KR20200098556A - 연마 패드 - Google Patents
연마 패드 Download PDFInfo
- Publication number
- KR20200098556A KR20200098556A KR1020207018708A KR20207018708A KR20200098556A KR 20200098556 A KR20200098556 A KR 20200098556A KR 1020207018708 A KR1020207018708 A KR 1020207018708A KR 20207018708 A KR20207018708 A KR 20207018708A KR 20200098556 A KR20200098556 A KR 20200098556A
- Authority
- KR
- South Korea
- Prior art keywords
- polyurethane resin
- polishing pad
- resin foam
- polishing
- polished
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/48—Polyethers
- C08G18/4825—Polyethers containing two hydroxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/16—Catalysts
- C08G18/18—Catalysts containing secondary or tertiary amines or salts thereof
- C08G18/20—Heterocyclic amines; Salts thereof
- C08G18/2045—Heterocyclic amines; Salts thereof containing condensed heterocyclic rings
- C08G18/2063—Heterocyclic amines; Salts thereof containing condensed heterocyclic rings having two nitrogen atoms in the condensed ring system
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/48—Polyethers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/48—Polyethers
- C08G18/4854—Polyethers containing oxyalkylene groups having four carbon atoms in the alkylene group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
- C08G18/76—Polyisocyanates or polyisothiocyanates cyclic aromatic
- C08G18/7614—Polyisocyanates or polyisothiocyanates cyclic aromatic containing only one aromatic ring
- C08G18/7621—Polyisocyanates or polyisothiocyanates cyclic aromatic containing only one aromatic ring being toluene diisocyanate including isomer mixtures
-
- H01L21/67092—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Polyurethanes Or Polyureas (AREA)
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
Description
[도 2] 실시예 및 비교예의 연마 패드를 사용하여 피연마물을 연마했을 때의 피연마물에 있어서의 결함의 수를 나타내는 도면이다.
[도 3] 실시예 및 비교예의 연마 패드를 사용하여 피연마물을 연마했을 때의 피연마물에 있어서의 헤이즈 레벨을 나타내는 도면이다.
Claims (7)
- 폴리우레탄 수지 발포체를 포함하는 연마 패드로서,
연마면을 가지고,
상기 연마면이, 상기 폴리우레탄 수지 발포체의 표면으로 구성되며,
상기 폴리우레탄 수지 발포체는, 30℃에서의 tanδ가 0.10∼0.50이고, 기포 직경의 평균값이 50∼120㎛인, 연마 패드. - 제1항에 있어서,
상기 폴리우레탄 수지 발포체는, 기포 직경의 표준 편차가 10∼55㎛인, 연마 패드. - 제1항 또는 제2항에 있어서,
상기 폴리우레탄 수지 발포체에서는, 기포가, 상기 연마면에 수직한 단면(斷面)에 있어서 원형상으로 되어 있는, 연마 패드. - 제1항 내지 제3항 중 어느 한 항에 있어서,
상기 폴리우레탄 수지 발포체는, 겉보기 밀도가 0.4∼0.6g/㎤인, 연마 패드. - 제1항 내지 제4항 중 어느 한 항에 있어서,
상기 폴리우레탄 수지 발포체는, 45℃에서의 저장 탄성률 E'이 0.5×107∼5.0×107Pa인, 연마 패드. - 제1항 내지 제5항 중 어느 한 항에 있어서,
상기 폴리우레탄 수지 발포체는, 65℃에서의 저장 탄성률 E'이 0.5×107∼5.0×107Pa인, 연마 패드. - 제1항 내지 제6항 중 어느 한 항에 있어서,
상기 폴리우레탄 수지 발포체가, 폴리우레탄 수지를 함유하고,
상기 폴리우레탄 수지가, 폴리프로필렌글리콜을 구성 단위로서 포함하는, 연마 패드.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017252429 | 2017-12-27 | ||
| JPJP-P-2017-252429 | 2017-12-27 | ||
| PCT/JP2018/048164 WO2019131886A1 (ja) | 2017-12-27 | 2018-12-27 | 研磨パッド |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20200098556A true KR20200098556A (ko) | 2020-08-20 |
| KR102625059B1 KR102625059B1 (ko) | 2024-01-12 |
Family
ID=67067569
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020207018708A Active KR102625059B1 (ko) | 2017-12-27 | 2018-12-27 | 연마 패드 |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JP7292215B2 (ko) |
| KR (1) | KR102625059B1 (ko) |
| CN (1) | CN111542416B (ko) |
| DE (1) | DE112018006718T5 (ko) |
| TW (1) | TWI815843B (ko) |
| WO (1) | WO2019131886A1 (ko) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7759179B2 (ja) * | 2020-09-30 | 2025-10-23 | 富士紡ホールディングス株式会社 | 研磨パッド |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005120253A (ja) * | 2003-10-17 | 2005-05-12 | Toray Ind Inc | 発泡ポリウレタンおよびその製造方法 |
| JP2007250166A (ja) | 2006-02-14 | 2007-09-27 | Hoya Corp | 磁気ディスク用ガラス基板の製造方法 |
| JP2010082708A (ja) * | 2008-09-29 | 2010-04-15 | Fujibo Holdings Inc | 研磨パッド |
| JP2012223835A (ja) * | 2011-04-15 | 2012-11-15 | Fujibo Holdings Inc | 研磨パッド及びその製造方法 |
| WO2017066077A1 (en) * | 2015-10-16 | 2017-04-20 | Applied Materials, Inc. | Method and apparatus for forming advanced polishing pads using an additive manufacturing process |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3677526D1 (de) * | 1985-11-12 | 1991-03-21 | Asahi Chemical Ind | Schaumfaehige fluor enthaltende polymerzusammensetzungen und die so erhaltenen fluorschaeume. |
| US6764574B1 (en) * | 2001-03-06 | 2004-07-20 | Psiloquest | Polishing pad composition and method of use |
| KR101290490B1 (ko) * | 2005-09-22 | 2013-07-26 | 가부시키가이샤 구라레 | 고분자 재료, 그것으로부터 얻어지는 발포체 및 이들을사용한 연마 패드 |
| WO2008123085A1 (ja) * | 2007-03-20 | 2008-10-16 | Kuraray Co., Ltd. | 研磨パッド用クッションおよびそれを用いた研磨パッド |
| JP5484145B2 (ja) * | 2010-03-24 | 2014-05-07 | 東洋ゴム工業株式会社 | 研磨パッド |
| JP5945874B2 (ja) * | 2011-10-18 | 2016-07-05 | 富士紡ホールディングス株式会社 | 研磨パッド及びその製造方法 |
| JP5959390B2 (ja) * | 2012-09-26 | 2016-08-02 | 富士紡ホールディングス株式会社 | 研磨パッド用シート、研磨パッド及びその製造方法、並びに研磨方法 |
| JP6386832B2 (ja) * | 2013-08-26 | 2018-09-05 | 日東電工株式会社 | 発泡シート |
| JP5676798B1 (ja) * | 2013-08-26 | 2015-02-25 | 日東電工株式会社 | 発泡シート |
| JP6311183B2 (ja) * | 2014-03-31 | 2018-04-18 | 富士紡ホールディングス株式会社 | 研磨パッド及びその製造方法 |
| JP6539910B2 (ja) * | 2015-04-03 | 2019-07-10 | 富士紡ホールディングス株式会社 | 研磨パッド及びその製造方法 |
| JP6600149B2 (ja) * | 2015-04-03 | 2019-10-30 | 富士紡ホールディングス株式会社 | 研磨パッド及びその製造方法 |
-
2018
- 2018-12-27 WO PCT/JP2018/048164 patent/WO2019131886A1/ja not_active Ceased
- 2018-12-27 TW TW107147459A patent/TWI815843B/zh active
- 2018-12-27 DE DE112018006718.1T patent/DE112018006718T5/de active Pending
- 2018-12-27 KR KR1020207018708A patent/KR102625059B1/ko active Active
- 2018-12-27 JP JP2019562170A patent/JP7292215B2/ja active Active
- 2018-12-27 CN CN201880083681.9A patent/CN111542416B/zh active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005120253A (ja) * | 2003-10-17 | 2005-05-12 | Toray Ind Inc | 発泡ポリウレタンおよびその製造方法 |
| JP2007250166A (ja) | 2006-02-14 | 2007-09-27 | Hoya Corp | 磁気ディスク用ガラス基板の製造方法 |
| JP2010082708A (ja) * | 2008-09-29 | 2010-04-15 | Fujibo Holdings Inc | 研磨パッド |
| JP2012223835A (ja) * | 2011-04-15 | 2012-11-15 | Fujibo Holdings Inc | 研磨パッド及びその製造方法 |
| CN103563056A (zh) * | 2011-04-15 | 2014-02-05 | 富士纺控股株式会社 | 研磨垫及其制造方法 |
| KR20140025453A (ko) * | 2011-04-15 | 2014-03-04 | 후지보홀딩스가부시끼가이샤 | 연마 패드 및 그의 제조 방법 |
| WO2017066077A1 (en) * | 2015-10-16 | 2017-04-20 | Applied Materials, Inc. | Method and apparatus for forming advanced polishing pads using an additive manufacturing process |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2019131886A1 (ja) | 2021-01-07 |
| WO2019131886A1 (ja) | 2019-07-04 |
| CN111542416A (zh) | 2020-08-14 |
| CN111542416B (zh) | 2022-10-21 |
| TWI815843B (zh) | 2023-09-21 |
| WO2019131886A9 (ja) | 2020-07-23 |
| TW201940561A (zh) | 2019-10-16 |
| DE112018006718T5 (de) | 2020-09-10 |
| KR102625059B1 (ko) | 2024-01-12 |
| JP7292215B2 (ja) | 2023-06-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102692425B1 (ko) | 연마 패드 | |
| JP7273509B2 (ja) | 研磨パッド | |
| TWI722108B (zh) | 研磨墊及研磨墊之製造方法 | |
| KR102625059B1 (ko) | 연마 패드 | |
| JP6685805B2 (ja) | 研磨パッド | |
| CN113211303B (zh) | 研磨垫 | |
| JP6983001B2 (ja) | 研磨パッド | |
| JP7198662B2 (ja) | 研磨パッド | |
| KR102449663B1 (ko) | 연마 패드 | |
| JP6941712B1 (ja) | 研磨パッド | |
| JP7576396B2 (ja) | 研磨パッド | |
| JP7099827B2 (ja) | 研磨パッド | |
| JP7608146B2 (ja) | 研磨パッド | |
| JP2026036469A (ja) | 研磨パッド | |
| JP2021109277A (ja) | 研磨パッド |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| A201 | Request for examination | ||
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U12-oth-PR1002 Fee payment year number: 1 |
|
| PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |
