SE8202309L - SEEN TO ACHIEVE A THROUGH HALL IN A CONDUCTOR FOR ELECTRICAL CIRCUITS BECOMING CONDUCTIVE - Google Patents

SEEN TO ACHIEVE A THROUGH HALL IN A CONDUCTOR FOR ELECTRICAL CIRCUITS BECOMING CONDUCTIVE

Info

Publication number
SE8202309L
SE8202309L SE8202309A SE8202309A SE8202309L SE 8202309 L SE8202309 L SE 8202309L SE 8202309 A SE8202309 A SE 8202309A SE 8202309 A SE8202309 A SE 8202309A SE 8202309 L SE8202309 L SE 8202309L
Authority
SE
Sweden
Prior art keywords
ink
holes
hall
conductor
seen
Prior art date
Application number
SE8202309A
Other languages
Swedish (sv)
Inventor
R Scorta
Original Assignee
Italtel Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Italtel Spa filed Critical Italtel Spa
Publication of SE8202309L publication Critical patent/SE8202309L/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981—Metallised walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0134—Drum, e.g. rotary drum or dispenser with a plurality of openings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736—Methods for applying liquids, e.g. spraying
    • H05K2203/0753—Reversing fluid direction, e.g. in holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Plates And Materials Therefor (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

Conductive ink is passed one or more times through the holes 11 made in the support board 1 which, having been inserted between two semirigid stencils 2 in order to obtain adequate mechanical resistence, divides two chambers 4, 7 with variable volumes from each other. The volume of the chamber containing the ink diminishes, or is reduced, as it is forced through the holes, whilst the volume of the other chamber increases as the ink is sucked in. Once a predetermined quantity of ink has been transferred from one chamber to the other, the process is reversed; the entire cycle may be repeated several times over, until an adequate layer of ink has been deposited on the walls of the holes. <IMAGE>
SE8202309A 1981-04-10 1982-04-13 SEEN TO ACHIEVE A THROUGH HALL IN A CONDUCTOR FOR ELECTRICAL CIRCUITS BECOMING CONDUCTIVE SE8202309L (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT21045/81A IT1137331B (en) 1981-04-10 1981-04-10 METHOD TO MAKE CONDUCTIVE THROUGH HOLES IN SUPPORTS FOR ELECTRIC CIRCUITS

Publications (1)

Publication Number Publication Date
SE8202309L true SE8202309L (en) 1982-10-11

Family

ID=11175883

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8202309A SE8202309L (en) 1981-04-10 1982-04-13 SEEN TO ACHIEVE A THROUGH HALL IN A CONDUCTOR FOR ELECTRICAL CIRCUITS BECOMING CONDUCTIVE

Country Status (5)

Country Link
GB (1) GB2100520B (en)
IL (1) IL65455A0 (en)
IT (1) IT1137331B (en)
SE (1) SE8202309L (en)
YU (1) YU79382A (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1219179A (en) * 1982-09-27 1987-03-17 Etd Technology, Inc. Apparatus and method for electroless plating
IT1165498B (en) * 1983-12-20 1987-04-22 Italtel Spa METHOD FOR COATING THE WALLS OF HOLES THROUGH SUPPORTS FOR ELECTRIC CIRCUITS AND MACHINE TO IMPLEMENT TLAE WITH AN INK
SE453708B (en) * 1985-03-05 1988-02-22 Svecia Silkscreen Maskiner Ab STONE PRINTING MACHINE TO CREATE A MATERIAL LAYER ON AN INNER WALL PART FOR A THROUGH HALL IN A PLATE
EP0327298A3 (en) * 1988-02-03 1990-06-27 THE GENERAL ELECTRIC COMPANY, p.l.c. Apparatus for selectively coating part of a member
GB8802393D0 (en) * 1988-02-03 1988-03-02 Gen Electric Co Plc Apparatus for selectively coating part of member
DE3916694A1 (en) * 1989-05-23 1990-11-29 Schering Ag ARRANGEMENT FOR CHEMICAL TREATMENT AND / OR CLEANING OF GOODS, ESPECIALLY BOLTED PCBS AND RELATED METHOD
GB2349279B (en) * 1997-11-26 2002-06-05 Karl Michael Wallis Method and apparatus for manufacturing double sided or multi-layered printed circuit boards

Also Published As

Publication number Publication date
YU79382A (en) 1985-03-20
GB2100520B (en) 1984-10-10
IT1137331B (en) 1986-09-10
GB2100520A (en) 1982-12-22
IT8121045A0 (en) 1981-04-10
IL65455A0 (en) 1982-07-30

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