TH1305C3 - Lead-free high temperature solder - Google Patents
Lead-free high temperature solderInfo
- Publication number
- TH1305C3 TH1305C3 TH303001328U TH0303001328U TH1305C3 TH 1305 C3 TH1305 C3 TH 1305C3 TH 303001328 U TH303001328 U TH 303001328U TH 0303001328 U TH0303001328 U TH 0303001328U TH 1305 C3 TH1305 C3 TH 1305C3
- Authority
- TH
- Thailand
- Prior art keywords
- lead
- high temperature
- free high
- temperature solder
- weight
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical group [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract 2
- 229910052802 copper Inorganic materials 0.000 claims abstract 2
- 239000010949 copper Substances 0.000 claims abstract 2
- 229910052709 silver Inorganic materials 0.000 claims abstract 2
- 239000004332 silver Substances 0.000 claims abstract 2
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 abstract 2
- 229910052751 metal Inorganic materials 0.000 abstract 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 150000002739 metals Chemical class 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
Abstract
โลหะบัดกรีอุณหภูมิสูงชนิดไร้สารตะกั่วผสม ซึ่งมีส่วนประกอบของโลหะต่างๆ อยู่ในเนื้อของโลหะ บัดกรีและที่ใช้เป็นส่วนประกอบในขั้นตอนกระบวนการประดิษฐ์ ผลิตภัณฑ์ ประกอบด้วย เงิน 3.0 ~4.60 % โดยน้ำหนัก ทองแดง มากกว่า 1.50 ~ 3.50 % โดยน้ำหนักและค่าสมดุลจะเป็นดีบุก Lead-free high temperature solder paste Which contains various metals In the texture of the metal Solder and as a component in the fabrication process, the product contains silver 3.0 ~ 4.60% by weight, copper greater than 1.50 ~ 3.50% by weight and the balance is tin.
Claims (1)
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TH1305A3 TH1305A3 (en) | 2004-03-26 |
| TH1305C3 true TH1305C3 (en) | 2004-03-26 |
Family
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