TH8819A - Copper-doped low melting point solder for assembly and re-soldering - Google Patents

Abstract

Copper low melting point compound disclosed for reclaiming and re-soldering of copper substrates The amount of copper required to contain in the solder to inhibit the melting of the copper surface to be soldered. It has been found to be an intrusion level below the eutectic point of the tin-copper bilateral.

Claims (3)

1.Low melting point ingredients The solder contains the following approximate weight: 54% tin / 26% lead / 20% indium and tainted with copper approximately 0.12 to 0.20% by weight. 2.Electronic devices containing copper Including a low melting point solder mixture It contains approximately 54% / tin / 26% lead / 20% indium and is doped with approximately 0.12 to 0.20% copper by weight. 3. Methods for making electronic devices that consist of at least one process of soldering over a metal with a specified approximate compound as follows: 54% Tin / 26% Lead / 20% India. M and was tainted with copper approximately 0.12 to 0.20% by weight.