KR960000734A - 다중 기판 전달 장치 - Google Patents
다중 기판 전달 장치 Download PDFInfo
- Publication number
- KR960000734A KR960000734A KR1019940014496A KR19940014496A KR960000734A KR 960000734 A KR960000734 A KR 960000734A KR 1019940014496 A KR1019940014496 A KR 1019940014496A KR 19940014496 A KR19940014496 A KR 19940014496A KR 960000734 A KR960000734 A KR 960000734A
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- substrate transfer
- guide
- roller
- rotor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
- H10P72/3202—Mechanical details, e.g. rollers or belts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
- H10P72/3302—Mechanical parts of transfer devices
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (4)
- 기판 전달 장치에 있어서, 그 중심부에 회전운동을 하는 원형의 회전자(13)가 형성되고, 그 상부 표면은 기판 전달 이동 방향을 안내하는 가이드 수단(12,18,19)이 형성된 지지판, 일측단은 상기 회전자(13)에 고정되고 타측단은 기판이 올려지며, 상기 가이드 수단(12,18,19)과 결합되는 가이드 결합수단(5,16,17)이 구성되어 기판을 전달하는 다수의 기판 전달암을 포함하여 구성되는 것을 특징으로 하는 다중 기판 전달장치.
- 제1항에 있어서, 상기 기판 전달암은, 회전자(13)에 고정되는 일측단에 형성되는 원통형의 구동중심롤러(1), 상기 기판 전달암 타측에 형성되는 기판 로더판(7), 상기 기판 로더판(7)을 지지하는 원통형의 기판 로더판 지지롤러(6), 상기 구동중심롤러(1) 및 기판 로더판 지지롤러(6)를 연결하는 롤러 연결판(2), 상기 구동중심롤러(1)가 고정된 회전자(13)방향으로 기판 로더판(6)의 구동을 위해 상기 롤러연결판(2)이 굴절되도록 구동중심롤러(1) 및 기판 로더판 지지롤러(6)사이에 형성된 다수의 굴절수단(3,4)을 포함하여 구성되는 것을 특징으로 하는 다중 기판 전달 장치.
- 제1항에 있어서, 상기 가이드 수단(12,18,19)과 가이드 결합수단(5,16,17)은 서로 다른 극성을 가지는 자석(12,5)인 것을 특징으로 하는 다중 기판 전달 장치.
- 제1항에 있어서, 상기 가이드 수단(12,18,19)은 기판 전달 이동로를 따라 형성된 가이드 홈(18,19)이고, 가이드 결합수단(5,16,17)은 상기 홈(18,19)을 따라 이동하는 가이드봉(16,17)인 것을 특징으로 하는 다중 기판 전달장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019940014496A KR0129582B1 (ko) | 1994-06-23 | 1994-06-23 | 다중 기판 전달 장치 |
| US08/493,569 US5713717A (en) | 1994-06-23 | 1995-06-22 | Multi-substrate feeder for semiconductor device manufacturing system |
| JP7158053A JP2804730B2 (ja) | 1994-06-23 | 1995-06-23 | 多重基板伝達装置 |
| DE19522942A DE19522942B4 (de) | 1994-06-23 | 1995-06-23 | Mehr-Substrat-Beschickungsstation für Halbleitervorrichtungsherstellungssystem |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019940014496A KR0129582B1 (ko) | 1994-06-23 | 1994-06-23 | 다중 기판 전달 장치 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR960000734A true KR960000734A (ko) | 1996-01-25 |
| KR0129582B1 KR0129582B1 (ko) | 1998-04-06 |
Family
ID=19386133
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019940014496A Expired - Fee Related KR0129582B1 (ko) | 1994-06-23 | 1994-06-23 | 다중 기판 전달 장치 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US5713717A (ko) |
| JP (1) | JP2804730B2 (ko) |
| KR (1) | KR0129582B1 (ko) |
| DE (1) | DE19522942B4 (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110870057A (zh) * | 2017-07-14 | 2020-03-06 | 株式会社荏原制作所 | 基板保持装置 |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3947761B2 (ja) * | 1996-09-26 | 2007-07-25 | 株式会社日立国際電気 | 基板処理装置、基板搬送機および基板処理方法 |
| JP3215643B2 (ja) * | 1997-01-31 | 2001-10-09 | ワイエイシイ株式会社 | プラズマ処理装置 |
| JPH10329069A (ja) * | 1997-03-31 | 1998-12-15 | Daihen Corp | 搬送システムの制御方法 |
| JP3722598B2 (ja) * | 1997-07-16 | 2005-11-30 | 株式会社ダイヘン | 2アーム方式の搬送用ロボット装置 |
| JPH11188671A (ja) * | 1997-12-26 | 1999-07-13 | Daihen Corp | 2アーム方式の搬送用ロボット装置 |
| JPH11188670A (ja) * | 1997-12-26 | 1999-07-13 | Daihen Corp | 2アーム方式の搬送用ロボット装置 |
| KR100265287B1 (ko) * | 1998-04-21 | 2000-10-02 | 윤종용 | 반도체소자 제조용 식각설비의 멀티챔버 시스템 |
| JPH11333778A (ja) | 1998-05-29 | 1999-12-07 | Daihen Corp | 搬送用ロボット装置 |
| US6056504A (en) * | 1998-06-05 | 2000-05-02 | Applied Materials, Inc. | Adjustable frog-leg robot |
| JP3863671B2 (ja) | 1998-07-25 | 2006-12-27 | 株式会社ダイヘン | 搬送用ロボット装置 |
| US20040018070A1 (en) * | 2002-07-25 | 2004-01-29 | Applied Materials, Inc. | Compact and high throughput semiconductor fabrication system |
| US8668422B2 (en) * | 2004-08-17 | 2014-03-11 | Mattson Technology, Inc. | Low cost high throughput processing platform |
| TWI450356B (zh) * | 2007-05-08 | 2014-08-21 | 布魯克斯自動機械公司 | 基板運送裝置 |
| US8752449B2 (en) * | 2007-05-08 | 2014-06-17 | Brooks Automation, Inc. | Substrate transport apparatus with multiple movable arms utilizing a mechanical switch mechanism |
| US8918203B2 (en) | 2011-03-11 | 2014-12-23 | Brooks Automation, Inc. | Substrate processing apparatus |
| CN102774652A (zh) * | 2012-07-31 | 2012-11-14 | 深圳市华星光电技术有限公司 | 一种液晶面板搬运装置及其支撑臂结构 |
| CN104308859B (zh) * | 2014-09-19 | 2016-03-23 | 重庆交通大学 | 基于行车的重载精密冗余三臂机械手 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62222906A (ja) * | 1986-03-25 | 1987-09-30 | Hitachi Electronics Eng Co Ltd | ウエ−ハ搬送機構 |
| JPS63143833A (ja) * | 1986-12-08 | 1988-06-16 | Hitachi Electronics Eng Co Ltd | 面板搬送機構自動制御方式 |
| DE3912295C2 (de) * | 1989-04-14 | 1997-05-28 | Leybold Ag | Katodenzerstäubungsanlage |
| JP2808826B2 (ja) * | 1990-05-25 | 1998-10-08 | 松下電器産業株式会社 | 基板の移し換え装置 |
| JPH0536809A (ja) * | 1991-07-31 | 1993-02-12 | Mitsubishi Electric Corp | 半導体基板処理装置に於ける半導体基板搬送アーム |
| DE4235677C2 (de) * | 1992-10-22 | 1996-10-31 | Balzers Hochvakuum | Vakuumkammer, Vakuumbehandlungsanlage mit einer solchen Kammer sowie Transportverfahren |
| JP3025591B2 (ja) * | 1992-11-18 | 2000-03-27 | 入江工研株式会社 | 磁気浮上搬送装置 |
| DE4336792A1 (de) * | 1993-10-28 | 1995-05-04 | Leybold Ag | Vorrichtung für den Transport von Werkstücken in Vakuumbeschichtungsanlagen |
-
1994
- 1994-06-23 KR KR1019940014496A patent/KR0129582B1/ko not_active Expired - Fee Related
-
1995
- 1995-06-22 US US08/493,569 patent/US5713717A/en not_active Expired - Lifetime
- 1995-06-23 JP JP7158053A patent/JP2804730B2/ja not_active Expired - Fee Related
- 1995-06-23 DE DE19522942A patent/DE19522942B4/de not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110870057A (zh) * | 2017-07-14 | 2020-03-06 | 株式会社荏原制作所 | 基板保持装置 |
| CN110870057B (zh) * | 2017-07-14 | 2023-09-01 | 株式会社荏原制作所 | 基板保持装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0851138A (ja) | 1996-02-20 |
| DE19522942A1 (de) | 1996-01-04 |
| KR0129582B1 (ko) | 1998-04-06 |
| DE19522942B4 (de) | 2005-07-14 |
| US5713717A (en) | 1998-02-03 |
| JP2804730B2 (ja) | 1998-09-30 |
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