KR960000734A - 다중 기판 전달 장치 - Google Patents

다중 기판 전달 장치 Download PDF

Info

Publication number
KR960000734A
KR960000734A KR1019940014496A KR19940014496A KR960000734A KR 960000734 A KR960000734 A KR 960000734A KR 1019940014496 A KR1019940014496 A KR 1019940014496A KR 19940014496 A KR19940014496 A KR 19940014496A KR 960000734 A KR960000734 A KR 960000734A
Authority
KR
South Korea
Prior art keywords
substrate
substrate transfer
guide
roller
rotor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
KR1019940014496A
Other languages
English (en)
Other versions
KR0129582B1 (ko
Inventor
조경수
Original Assignee
김주용
현대전자산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김주용, 현대전자산업 주식회사 filed Critical 김주용
Priority to KR1019940014496A priority Critical patent/KR0129582B1/ko
Priority to US08/493,569 priority patent/US5713717A/en
Priority to JP7158053A priority patent/JP2804730B2/ja
Priority to DE19522942A priority patent/DE19522942B4/de
Publication of KR960000734A publication Critical patent/KR960000734A/ko
Application granted granted Critical
Publication of KR0129582B1 publication Critical patent/KR0129582B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3202Mechanical details, e.g. rollers or belts
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302Mechanical parts of transfer devices

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

본 발명은 그 중심부에 회전운동을 하는 원형의 회전자(13)가 형성되고, 그 상부 표면은 기판 전달 이동 방향을 안내하는 가이드 수단(12,18,19)이 형성된 지지판, 일측단은 상기 회전자(13)에 고정되고 타측단은 기판이 올려지며, 상기 가이드 수단(12,18,19)과 결합되는 가이드 결합수단(5,16,17)이 구성되어 기판을 전달하는 기판 전달암을 포함하여 구성되는 것을 특징으로 하는 다중 기판 전달장치에 관한 것이다.
그리고, 본 발명은 다수의 기판 전달암이 형성되어 특정장비에서 기판의 이동을 여러장 동시에 수행함으로, 공정시간의 단축을 가져와 반도체 소자의 생산력을 향상시키며, 장비 구매 갯수의 감소로 인한 비용절감의 효과를 가져온다.

Description

다중 기판 전달 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 기판 전달장치가 이용되는 반도체 장치의 구성 예시도.
제5도는 기판 전달 모듈의 일부를 포함한 기판 전달암의 전진상태 측면도.
제7도는 기판 전달 모듈내의 기판 전달암의 후진상태 평면도.
제8도는 기판 전달 모듈내의 마그네틱 배치를 표시한 평면도.

Claims (4)

  1. 기판 전달 장치에 있어서, 그 중심부에 회전운동을 하는 원형의 회전자(13)가 형성되고, 그 상부 표면은 기판 전달 이동 방향을 안내하는 가이드 수단(12,18,19)이 형성된 지지판, 일측단은 상기 회전자(13)에 고정되고 타측단은 기판이 올려지며, 상기 가이드 수단(12,18,19)과 결합되는 가이드 결합수단(5,16,17)이 구성되어 기판을 전달하는 다수의 기판 전달암을 포함하여 구성되는 것을 특징으로 하는 다중 기판 전달장치.
  2. 제1항에 있어서, 상기 기판 전달암은, 회전자(13)에 고정되는 일측단에 형성되는 원통형의 구동중심롤러(1), 상기 기판 전달암 타측에 형성되는 기판 로더판(7), 상기 기판 로더판(7)을 지지하는 원통형의 기판 로더판 지지롤러(6), 상기 구동중심롤러(1) 및 기판 로더판 지지롤러(6)를 연결하는 롤러 연결판(2), 상기 구동중심롤러(1)가 고정된 회전자(13)방향으로 기판 로더판(6)의 구동을 위해 상기 롤러연결판(2)이 굴절되도록 구동중심롤러(1) 및 기판 로더판 지지롤러(6)사이에 형성된 다수의 굴절수단(3,4)을 포함하여 구성되는 것을 특징으로 하는 다중 기판 전달 장치.
  3. 제1항에 있어서, 상기 가이드 수단(12,18,19)과 가이드 결합수단(5,16,17)은 서로 다른 극성을 가지는 자석(12,5)인 것을 특징으로 하는 다중 기판 전달 장치.
  4. 제1항에 있어서, 상기 가이드 수단(12,18,19)은 기판 전달 이동로를 따라 형성된 가이드 홈(18,19)이고, 가이드 결합수단(5,16,17)은 상기 홈(18,19)을 따라 이동하는 가이드봉(16,17)인 것을 특징으로 하는 다중 기판 전달장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019940014496A 1994-06-23 1994-06-23 다중 기판 전달 장치 Expired - Fee Related KR0129582B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1019940014496A KR0129582B1 (ko) 1994-06-23 1994-06-23 다중 기판 전달 장치
US08/493,569 US5713717A (en) 1994-06-23 1995-06-22 Multi-substrate feeder for semiconductor device manufacturing system
JP7158053A JP2804730B2 (ja) 1994-06-23 1995-06-23 多重基板伝達装置
DE19522942A DE19522942B4 (de) 1994-06-23 1995-06-23 Mehr-Substrat-Beschickungsstation für Halbleitervorrichtungsherstellungssystem

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019940014496A KR0129582B1 (ko) 1994-06-23 1994-06-23 다중 기판 전달 장치

Publications (2)

Publication Number Publication Date
KR960000734A true KR960000734A (ko) 1996-01-25
KR0129582B1 KR0129582B1 (ko) 1998-04-06

Family

ID=19386133

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940014496A Expired - Fee Related KR0129582B1 (ko) 1994-06-23 1994-06-23 다중 기판 전달 장치

Country Status (4)

Country Link
US (1) US5713717A (ko)
JP (1) JP2804730B2 (ko)
KR (1) KR0129582B1 (ko)
DE (1) DE19522942B4 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110870057A (zh) * 2017-07-14 2020-03-06 株式会社荏原制作所 基板保持装置

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3947761B2 (ja) * 1996-09-26 2007-07-25 株式会社日立国際電気 基板処理装置、基板搬送機および基板処理方法
JP3215643B2 (ja) * 1997-01-31 2001-10-09 ワイエイシイ株式会社 プラズマ処理装置
JPH10329069A (ja) * 1997-03-31 1998-12-15 Daihen Corp 搬送システムの制御方法
JP3722598B2 (ja) * 1997-07-16 2005-11-30 株式会社ダイヘン 2アーム方式の搬送用ロボット装置
JPH11188671A (ja) * 1997-12-26 1999-07-13 Daihen Corp 2アーム方式の搬送用ロボット装置
JPH11188670A (ja) * 1997-12-26 1999-07-13 Daihen Corp 2アーム方式の搬送用ロボット装置
KR100265287B1 (ko) * 1998-04-21 2000-10-02 윤종용 반도체소자 제조용 식각설비의 멀티챔버 시스템
JPH11333778A (ja) 1998-05-29 1999-12-07 Daihen Corp 搬送用ロボット装置
US6056504A (en) * 1998-06-05 2000-05-02 Applied Materials, Inc. Adjustable frog-leg robot
JP3863671B2 (ja) 1998-07-25 2006-12-27 株式会社ダイヘン 搬送用ロボット装置
US20040018070A1 (en) * 2002-07-25 2004-01-29 Applied Materials, Inc. Compact and high throughput semiconductor fabrication system
US8668422B2 (en) * 2004-08-17 2014-03-11 Mattson Technology, Inc. Low cost high throughput processing platform
TWI450356B (zh) * 2007-05-08 2014-08-21 布魯克斯自動機械公司 基板運送裝置
US8752449B2 (en) * 2007-05-08 2014-06-17 Brooks Automation, Inc. Substrate transport apparatus with multiple movable arms utilizing a mechanical switch mechanism
US8918203B2 (en) 2011-03-11 2014-12-23 Brooks Automation, Inc. Substrate processing apparatus
CN102774652A (zh) * 2012-07-31 2012-11-14 深圳市华星光电技术有限公司 一种液晶面板搬运装置及其支撑臂结构
CN104308859B (zh) * 2014-09-19 2016-03-23 重庆交通大学 基于行车的重载精密冗余三臂机械手

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62222906A (ja) * 1986-03-25 1987-09-30 Hitachi Electronics Eng Co Ltd ウエ−ハ搬送機構
JPS63143833A (ja) * 1986-12-08 1988-06-16 Hitachi Electronics Eng Co Ltd 面板搬送機構自動制御方式
DE3912295C2 (de) * 1989-04-14 1997-05-28 Leybold Ag Katodenzerstäubungsanlage
JP2808826B2 (ja) * 1990-05-25 1998-10-08 松下電器産業株式会社 基板の移し換え装置
JPH0536809A (ja) * 1991-07-31 1993-02-12 Mitsubishi Electric Corp 半導体基板処理装置に於ける半導体基板搬送アーム
DE4235677C2 (de) * 1992-10-22 1996-10-31 Balzers Hochvakuum Vakuumkammer, Vakuumbehandlungsanlage mit einer solchen Kammer sowie Transportverfahren
JP3025591B2 (ja) * 1992-11-18 2000-03-27 入江工研株式会社 磁気浮上搬送装置
DE4336792A1 (de) * 1993-10-28 1995-05-04 Leybold Ag Vorrichtung für den Transport von Werkstücken in Vakuumbeschichtungsanlagen

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110870057A (zh) * 2017-07-14 2020-03-06 株式会社荏原制作所 基板保持装置
CN110870057B (zh) * 2017-07-14 2023-09-01 株式会社荏原制作所 基板保持装置

Also Published As

Publication number Publication date
JPH0851138A (ja) 1996-02-20
DE19522942A1 (de) 1996-01-04
KR0129582B1 (ko) 1998-04-06
DE19522942B4 (de) 2005-07-14
US5713717A (en) 1998-02-03
JP2804730B2 (ja) 1998-09-30

Similar Documents

Publication Publication Date Title
KR960000734A (ko) 다중 기판 전달 장치
KR101848849B1 (ko) 기판 이송 장치
DE69611700D1 (de) Dauermagnetrotor für einen elektromotor
KR900010960A (ko) 웨이퍼 주위에 형성된 노치(notch)를 사용하는 웨이퍼 위치 설정 기구
JPS63232496A (ja) 電子部品装着装置
US6657449B2 (en) Test pin unit for PCB test device and feeding device of the same
KR101318173B1 (ko) 기판 이송 장치
TWI788151B (zh) 撕膜裝置
JPS60107451A (ja) 移送装置
JP3799193B2 (ja) ウェハ搬送装置
CN222291260U (zh) 一种包装印刷用输送装置
JPH07125838A (ja) 位置決めテーブル装置
KR940014090A (ko) 타그부착장치
JPH10279068A (ja) 基板搬送装置及びこれを用いた基板処理装置
KR100586187B1 (ko) 마그네트 베어링이 구비된 기판이송장치
JP3647119B2 (ja) 基板搬送装置
JPH01110424A (ja) 磁気浮上型搬送装置
EP0991110B8 (de) Halbleiter-Montageeinrichtung mit einem Chipgreifer
KR100366221B1 (ko) 표면실장장치 및 그 방법
WO2020073278A1 (zh) 连接结构及送料装置
JPH0224039A (ja) 搬送装置
KR20030075545A (ko) 벨트 접촉구조가 개선된 풀리를 갖는 기판 이송장치
KR900015369A (ko) 다이본더의 웨이퍼 홀딩장치
KR970030417A (ko) 웨이퍼상의 파티클 제거장치(an apparatus for removing particles on a wafer)
JPH0640193A (ja) プロッター

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

R17-X000 Change to representative recorded

St.27 status event code: A-5-5-R10-R17-oth-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 12

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 13

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 14

FPAY Annual fee payment

Payment date: 20111024

Year of fee payment: 15

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 15

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

FPAY Annual fee payment

Payment date: 20121022

Year of fee payment: 16

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 16

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20131112

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20131112

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000