NL6808859A - - Google Patents

Info

Publication number
NL6808859A
NL6808859A NL6808859A NL6808859A NL6808859A NL 6808859 A NL6808859 A NL 6808859A NL 6808859 A NL6808859 A NL 6808859A NL 6808859 A NL6808859 A NL 6808859A NL 6808859 A NL6808859 A NL 6808859A
Authority
NL
Netherlands
Application number
NL6808859A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NL6808859A publication Critical patent/NL6808859A/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/042—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with blades or wires mounted in a reciprocating frame
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes
    • Y10T83/0524—Plural cutting steps
    • Y10T83/0572—Plural cutting steps effect progressive cut

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
NL6808859A 1967-06-27 1968-06-24 NL6808859A (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB2989267A GB1182820A (en) 1967-06-27 1967-06-27 Manufacture of Semiconductor Elements.
GB2956067 1967-06-27

Publications (1)

Publication Number Publication Date
NL6808859A true NL6808859A (de) 1968-12-30

Family

ID=26259972

Family Applications (1)

Application Number Title Priority Date Filing Date
NL6808859A NL6808859A (de) 1967-06-27 1968-06-24

Country Status (6)

Country Link
US (1) US3624677A (de)
CH (1) CH493939A (de)
DE (1) DE1764518A1 (de)
FR (1) FR1571103A (de)
GB (1) GB1182820A (de)
NL (1) NL6808859A (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1315479A (en) * 1970-06-24 1973-05-02 Licentia Gmbh Method for manufacturing diodes
US4097310A (en) * 1975-06-03 1978-06-27 Joseph Lindmayer Method of forming silicon solar energy cells
US4138304A (en) * 1977-11-03 1979-02-06 General Electric Company Wafer sawing technique
US4249299A (en) * 1979-03-05 1981-02-10 Hughes Aircraft Company Edge-around leads for backside connections to silicon circuit die
US5596222A (en) * 1994-08-12 1997-01-21 The Charles Stark Draper Laboratory, Inc. Wafer of transducer chips
JP5089643B2 (ja) * 2009-04-30 2012-12-05 インターナショナル・ビジネス・マシーンズ・コーポレーション 光接続要素の製造方法、光伝送基板、光接続部品、接続方法および光伝送システム

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2743506A (en) * 1952-02-23 1956-05-01 Int Resistance Co Method of manufacturing rectifier cells
US2784479A (en) * 1952-03-12 1957-03-12 Gen Electric Method of manufacturing rectifier plates in multiple
GB852003A (en) * 1958-06-10 1960-10-19 Siemens Edison Swan Ltd Improvements relating to the production of wafers of semi-conductor material
DE1269732C2 (de) * 1962-12-24 1973-12-13 Verfahren zum herstellen von halbleiteranordnungen
US3332143A (en) * 1964-12-28 1967-07-25 Gen Electric Semiconductor devices with epitaxial contour
US3326071A (en) * 1965-03-19 1967-06-20 Norton Co Dicing machine

Also Published As

Publication number Publication date
GB1182820A (en) 1970-03-04
CH493939A (de) 1970-07-15
DE1764518A1 (de) 1971-08-05
US3624677A (en) 1971-11-30
FR1571103A (de) 1969-06-13

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