SG95650A1 - Die attach adhesives with vinyl ether and carbamate or urea functionality - Google Patents
Die attach adhesives with vinyl ether and carbamate or urea functionalityInfo
- Publication number
- SG95650A1 SG95650A1 SG200102949A SG200102949A SG95650A1 SG 95650 A1 SG95650 A1 SG 95650A1 SG 200102949 A SG200102949 A SG 200102949A SG 200102949 A SG200102949 A SG 200102949A SG 95650 A1 SG95650 A1 SG 95650A1
- Authority
- SG
- Singapore
- Prior art keywords
- carbamate
- vinyl ether
- urea functionality
- die attach
- attach adhesives
- Prior art date
Links
- KXDHJXZQYSOELW-UHFFFAOYSA-M Carbamate Chemical compound NC([O-])=O KXDHJXZQYSOELW-UHFFFAOYSA-M 0.000 title abstract 3
- XSQUKJJJFZCRTK-UHFFFAOYSA-N urea group Chemical group NC(=O)N XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 title abstract 3
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 title abstract 2
- 239000000853 adhesive Substances 0.000 title abstract 2
- 230000001070 adhesive effect Effects 0.000 title abstract 2
- GNVMUORYQLCPJZ-UHFFFAOYSA-M Thiocarbamate Chemical compound NC([S-])=O GNVMUORYQLCPJZ-UHFFFAOYSA-M 0.000 abstract 2
- 150000001875 compounds Chemical class 0.000 abstract 2
- 238000004377 microelectronic Methods 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/67—Unsaturated compounds having active hydrogen
- C08G18/671—Unsaturated compounds having only one group containing active hydrogen
- C08G18/6715—Unsaturated monofunctional alcohols or amines
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J135/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least another carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J135/08—Copolymers with vinyl ethers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
- C09J175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
- C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US57330300A | 2000-05-18 | 2000-05-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG95650A1 true SG95650A1 (en) | 2003-04-23 |
Family
ID=24291427
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG200102949A SG95650A1 (en) | 2000-05-18 | 2001-05-16 | Die attach adhesives with vinyl ether and carbamate or urea functionality |
Country Status (10)
| Country | Link |
|---|---|
| US (2) | US20020032260A1 (de) |
| EP (1) | EP1156068B1 (de) |
| JP (1) | JP2002047475A (de) |
| KR (1) | KR100789332B1 (de) |
| CN (1) | CN1180044C (de) |
| AT (1) | ATE291048T1 (de) |
| CA (1) | CA2347872A1 (de) |
| DE (1) | DE60109356T2 (de) |
| SG (1) | SG95650A1 (de) |
| TW (1) | TWI301491B (de) |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002047475A (ja) * | 2000-05-18 | 2002-02-12 | Natl Starch & Chem Investment Holding Corp | ビニルエーテルおよびカルバメートまたは尿素官能基を有するダイ結合性接着剤 |
| US6831132B2 (en) * | 2002-03-28 | 2004-12-14 | Henkel Corporation | Film adhesives containing maleimide compounds and methods for use thereof |
| US20030232926A1 (en) * | 2002-05-14 | 2003-12-18 | Nikolic Nikola A. | Thermoset adhesive films |
| US7176044B2 (en) * | 2002-11-25 | 2007-02-13 | Henkel Corporation | B-stageable die attach adhesives |
| US7884174B2 (en) | 2003-05-05 | 2011-02-08 | Designer Molecules, Inc. | Imide-linked maleimide and polymaleimide compounds |
| WO2010019832A2 (en) | 2008-08-13 | 2010-02-18 | Designer Molecules, Inc. | Amide-extended crosslinking compounds and methods for use thereof |
| US8513375B2 (en) * | 2003-05-05 | 2013-08-20 | Designer Molecules, Inc. | Imide-linked maleimide and polymaleimide compounds |
| KR101179815B1 (ko) * | 2003-05-05 | 2012-09-04 | 디자이너 몰레큘스 인코퍼레이티드 | 이미드-연결된 말레이미드 및 폴리말레이미드 화합물 |
| ES2426004T3 (es) * | 2004-05-02 | 2013-10-18 | Ashland Licensing And Intellectual Property Llc | Revestimientos curables por radiación para sustratos metálicos de oligómeros multifuncionales de acrilato |
| US20050267254A1 (en) * | 2004-05-28 | 2005-12-01 | Mizori Farhad G | Functionalized urethanes and methods for use thereof |
| WO2005121190A2 (en) * | 2004-06-04 | 2005-12-22 | Designer Molecules Inc. | Free-radical curable polyesters and methods for use thereof |
| US7875688B2 (en) * | 2004-06-04 | 2011-01-25 | Designer Molecules, Inc. | Free-radical curable polyesters and methods for use thereof |
| US7875686B2 (en) * | 2004-08-18 | 2011-01-25 | Promerus Llc | Polycycloolefin polymeric compositions for semiconductor applications |
| US7850870B2 (en) * | 2004-10-28 | 2010-12-14 | Dow Corning Corporation | Conductive curable compositions |
| JP2006193666A (ja) * | 2005-01-14 | 2006-07-27 | Sumitomo Bakelite Co Ltd | 半導体用接着フィルム、半導体用接着フィルム付きキャリア材料および半導体装置 |
| US20060235137A1 (en) * | 2005-04-18 | 2006-10-19 | Eunsook Chae | Die attach adhesives with improved stress performance |
| WO2007040794A1 (en) * | 2005-09-21 | 2007-04-12 | Dow Corning Corporation | Ambient lithographic method using organoborane amine complexes |
| US8043534B2 (en) * | 2005-10-21 | 2011-10-25 | Designer Molecules, Inc. | Maleimide compositions and methods for use thereof |
| ATE397647T1 (de) * | 2006-03-06 | 2008-06-15 | Umicore Ag & Co Kg | Zusammensetzung zur befestigung von hochleistungshalbleiter |
| US20080262191A1 (en) * | 2007-01-26 | 2008-10-23 | Mizori Farhad G | Methods for the preparation of imides, maleimides and maleimide-terminated polyimide compounds |
| US7868113B2 (en) | 2007-04-11 | 2011-01-11 | Designer Molecules, Inc. | Low shrinkage polyester thermosetting resins |
| US8063161B2 (en) * | 2007-04-16 | 2011-11-22 | Designer Molecules, Inc. | Low temperature curing acrylate and maleimide based formulations and methods for use thereof |
| US8308892B2 (en) | 2008-04-09 | 2012-11-13 | Designer Molecules, Inc. | Di-cinnamyl compounds and methods for use thereof |
| US8158748B2 (en) | 2008-08-13 | 2012-04-17 | Designer Molecules, Inc. | Hetero-functional compounds and methods for use thereof |
| GB201102035D0 (en) * | 2011-02-04 | 2011-03-23 | Zephyros Inc | Improvements in or relating to extrusion |
| EP2843740B1 (de) * | 2012-04-27 | 2019-04-03 | AGC Inc. | Binder für eine stromspeichervorrichtung |
| KR102058113B1 (ko) * | 2015-11-23 | 2019-12-23 | 주식회사 엘지화학 | 접착력이 개선된 리튬 이차전지용 전극 및 이의 제조방법 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2143540A (en) * | 1983-07-18 | 1985-02-13 | Gen Electric | Polyimide molding compositions |
| US4775732A (en) * | 1988-01-11 | 1988-10-04 | Allied-Signal Inc. | Vinyl ether terminated ester and urethane resins from bis(hydroxyalkyl)cycloalkanes |
| EP0969065A2 (de) * | 1998-07-02 | 2000-01-05 | National Starch and Chemical Investment Holding Corporation | Klebstoff zur Befestigung von Chips zur Anwendung bei der Mikroelekronischen Anordnung |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2116082A (en) * | 1982-02-26 | 1983-09-21 | Gen Electric | Inserts for cutting tools |
| US4486582A (en) * | 1983-01-27 | 1984-12-04 | The Dow Chemical Company | Reactive monomers and thermosettable compositions containing same |
| US4732956A (en) * | 1984-06-18 | 1988-03-22 | Loctite (Ireland) Ltd. | Styryloxy resins and compositions thereof |
| US4543397A (en) * | 1984-06-18 | 1985-09-24 | Loctite (Ireland) Ltd. | Styryloxy resins and compositions thereof |
| US4640849A (en) * | 1986-01-31 | 1987-02-03 | Loctite (Ireland) Limited | Meta-bridged styryloxy resins |
| US4751273A (en) * | 1986-08-19 | 1988-06-14 | Allied-Signal, Inc. | Vinyl ether terminated urethane resins |
| US4749807A (en) * | 1987-02-17 | 1988-06-07 | Allied-Signal Inc. | Vinyl ether terminated ester oligomers |
| US5334456A (en) * | 1988-08-12 | 1994-08-02 | Stamicarbon B.V. | Free-radical curable compositions |
| AU4432789A (en) * | 1988-11-10 | 1990-05-17 | Loctite (Ireland) Limited | Polymerisable styryloxy resins and compositions thereof |
| US5183946A (en) * | 1989-02-08 | 1993-02-02 | Isp Investments Inc. | Vinyloxy hydroxyalkylcycloalkane and preparation therefor |
| US5084490A (en) * | 1990-12-10 | 1992-01-28 | Loctite (Ireland) Limited | Styryloxy compounds and polymers thereof |
| CA2139124A1 (en) | 1993-05-03 | 1994-11-10 | Anthony F. Jacobine | Polymer dispersed liquid crystals in electron-rich alkene-thiol polymers |
| ES2150977T3 (es) | 1993-08-09 | 2000-12-16 | Vantico Ag | Nuevos (met)acrilatos conteniendo grupos uretano. |
| US6034194A (en) | 1994-09-02 | 2000-03-07 | Quantum Materials/Dexter Corporation | Bismaleimide-divinyl adhesive compositions and uses therefor |
| US5514727A (en) | 1994-07-13 | 1996-05-07 | Alliedsignal Inc. | Stabilizers for vinyl ether-based coating systems |
| US5491178A (en) | 1994-07-13 | 1996-02-13 | Alliedsignal Inc. | Hydrogen stabilizers for vinyl ether-based coating systems |
| US5539014A (en) | 1994-07-13 | 1996-07-23 | Alliedsignal Inc. | Adhesion promoters for vinyl ether-based coating systems |
| US5789757A (en) | 1996-09-10 | 1998-08-04 | The Dexter Corporation | Malemide containing formulations and uses therefor |
| US5708129A (en) | 1995-04-28 | 1998-01-13 | Johnson Matthey, Inc. | Die attach adhesive with reduced resin bleed |
| US5633411A (en) | 1995-06-07 | 1997-05-27 | Loctite Corporation | Method for production of allyloxystyrene compounds |
| US6121358A (en) | 1997-09-22 | 2000-09-19 | The Dexter Corporation | Hydrophobic vinyl monomers, formulations containing same, and uses therefor |
| US6291704B1 (en) | 1998-01-20 | 2001-09-18 | Alliedsignal Inc. | Polymerizable halogenated vinyl ethers |
| EP1084390A4 (de) | 1998-06-09 | 2005-07-27 | California Inst Of Techn | Kolloidal-teilchen zur verwendung in sensor-arrays |
| JP2002047475A (ja) * | 2000-05-18 | 2002-02-12 | Natl Starch & Chem Investment Holding Corp | ビニルエーテルおよびカルバメートまたは尿素官能基を有するダイ結合性接着剤 |
-
2001
- 2001-05-16 JP JP2001146586A patent/JP2002047475A/ja active Pending
- 2001-05-16 CN CNB011197102A patent/CN1180044C/zh not_active Expired - Fee Related
- 2001-05-16 KR KR1020010026769A patent/KR100789332B1/ko not_active Expired - Fee Related
- 2001-05-16 EP EP01111271A patent/EP1156068B1/de not_active Expired - Lifetime
- 2001-05-16 SG SG200102949A patent/SG95650A1/en unknown
- 2001-05-16 AT AT01111271T patent/ATE291048T1/de not_active IP Right Cessation
- 2001-05-16 CA CA002347872A patent/CA2347872A1/en not_active Abandoned
- 2001-05-16 DE DE60109356T patent/DE60109356T2/de not_active Expired - Lifetime
- 2001-05-17 TW TW090112030A patent/TWI301491B/zh not_active IP Right Cessation
- 2001-08-08 US US09/924,321 patent/US20020032260A1/en not_active Abandoned
- 2001-08-10 US US09/927,242 patent/US6699929B2/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2143540A (en) * | 1983-07-18 | 1985-02-13 | Gen Electric | Polyimide molding compositions |
| US4775732A (en) * | 1988-01-11 | 1988-10-04 | Allied-Signal Inc. | Vinyl ether terminated ester and urethane resins from bis(hydroxyalkyl)cycloalkanes |
| EP0969065A2 (de) * | 1998-07-02 | 2000-01-05 | National Starch and Chemical Investment Holding Corporation | Klebstoff zur Befestigung von Chips zur Anwendung bei der Mikroelekronischen Anordnung |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2002047475A (ja) | 2002-02-12 |
| KR100789332B1 (ko) | 2007-12-28 |
| US20020032260A1 (en) | 2002-03-14 |
| US6699929B2 (en) | 2004-03-02 |
| CA2347872A1 (en) | 2001-11-18 |
| KR20010106259A (ko) | 2001-11-29 |
| DE60109356D1 (de) | 2005-04-21 |
| CN1324908A (zh) | 2001-12-05 |
| EP1156068B1 (de) | 2005-03-16 |
| TWI301491B (en) | 2008-10-01 |
| US20020032257A1 (en) | 2002-03-14 |
| ATE291048T1 (de) | 2005-04-15 |
| EP1156068A1 (de) | 2001-11-21 |
| HK1042316A1 (en) | 2002-08-09 |
| CN1180044C (zh) | 2004-12-15 |
| DE60109356T2 (de) | 2005-07-28 |
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