TW200419763A - Multi-chips stacked package - Google Patents

Multi-chips stacked package

Info

Publication number
TW200419763A
TW200419763A TW092106422A TW92106422A TW200419763A TW 200419763 A TW200419763 A TW 200419763A TW 092106422 A TW092106422 A TW 092106422A TW 92106422 A TW92106422 A TW 92106422A TW 200419763 A TW200419763 A TW 200419763A
Authority
TW
Taiwan
Prior art keywords
substrate
supporting
stacked package
chips stacked
chip
Prior art date
Application number
TW092106422A
Other languages
English (en)
Other versions
TWI317549B (en
Inventor
Chih-Ming Chung
Sung-Fei Wang
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW092106422A priority Critical patent/TWI317549B/zh
Priority to US10/747,036 priority patent/US20040183180A1/en
Publication of TW200419763A publication Critical patent/TW200419763A/zh
Application granted granted Critical
Publication of TWI317549B publication Critical patent/TWI317549B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H10W74/117—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations the substrate having spherical bumps for external connection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/231—Configurations of stacked chips the stacked chips being on both top and bottom sides of an auxiliary carrier having no electrical connection structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/291—Configurations of stacked chips characterised by containers, encapsulations, or other housings for the stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
TW092106422A 2003-03-21 2003-03-21 Multi-chips stacked package TWI317549B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW092106422A TWI317549B (en) 2003-03-21 2003-03-21 Multi-chips stacked package
US10/747,036 US20040183180A1 (en) 2003-03-21 2003-12-30 Multi-chips stacked package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW092106422A TWI317549B (en) 2003-03-21 2003-03-21 Multi-chips stacked package

Publications (2)

Publication Number Publication Date
TW200419763A true TW200419763A (en) 2004-10-01
TWI317549B TWI317549B (en) 2009-11-21

Family

ID=32986191

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092106422A TWI317549B (en) 2003-03-21 2003-03-21 Multi-chips stacked package

Country Status (2)

Country Link
US (1) US20040183180A1 (zh)
TW (1) TWI317549B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114496813A (zh) * 2022-01-24 2022-05-13 西安微电子技术研究所 一种裸芯片的堆叠方法

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* Cited by examiner, † Cited by third party
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US7479407B2 (en) * 2002-11-22 2009-01-20 Freescale Semiconductor, Inc. Digital and RF system and method therefor
US7205651B2 (en) * 2004-04-16 2007-04-17 St Assembly Test Services Ltd. Thermally enhanced stacked die package and fabrication method
TWI237882B (en) * 2004-05-11 2005-08-11 Via Tech Inc Stacked multi-chip package
KR100639701B1 (ko) * 2004-11-17 2006-10-30 삼성전자주식회사 멀티칩 패키지
KR100593703B1 (ko) * 2004-12-10 2006-06-30 삼성전자주식회사 돌출부 와이어 본딩 구조 보강용 더미 칩을 포함하는반도체 칩 적층 패키지
JP2006216911A (ja) * 2005-02-07 2006-08-17 Renesas Technology Corp 半導体装置およびカプセル型半導体パッケージ
JP4408832B2 (ja) * 2005-05-20 2010-02-03 Ｎｅｃエレクトロニクス株式会社 半導体装置
CN100541782C (zh) * 2005-09-30 2009-09-16 日月光半导体制造股份有限公司 具有堆叠平台之封装结构及其封装方法
US7829986B2 (en) * 2006-04-01 2010-11-09 Stats Chippac Ltd. Integrated circuit package system with net spacer
KR100809693B1 (ko) * 2006-08-01 2008-03-06 삼성전자주식회사 하부 반도체 칩에 대한 신뢰도가 개선된 수직 적층형멀티칩 패키지 및 그 제조방법
WO2008018058A1 (en) * 2006-08-07 2008-02-14 Sandisk Il Ltd. Inverted pyramid multi-die package reducing wire sweep and weakening torques
US7683460B2 (en) * 2006-09-22 2010-03-23 Infineon Technologies Ag Module with a shielding and/or heat dissipating element
US7906844B2 (en) * 2006-09-26 2011-03-15 Compass Technology Co. Ltd. Multiple integrated circuit die package with thermal performance
US20080197468A1 (en) * 2007-02-15 2008-08-21 Advanced Semiconductor Engineering, Inc. Package structure and manufacturing method thereof
JP2011077108A (ja) * 2009-09-29 2011-04-14 Elpida Memory Inc 半導体装置
US8404518B2 (en) * 2009-12-13 2013-03-26 Stats Chippac Ltd. Integrated circuit packaging system with package stacking and method of manufacture thereof
WO2012020064A1 (en) * 2010-08-10 2012-02-16 St-Ericsson Sa Packaging an integrated circuit die
TWI419270B (zh) * 2011-03-24 2013-12-11 南茂科技股份有限公司 封裝堆疊結構
TW201351599A (zh) * 2012-06-04 2013-12-16 矽品精密工業股份有限公司 半導體封裝件及其製法
TWI642150B (zh) * 2017-08-15 2018-11-21 Kingpak Technology Inc. 堆疊式感測器封裝結構
US10340250B2 (en) * 2017-08-15 2019-07-02 Kingpak Technology Inc. Stack type sensor package structure
CN107579048A (zh) * 2017-09-27 2018-01-12 江苏长电科技股份有限公司 一种改善多芯片堆叠装片的结构及其工艺方法
TWI667752B (zh) * 2018-05-18 2019-08-01 勝麗國際股份有限公司 感測器封裝結構
CN110518027B (zh) * 2018-05-21 2021-10-29 胜丽国际股份有限公司 感测器封装结构
CN111477621B (zh) * 2020-06-28 2020-09-15 甬矽电子(宁波)股份有限公司 芯片封装结构、其制作方法和电子设备
GB2603920B (en) * 2021-02-18 2023-02-22 Zhuzhou Crrc Times Electric Uk Innovation Center Power Semiconductor package

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5273940A (en) * 1992-06-15 1993-12-28 Motorola, Inc. Multiple chip package with thinned semiconductor chips
US5739581A (en) * 1995-11-17 1998-04-14 National Semiconductor Corporation High density integrated circuit package assembly with a heatsink between stacked dies
US6737750B1 (en) * 2001-12-07 2004-05-18 Amkor Technology, Inc. Structures for improving heat dissipation in stacked semiconductor packages

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114496813A (zh) * 2022-01-24 2022-05-13 西安微电子技术研究所 一种裸芯片的堆叠方法

Also Published As

Publication number Publication date
US20040183180A1 (en) 2004-09-23
TWI317549B (en) 2009-11-21

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