capacitor
JP2014138083A (en) * 2013-01-17 2014-07-28 Panasonic Corp Film capacitor

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5420745A (en) * 1991-09-30 1995-05-30 Matsushita Electric Industrial Co., Ltd. Surface-mount type ceramic capacitor
EP0750325A1 (en) * 1995-06-21 1996-12-27 Illinois Tool Works Inc. Infrared shielded capacitor
AU695731B2 (en) * 1995-06-21 1998-08-20 Illinois Tool Works Inc. Infrared shield for capacitors
CN100390909C (en) * 1995-06-21 2008-05-28 伊利诺斯工具制造公司 Infrared shielding for capacitors
JP2014138083A (en) * 2013-01-17 2014-07-28 Panasonic Corp Film capacitor

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