SG98002A1 - Thin film deposition apparatus for semiconductor - Google Patents
Thin film deposition apparatus for semiconductorInfo
- Publication number
- SG98002A1 SG98002A1 SG200007424A SG200007424A SG98002A1 SG 98002 A1 SG98002 A1 SG 98002A1 SG 200007424 A SG200007424 A SG 200007424A SG 200007424 A SG200007424 A SG 200007424A SG 98002 A1 SG98002 A1 SG 98002A1
- Authority
- SG
- Singapore
- Prior art keywords
- gas
- thin film
- reactor
- deposition apparatus
- film deposition
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
- C23C16/4488—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by in situ generation of reactive gas by chemical or electrochemical reaction
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Electrochemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Formation Of Insulating Films (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
- Physical Vapour Deposition (AREA)
- Magnetic Heads (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019990058541A KR100330749B1 (ko) | 1999-12-17 | 1999-12-17 | 반도체 박막증착장치 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG98002A1 true SG98002A1 (en) | 2003-08-20 |
Family
ID=19626555
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG200007424A SG98002A1 (en) | 1999-12-17 | 2000-12-13 | Thin film deposition apparatus for semiconductor |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US6740166B2 (de) |
| EP (1) | EP1108468B1 (de) |
| JP (1) | JP3481586B2 (de) |
| KR (1) | KR100330749B1 (de) |
| AT (1) | ATE268217T1 (de) |
| DE (1) | DE60011215T2 (de) |
| SG (1) | SG98002A1 (de) |
| TW (1) | TW466565B (de) |
Families Citing this family (68)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10063717C1 (de) | 2000-12-20 | 2002-02-21 | Infineon Technologies Ag | Verfahren zur Abscheidung dünner Schichten durch Chemical Vapor Deposition |
| US6825447B2 (en) | 2000-12-29 | 2004-11-30 | Applied Materials, Inc. | Apparatus and method for uniform substrate heating and contaminate collection |
| US6998579B2 (en) | 2000-12-29 | 2006-02-14 | Applied Materials, Inc. | Chamber for uniform substrate heating |
| US6765178B2 (en) | 2000-12-29 | 2004-07-20 | Applied Materials, Inc. | Chamber for uniform substrate heating |
| US6660126B2 (en) | 2001-03-02 | 2003-12-09 | Applied Materials, Inc. | Lid assembly for a processing system to facilitate sequential deposition techniques |
| US6878206B2 (en) | 2001-07-16 | 2005-04-12 | Applied Materials, Inc. | Lid assembly for a processing system to facilitate sequential deposition techniques |
| KR100420117B1 (ko) * | 2001-03-12 | 2004-03-02 | 삼성전자주식회사 | 수소 확산방지막을 포함하는 반도체 장치 및 그 제조 방법 |
| US6849545B2 (en) | 2001-06-20 | 2005-02-01 | Applied Materials, Inc. | System and method to form a composite film stack utilizing sequential deposition techniques |
| US20030198754A1 (en) * | 2001-07-16 | 2003-10-23 | Ming Xi | Aluminum oxide chamber and process |
| US8110489B2 (en) | 2001-07-25 | 2012-02-07 | Applied Materials, Inc. | Process for forming cobalt-containing materials |
| WO2003030224A2 (en) | 2001-07-25 | 2003-04-10 | Applied Materials, Inc. | Barrier formation using novel sputter-deposition method |
| US20030029715A1 (en) | 2001-07-25 | 2003-02-13 | Applied Materials, Inc. | An Apparatus For Annealing Substrates In Physical Vapor Deposition Systems |
| US9051641B2 (en) | 2001-07-25 | 2015-06-09 | Applied Materials, Inc. | Cobalt deposition on barrier surfaces |
| US20090004850A1 (en) | 2001-07-25 | 2009-01-01 | Seshadri Ganguli | Process for forming cobalt and cobalt silicide materials in tungsten contact applications |
| US7085616B2 (en) | 2001-07-27 | 2006-08-01 | Applied Materials, Inc. | Atomic layer deposition apparatus |
| US6718126B2 (en) | 2001-09-14 | 2004-04-06 | Applied Materials, Inc. | Apparatus and method for vaporizing solid precursor for CVD or atomic layer deposition |
| US6936906B2 (en) | 2001-09-26 | 2005-08-30 | Applied Materials, Inc. | Integration of barrier layer and seed layer |
| US7049226B2 (en) | 2001-09-26 | 2006-05-23 | Applied Materials, Inc. | Integration of ALD tantalum nitride for copper metallization |
| US7780785B2 (en) | 2001-10-26 | 2010-08-24 | Applied Materials, Inc. | Gas delivery apparatus for atomic layer deposition |
| US6916398B2 (en) | 2001-10-26 | 2005-07-12 | Applied Materials, Inc. | Gas delivery apparatus and method for atomic layer deposition |
| US6773507B2 (en) * | 2001-12-06 | 2004-08-10 | Applied Materials, Inc. | Apparatus and method for fast-cycle atomic layer deposition |
| US6729824B2 (en) | 2001-12-14 | 2004-05-04 | Applied Materials, Inc. | Dual robot processing system |
| AU2003238853A1 (en) | 2002-01-25 | 2003-09-02 | Applied Materials, Inc. | Apparatus for cyclical deposition of thin films |
| US6998014B2 (en) | 2002-01-26 | 2006-02-14 | Applied Materials, Inc. | Apparatus and method for plasma assisted deposition |
| US6911391B2 (en) | 2002-01-26 | 2005-06-28 | Applied Materials, Inc. | Integration of titanium and titanium nitride layers |
| US6866746B2 (en) * | 2002-01-26 | 2005-03-15 | Applied Materials, Inc. | Clamshell and small volume chamber with fixed substrate support |
| US6972267B2 (en) | 2002-03-04 | 2005-12-06 | Applied Materials, Inc. | Sequential deposition of tantalum nitride using a tantalum-containing precursor and a nitrogen-containing precursor |
| US7186385B2 (en) | 2002-07-17 | 2007-03-06 | Applied Materials, Inc. | Apparatus for providing gas to a processing chamber |
| US6955211B2 (en) | 2002-07-17 | 2005-10-18 | Applied Materials, Inc. | Method and apparatus for gas temperature control in a semiconductor processing system |
| US7066194B2 (en) * | 2002-07-19 | 2006-06-27 | Applied Materials, Inc. | Valve design and configuration for fast delivery system |
| US6772072B2 (en) | 2002-07-22 | 2004-08-03 | Applied Materials, Inc. | Method and apparatus for monitoring solid precursor delivery |
| US6915592B2 (en) | 2002-07-29 | 2005-07-12 | Applied Materials, Inc. | Method and apparatus for generating gas to a processing chamber |
| JP4303925B2 (ja) | 2002-08-19 | 2009-07-29 | 篠田プラズマ株式会社 | 金属酸化膜の形成方法及びガス放電管の2次電子放出膜形成方法 |
| US6821563B2 (en) | 2002-10-02 | 2004-11-23 | Applied Materials, Inc. | Gas distribution system for cyclical layer deposition |
| US20040069227A1 (en) | 2002-10-09 | 2004-04-15 | Applied Materials, Inc. | Processing chamber configured for uniform gas flow |
| US6905737B2 (en) | 2002-10-11 | 2005-06-14 | Applied Materials, Inc. | Method of delivering activated species for rapid cyclical deposition |
| EP1420080A3 (de) | 2002-11-14 | 2005-11-09 | Applied Materials, Inc. | Vorrichtung und Verfahren zu hybriden chemischen Abscheidungsverfahren |
| US6868859B2 (en) * | 2003-01-29 | 2005-03-22 | Applied Materials, Inc. | Rotary gas valve for pulsing a gas |
| US6994319B2 (en) * | 2003-01-29 | 2006-02-07 | Applied Materials, Inc. | Membrane gas valve for pulsing a gas |
| US20040177813A1 (en) | 2003-03-12 | 2004-09-16 | Applied Materials, Inc. | Substrate support lift mechanism |
| DE10325629A1 (de) * | 2003-03-21 | 2004-10-07 | Forschungszentrum Jülich GmbH | Verfahren zur Abscheidung von Verbindungen auf einem Substrat mittels metallorganischer Gasphasendeposition |
| US20070031991A1 (en) * | 2003-03-21 | 2007-02-08 | Forschungszentrum Julich Gmbh | Method for depositing compounds on a substrate by means of metalorganic chemical vapor deposition |
| US7342984B1 (en) | 2003-04-03 | 2008-03-11 | Zilog, Inc. | Counting clock cycles over the duration of a first character and using a remainder value to determine when to sample a bit of a second character |
| US20040198069A1 (en) | 2003-04-04 | 2004-10-07 | Applied Materials, Inc. | Method for hafnium nitride deposition |
| KR100505064B1 (ko) | 2003-05-06 | 2005-07-29 | 삼성전자주식회사 | 반도체 소자의 산화방법 및 이를 이용한 산화막 형성방법 |
| US20050067103A1 (en) * | 2003-09-26 | 2005-03-31 | Applied Materials, Inc. | Interferometer endpoint monitoring device |
| US20050252449A1 (en) | 2004-05-12 | 2005-11-17 | Nguyen Son T | Control of gas flow and delivery to suppress the formation of particles in an MOCVD/ALD system |
| US8323754B2 (en) | 2004-05-21 | 2012-12-04 | Applied Materials, Inc. | Stabilization of high-k dielectric materials |
| US8119210B2 (en) | 2004-05-21 | 2012-02-21 | Applied Materials, Inc. | Formation of a silicon oxynitride layer on a high-k dielectric material |
| US7402534B2 (en) | 2005-08-26 | 2008-07-22 | Applied Materials, Inc. | Pretreatment processes within a batch ALD reactor |
| US7464917B2 (en) | 2005-10-07 | 2008-12-16 | Appiled Materials, Inc. | Ampoule splash guard apparatus |
| US20070128862A1 (en) | 2005-11-04 | 2007-06-07 | Paul Ma | Apparatus and process for plasma-enhanced atomic layer deposition |
| KR100725098B1 (ko) * | 2005-11-17 | 2007-06-04 | 삼성전자주식회사 | 반도체 제조설비의 유량조절기 오동작 감지장치 및 그 방법 |
| US20070151668A1 (en) | 2006-01-04 | 2007-07-05 | Tokyo Electron Limited | Gas supply system, substrate processing apparatus, and gas supply method |
| US7798096B2 (en) | 2006-05-05 | 2010-09-21 | Applied Materials, Inc. | Plasma, UV and ion/neutral assisted ALD or CVD in a batch tool |
| US7601648B2 (en) | 2006-07-31 | 2009-10-13 | Applied Materials, Inc. | Method for fabricating an integrated gate dielectric layer for field effect transistors |
| US8092695B2 (en) * | 2006-10-30 | 2012-01-10 | Applied Materials, Inc. | Endpoint detection for photomask etching |
| US20080099436A1 (en) * | 2006-10-30 | 2008-05-01 | Michael Grimbergen | Endpoint detection for photomask etching |
| US7775508B2 (en) | 2006-10-31 | 2010-08-17 | Applied Materials, Inc. | Ampoule for liquid draw and vapor draw with a continuous level sensor |
| US8821637B2 (en) | 2007-01-29 | 2014-09-02 | Applied Materials, Inc. | Temperature controlled lid assembly for tungsten nitride deposition |
| US8297223B2 (en) * | 2007-10-02 | 2012-10-30 | Msp Corporation | Method and apparatus for particle filtration and enhancing tool performance in film deposition |
| US8146896B2 (en) | 2008-10-31 | 2012-04-03 | Applied Materials, Inc. | Chemical precursor ampoule for vapor deposition processes |
| US8778204B2 (en) | 2010-10-29 | 2014-07-15 | Applied Materials, Inc. | Methods for reducing photoresist interference when monitoring a target layer in a plasma process |
| US8961804B2 (en) | 2011-10-25 | 2015-02-24 | Applied Materials, Inc. | Etch rate detection for photomask etching |
| US8808559B2 (en) | 2011-11-22 | 2014-08-19 | Applied Materials, Inc. | Etch rate detection for reflective multi-material layers etching |
| US8900469B2 (en) | 2011-12-19 | 2014-12-02 | Applied Materials, Inc. | Etch rate detection for anti-reflective coating layer and absorber layer etching |
| US9805939B2 (en) | 2012-10-12 | 2017-10-31 | Applied Materials, Inc. | Dual endpoint detection for advanced phase shift and binary photomasks |
| US8778574B2 (en) | 2012-11-30 | 2014-07-15 | Applied Materials, Inc. | Method for etching EUV material layers utilized to form a photomask |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0861683A2 (de) * | 1997-02-24 | 1998-09-02 | Applied Materials, Inc. | Verfahren und Vorrichtung zur Verminderung von Abgasen |
| US5876798A (en) * | 1997-12-29 | 1999-03-02 | Chartered Semiconductor Manufacturing, Ltd. | Method of fluorinated silicon oxide film deposition |
| US5928428A (en) * | 1996-02-23 | 1999-07-27 | Mitsubishi Denki Kabushiki Kaisha | Apparatus and method for manufacturing a semiconductor device |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56114809A (en) | 1980-02-12 | 1981-09-09 | Toshiba Corp | Ozonizer |
| JP2888253B2 (ja) * | 1989-07-20 | 1999-05-10 | 富士通株式会社 | 化学気相成長法およびその実施のための装置 |
| JPH04196528A (ja) * | 1990-11-28 | 1992-07-16 | Toshiba Corp | マグネトロンエッチング装置 |
| JPH05247654A (ja) | 1991-03-19 | 1993-09-24 | Babcock Hitachi Kk | 光励起cvd装置 |
| JPH05234882A (ja) | 1992-02-21 | 1993-09-10 | Hitachi Ltd | 表面処理装置 |
| JP3174856B2 (ja) * | 1993-05-07 | 2001-06-11 | 日本エア・リキード株式会社 | 混合ガス供給装置 |
| US5352615A (en) * | 1994-01-24 | 1994-10-04 | Motorola, Inc. | Denuding a semiconductor substrate |
| KR100373434B1 (ko) * | 1995-12-15 | 2003-05-16 | 실리콘 밸리 그룹 써어멀 시스템즈, 엘엘씨 | 감소된금속오염물질을갖는유전체막형성방법 |
| US6004397A (en) * | 1996-05-16 | 1999-12-21 | Lg Semicon Co., Ltd. | TEOS-O3 oxidizing film depositing system and process for supplying ozone (O3) thereto |
| US5976471A (en) * | 1997-04-16 | 1999-11-02 | Lockheed Martin Energy Systems, Inc. | Ozone decomposing filter |
-
1999
- 1999-12-17 KR KR1019990058541A patent/KR100330749B1/ko not_active Expired - Lifetime
-
2000
- 2000-11-30 US US09/726,977 patent/US6740166B2/en not_active Expired - Fee Related
- 2000-12-07 TW TW089126057A patent/TW466565B/zh not_active IP Right Cessation
- 2000-12-13 SG SG200007424A patent/SG98002A1/en unknown
- 2000-12-13 JP JP2000378316A patent/JP3481586B2/ja not_active Expired - Fee Related
- 2000-12-15 EP EP00311218A patent/EP1108468B1/de not_active Expired - Lifetime
- 2000-12-15 AT AT00311218T patent/ATE268217T1/de not_active IP Right Cessation
- 2000-12-15 DE DE60011215T patent/DE60011215T2/de not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5928428A (en) * | 1996-02-23 | 1999-07-27 | Mitsubishi Denki Kabushiki Kaisha | Apparatus and method for manufacturing a semiconductor device |
| EP0861683A2 (de) * | 1997-02-24 | 1998-09-02 | Applied Materials, Inc. | Verfahren und Vorrichtung zur Verminderung von Abgasen |
| US5876798A (en) * | 1997-12-29 | 1999-03-02 | Chartered Semiconductor Manufacturing, Ltd. | Method of fluorinated silicon oxide film deposition |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100330749B1 (ko) | 2002-04-03 |
| JP3481586B2 (ja) | 2003-12-22 |
| US6740166B2 (en) | 2004-05-25 |
| JP2001217232A (ja) | 2001-08-10 |
| TW466565B (en) | 2001-12-01 |
| EP1108468A1 (de) | 2001-06-20 |
| DE60011215T2 (de) | 2005-07-07 |
| KR20010056876A (ko) | 2001-07-04 |
| EP1108468B1 (de) | 2004-06-02 |
| ATE268217T1 (de) | 2004-06-15 |
| DE60011215D1 (de) | 2004-07-08 |
| US20020134307A1 (en) | 2002-09-26 |
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