MY138686A - Adhesive sheet for producing semiconductor device, semiconductor device, and production method for semiconductor device - Google Patents

Adhesive sheet for producing semiconductor device, semiconductor device, and production method for semiconductor device

Info

Publication number
MY138686A
MY138686A MYPI20061357A MYPI20061357A MY138686A MY 138686 A MY138686 A MY 138686A MY PI20061357 A MYPI20061357 A MY PI20061357A MY PI20061357 A MYPI20061357 A MY PI20061357A MY 138686 A MY138686 A MY 138686A
Authority
MY
Malaysia
Prior art keywords
semiconductor device
adhesive sheet
producing
adhesive
production method
Prior art date
Application number
MYPI20061357A
Inventor
Takeshi Sato
Nobuhiro Hashimoto
Atsufumi Yamai
Original Assignee
Tomoegawa Paper Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2005099481A external-priority patent/JP4654062B2/en
Priority claimed from JP2005316560A external-priority patent/JP4863690B2/en
Priority claimed from JP2005316561A external-priority patent/JP4538398B2/en
Application filed by Tomoegawa Paper Co Ltd filed Critical Tomoegawa Paper Co Ltd
Publication of MY138686A publication Critical patent/MY138686A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)

Abstract

AN OBJECT OF THE PRESENT INVENTION IS TO PROVIDE AN ADHESIVE SHEET FOR PRODUCING A SEMICONDUCTOR DEVICE, WHICH CAN PREVENT THE GENERATION OF OUT GAS COMPONENTS WHICH IS CAUSED BY USING A SILICONE ADHESIVE AND THE LIKE, AND THE OCCURRENCE OF ADHESIVE TRANSFER WHILE MAINTAINING EXCELLENT WIRE BONDING PROPERTIES AND MOLD FLASH PROPERTIES OF THERMOSETTING ADHESIVES WHEN THE ADHESIVE SHEET IS USED FOR PRODUCING A SEMICONDUCTOR DEVICE SUCH AS A QFN, AND CAN THEREBY PREVENT THE PRODUCTION OF DEFECTIVE SEMICONDUCTOR DEVICES, IN ORDER TO ACHIEVE THE OBJECT, THE PRESENT INVENTION PROVIDE AN ADHESIVE SHEET FOR PRODUCING A SEMICONDUCTOR DEVICE WHICH IS DETACHABLY ATTACHED TO A LEAD FRAME OR A WIRING SUBSTRATE, WHEREIN (LIE ADHESIVE SHEET COMPRISES A SUBSTRATE AND AN ADHESIVE LAYER, AND THE ADHESIVE LAYER COMPRISES A THERMOSETTING RESIN COMPONENT (A), A THERMOPLASTIC 15 RESIN COMPONENT (B), AND A FLUORINE BASED ADDITIVE (C).
MYPI20061357A 2005-03-30 2006-03-28 Adhesive sheet for producing semiconductor device, semiconductor device, and production method for semiconductor device MY138686A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005099481A JP4654062B2 (en) 2005-03-30 2005-03-30 Adhesive sheet for manufacturing semiconductor device and method for manufacturing semiconductor device
JP2005316560A JP4863690B2 (en) 2005-10-31 2005-10-31 Adhesive sheet for manufacturing semiconductor device, semiconductor device and manufacturing method thereof
JP2005316561A JP4538398B2 (en) 2005-10-31 2005-10-31 Adhesive sheet for manufacturing semiconductor device and method for manufacturing semiconductor device

Publications (1)

Publication Number Publication Date
MY138686A true MY138686A (en) 2009-07-31

Family

ID=37627290

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20061357A MY138686A (en) 2005-03-30 2006-03-28 Adhesive sheet for producing semiconductor device, semiconductor device, and production method for semiconductor device

Country Status (4)

Country Link
KR (1) KR100776313B1 (en)
MY (1) MY138686A (en)
SG (1) SG126111A1 (en)
TW (1) TWI328030B (en)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4863690B2 (en) * 2005-10-31 2012-01-25 株式会社巴川製紙所 Adhesive sheet for manufacturing semiconductor device, semiconductor device and manufacturing method thereof

Also Published As

Publication number Publication date
KR100776313B1 (en) 2007-11-13
TW200706627A (en) 2007-02-16
KR20060106715A (en) 2006-10-12
TWI328030B (en) 2010-08-01
SG126111A1 (en) 2006-10-30

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