PL3841601T3 - Niskoprofilowe kołnierze do zagnieżdżania kondensatorów - Google Patents

Niskoprofilowe kołnierze do zagnieżdżania kondensatorów

Info

Publication number
PL3841601T3
PL3841601T3 PL19735117.4T PL19735117T PL3841601T3 PL 3841601 T3 PL3841601 T3 PL 3841601T3 PL 19735117 T PL19735117 T PL 19735117T PL 3841601 T3 PL3841601 T3 PL 3841601T3
Authority
PL
Poland
Prior art keywords
nesting
collars
capacitor
low profile
profile
Prior art date
Application number
PL19735117.4T
Other languages
English (en)
Inventor
Derek B. WELLS
Kenneth P. WALSH JR.
Gregory S. Renaud
Dimitry Zarkh
Original Assignee
Raytheon Company
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raytheon Company filed Critical Raytheon Company
Publication of PL3841601T3 publication Critical patent/PL3841601T3/pl

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02Mountings
    • H01G2/06Mountings specially adapted for mounting on a printed-circuit support
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G11/00Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
    • H01G11/10Multiple hybrid or EDL capacitors, e.g. arrays or modules
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G11/00Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
    • H01G11/78Cases; Housings; Encapsulations; Mountings
    • H01G11/82Fixing or assembling a capacitive element in a housing, e.g. mounting electrodes, current collectors or terminals in containers or encapsulations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02Mountings
    • H01G2/04Mountings specially adapted for mounting on a chassis
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/38Multiple capacitors, i.e. structural combinations of fixed capacitors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/181Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/02Arrangements of circuit components or wiring on supporting structure
    • H05K7/12Resilient or clamping means for holding component to structure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • H05K7/1422Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G11/00Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
    • H01G11/78Cases; Housings; Encapsulations; Mountings
    • H01G11/80Gaskets; Sealings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/10Housing; Encapsulation
    • H01G2/106Fixing the capacitor in a housing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/40Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10015Non-printed capacitor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10507Involving several components
    • H05K2201/10522Adjacent components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2045Protection against vibrations
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Connection Of Plates (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Engine Equipment That Uses Special Cycles (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Executing Machine-Instructions (AREA)
PL19735117.4T 2018-08-22 2019-06-18 Niskoprofilowe kołnierze do zagnieżdżania kondensatorów PL3841601T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US16/109,519 US10716232B2 (en) 2018-08-22 2018-08-22 Low profile, nesting capacitor collars
PCT/US2019/037775 WO2020040853A1 (en) 2018-08-22 2019-06-18 Low profile, nesting capacitor collars

Publications (1)

Publication Number Publication Date
PL3841601T3 true PL3841601T3 (pl) 2023-05-22

Family

ID=67138178

Family Applications (1)

Application Number Title Priority Date Filing Date
PL19735117.4T PL3841601T3 (pl) 2018-08-22 2019-06-18 Niskoprofilowe kołnierze do zagnieżdżania kondensatorów

Country Status (5)

Country Link
US (1) US10716232B2 (pl)
EP (2) EP4220673B1 (pl)
ES (1) ES2945998T3 (pl)
PL (1) PL3841601T3 (pl)
WO (1) WO2020040853A1 (pl)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112840421B (zh) * 2018-12-05 2022-07-22 松下知识产权经营株式会社 车载电源装置
EP4468317A1 (en) * 2023-05-24 2024-11-27 Abb Schweiz Ag Clamp arrangement for cylindrical object, cylindrical object assembly comprising said clamp arrangement and method of manufacturing cylindrical object assembly

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2762989A (en) 1952-10-16 1956-09-11 Solar Mfg Corp Capacitor mount
US3237905A (en) 1963-11-12 1966-03-01 Mallory & Co Inc P R Vertical mounting clamp for cardboard tubular capacitors
US3229939A (en) 1963-11-22 1966-01-18 North American Aviation Inc Mounting grommet for electrical components
US3895832A (en) 1974-05-13 1975-07-22 Mueller Co Collet compression connection
US4088327A (en) 1977-06-22 1978-05-09 General Signal Corporation Sealing ring with tabs for holding for assembly
US4182519A (en) 1978-01-24 1980-01-08 Ralph Wilson Resilient sealing ring
JP3412172B2 (ja) 1992-10-05 2003-06-03 日本ケミコン株式会社 電解コンデンサの固定装置
US5880926A (en) 1996-04-19 1999-03-09 Nichicon Corporation Electronic device with mounting structure
DE19725843C1 (de) 1997-06-18 1998-10-29 Siemens Matsushita Components Elektrischer Kondensator
FI107416B (fi) 2000-03-10 2001-07-31 Vacon Oyj Kondensaattorin kiinnitys- ja suojajärjestely
DE10016864A1 (de) 2000-04-05 2001-11-15 Epcos Ag Montagemittel, Montageanordnung mit dem Montagemittel und Verwendung des Montagemittels
CA2482505C (en) 2003-09-25 2010-11-23 Philmac Pty Ltd A collet for pipe coupling
DE102005025832B3 (de) 2005-06-02 2006-11-16 Aic Europe Elektronische Bauteile Gmbh Befestigung eines Kondensators
DE102005056043B4 (de) 2005-08-02 2008-01-10 Epcos Ag Montageanordnung für einen Kondensator
US7234956B2 (en) 2005-09-02 2007-06-26 Kauffman George M Electrical connector with dual independent coupling means
DE102006015129A1 (de) 2006-03-31 2007-10-11 Epcos Ag Montageanordnung
US8194393B2 (en) * 2007-02-16 2012-06-05 Panasonic Corporation Capacitor unit and its manufacturing method
US7791901B2 (en) 2007-05-24 2010-09-07 Delphi Technologies, Inc. Stand-off mounting apparatus for discrete electrical components
DE102008048082A1 (de) 2008-09-19 2010-04-08 Bombardier Transportation Gmbh Anordnung und Verfahren zum Halten einer Mehrzahl von elektrischen Kondensatorbaugruppen
GB2483915A (en) * 2010-09-24 2012-03-28 Oceanvolt Oy Mount for a boat propulsion unit
JP2012074561A (ja) * 2010-09-29 2012-04-12 Omron Corp 電解コンデンサ用ソケット
JP5327175B2 (ja) * 2010-09-30 2013-10-30 オムロン株式会社 電解コンデンサ用表面実装ソケット及び電解コンデンサの表面実装方法
US8570767B2 (en) * 2011-03-21 2013-10-29 Deere & Company Capacitor assembly
JP6142508B2 (ja) * 2012-11-12 2017-06-07 北川工業株式会社 コンデンサホルダ
US9585255B2 (en) 2015-03-11 2017-02-28 Raytheon Company Component support for dense circuit board

Also Published As

Publication number Publication date
EP4220673A2 (en) 2023-08-02
EP3841601B1 (en) 2023-04-05
ES2945998T3 (es) 2023-07-11
US20200068738A1 (en) 2020-02-27
WO2020040853A1 (en) 2020-02-27
EP4220673B1 (en) 2026-02-11
EP4220673A3 (en) 2023-08-09
US10716232B2 (en) 2020-07-14
EP3841601A1 (en) 2021-06-30

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