SE9403531L - System och förfarande för behandling av minnesdata samt kommunikationssystem omfattande dylikt system - Google Patents

System och förfarande för behandling av minnesdata samt kommunikationssystem omfattande dylikt system

Info

Publication number
SE9403531L
SE9403531L SE9403531A SE9403531A SE9403531L SE 9403531 L SE9403531 L SE 9403531L SE 9403531 A SE9403531 A SE 9403531A SE 9403531 A SE9403531 A SE 9403531A SE 9403531 L SE9403531 L SE 9403531L
Authority
SE
Sweden
Prior art keywords
memory
addresses
systems
pct
address
Prior art date
Application number
SE9403531A
Other languages
English (en)
Swedish (sv)
Other versions
SE515718C2 (sv
SE9403531D0 (sv
Inventor
Oleg Avsan
Klaus Wildling
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE9403531A priority Critical patent/SE515718C2/sv
Publication of SE9403531D0 publication Critical patent/SE9403531D0/xx
Priority to EP95935639A priority patent/EP0787326B1/en
Priority to CN95196650A priority patent/CN1168729A/zh
Priority to CA002202863A priority patent/CA2202863A1/en
Priority to KR1019930005056A priority patent/KR100284785B1/ko
Priority to KR1019970702471A priority patent/KR100284784B1/ko
Priority to PCT/SE1995/001215 priority patent/WO1996012230A1/en
Priority to JP8513166A priority patent/JPH10507550A/ja
Priority to DE69525850T priority patent/DE69525850T2/de
Priority to US08/817,508 priority patent/US5933856A/en
Publication of SE9403531L publication Critical patent/SE9403531L/
Publication of SE515718C2 publication Critical patent/SE515718C2/sv

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F12/00—Accessing, addressing or allocating within memory systems or architectures
    • G06F12/02—Addressing or allocation; Relocation
    • G06F12/0215—Addressing or allocation; Relocation with look ahead addressing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/062—Glass compositions containing silica with less than 40% silica by weight
    • C03C3/064—Glass compositions containing silica with less than 40% silica by weight containing boron
    • C03C3/066—Glass compositions containing silica with less than 40% silica by weight containing boron containing zinc
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/062—Glass compositions containing silica with less than 40% silica by weight
    • C03C3/07—Glass compositions containing silica with less than 40% silica by weight containing lead
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/062—Glass compositions containing silica with less than 40% silica by weight
    • C03C3/07—Glass compositions containing silica with less than 40% silica by weight containing lead
    • C03C3/072—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/062—Glass compositions containing silica with less than 40% silica by weight
    • C03C3/07—Glass compositions containing silica with less than 40% silica by weight containing lead
    • C03C3/072—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron
    • C03C3/074—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron containing zinc
    • C03C3/0745—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron containing zinc containing more than 50% lead oxide, by weight
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
    • C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
    • C03C8/10—Frit compositions, i.e. in a powdered or comminuted form containing lead
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
    • C03C8/10—Frit compositions, i.e. in a powdered or comminuted form containing lead
    • C03C8/12—Frit compositions, i.e. in a powdered or comminuted form containing lead containing titanium or zirconium
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/22—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions containing two or more distinct frits having different compositions
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/14—Handling requests for interconnection or transfer
    • G06F13/16—Handling requests for interconnection or transfer for access to memory bus
    • G06F13/1605—Handling requests for interconnection or transfer for access to memory bus based on arbitration
    • G06F13/161—Handling requests for interconnection or transfer for access to memory bus based on arbitration with latency improvement
    • G06F13/1626—Handling requests for interconnection or transfer for access to memory bus based on arbitration with latency improvement by reordering requests
    • G06F13/1631—Handling requests for interconnection or transfer for access to memory bus based on arbitration with latency improvement by reordering requests through address comparison
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body
    • H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body characterised by the resistive component
    • H01C17/06553—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body characterised by the resistive component composed of a combination of metals and oxides

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electromagnetism (AREA)
  • Memory System Of A Hierarchy Structure (AREA)
  • Data Exchanges In Wide-Area Networks (AREA)
  • Small-Scale Networks (AREA)
  • Computer And Data Communications (AREA)
  • Non-Adjustable Resistors (AREA)
  • Advance Control (AREA)
  • Conductive Materials (AREA)
  • Communication Control (AREA)
SE9403531A 1994-10-17 1994-10-17 System och förfarande för behandling av minnesdata samt kommunikationssystem SE515718C2 (sv)

Priority Applications (10)

Application Number Priority Date Filing Date Title
SE9403531A SE515718C2 (sv) 1994-10-17 1994-10-17 System och förfarande för behandling av minnesdata samt kommunikationssystem
US08/817,508 US5933856A (en) 1994-10-17 1995-10-17 System and method for processing of memory data and communication system comprising such system
KR1019930005056A KR100284785B1 (ko) 1994-10-17 1995-10-17 메모리 데이터 처리 시스템 및 방법과 이건 시스템을 구비하는 통신 시스템
CN95196650A CN1168729A (zh) 1994-10-17 1995-10-17 处理存储器数据的系统和方法及包括该系统的通讯系统
CA002202863A CA2202863A1 (en) 1994-10-17 1995-10-17 System and method for processing of memory data and communication system comprising such system
EP95935639A EP0787326B1 (en) 1994-10-17 1995-10-17 System and method for processing of memory data and communication system comprising such system
KR1019970702471A KR100284784B1 (ko) 1994-10-17 1995-10-17 메모리 데이터 처리 시스템 및 방법과 이건 시스템을 구비하는 통신 시스템
PCT/SE1995/001215 WO1996012230A1 (en) 1994-10-17 1995-10-17 System and method for processing of memory data and communication system comprising such system
JP8513166A JPH10507550A (ja) 1994-10-17 1995-10-17 メモリ・データを処理する方法と装置及びこの装置を含む通信装置
DE69525850T DE69525850T2 (de) 1994-10-17 1995-10-17 System und verfahren zur verarbeitung von speicherdaten und kommunikationssystemen mit diesem system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9403531A SE515718C2 (sv) 1994-10-17 1994-10-17 System och förfarande för behandling av minnesdata samt kommunikationssystem

Publications (3)

Publication Number Publication Date
SE9403531D0 SE9403531D0 (sv) 1994-10-17
SE9403531L true SE9403531L (sv) 1996-04-18
SE515718C2 SE515718C2 (sv) 2001-10-01

Family

ID=20395633

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9403531A SE515718C2 (sv) 1994-10-17 1994-10-17 System och förfarande för behandling av minnesdata samt kommunikationssystem

Country Status (9)

Country Link
US (1) US5933856A ( )
EP (1) EP0787326B1 ( )
JP (1) JPH10507550A ( )
KR (2) KR100284785B1 ( )
CN (1) CN1168729A ( )
CA (1) CA2202863A1 ( )
DE (1) DE69525850T2 ( )
SE (1) SE515718C2 ( )
WO (1) WO1996012230A1 ( )

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100850648B1 (ko) * 2007-01-03 2008-08-07 한국과학기술원 산화물을 이용한 고효율 열발생 저항기, 액체 분사 헤드 및장치, 및 액체 분사 헤드용 기판
TWI519955B (zh) * 2010-03-29 2016-02-01 威盛電子股份有限公司 預取單元、資料預取方法以及電腦程式產品
CN106951374B (zh) * 2016-01-06 2022-06-10 北京忆芯科技有限公司 用于检查块页地址的方法及其装置
KR20250070946A (ko) * 2023-11-14 2025-05-21 에스케이하이닉스 주식회사 프로세싱-인-메모리 장치

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8405491D0 (en) * 1984-03-02 1984-04-04 Hemdal G Computers
JPH0221342A (ja) * 1987-02-27 1990-01-24 Hitachi Ltd マルチプロセッサシステム及びマルチプロセッサシステムにおける論理キャッシュメモリのアクセス方法
US4920477A (en) * 1987-04-20 1990-04-24 Multiflow Computer, Inc. Virtual address table look aside buffer miss recovery method and apparatus
JPH02191301A (ja) * 1988-12-08 1990-07-27 Showa Denko Kk 抵抗ペースト
US5214777A (en) * 1989-03-27 1993-05-25 Ncr Corporation High speed read/modify/write memory system and method
GB2239724B (en) * 1990-01-05 1993-11-24 Sun Microsystems Inc Apparatus for maintaining consistency in a multi-processor computer system using virtual caching
US5170476A (en) * 1990-01-22 1992-12-08 Motorola, Inc. Data processor having a deferred cache load
EP0447145B1 (en) * 1990-03-12 2000-07-12 Hewlett-Packard Company User scheduled direct memory access using virtual addresses
US5247645A (en) * 1991-03-12 1993-09-21 International Business Machines Corporation Dynamic memory mapper which supports interleaving across 2N +1, 2.sup.NN -1 number of banks for reducing contention during nonunit stride accesses
JP3230898B2 (ja) * 1993-06-02 2001-11-19 シャープ株式会社 データ駆動型情報処理システム
US5680577A (en) * 1995-04-27 1997-10-21 International Business Machines Corporation Method and system for processing multiple requests for data residing at the same memory address

Also Published As

Publication number Publication date
KR930020500A (ko) 1993-10-20
US5933856A (en) 1999-08-03
DE69525850D1 (de) 2002-04-18
KR100284784B1 (ko) 2001-03-15
EP0787326B1 (en) 2002-03-13
EP0787326A1 (en) 1997-08-06
SE515718C2 (sv) 2001-10-01
WO1996012230A1 (en) 1996-04-25
KR100284785B1 (ko) 2001-03-15
JPH10507550A (ja) 1998-07-21
CA2202863A1 (en) 1996-04-25
SE9403531D0 (sv) 1994-10-17
CN1168729A (zh) 1997-12-24
DE69525850T2 (de) 2002-09-26

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