TW200519988A - Method of production of multilayer ceramic electronic device - Google Patents

Method of production of multilayer ceramic electronic device

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Publication number
TW200519988A
TW200519988A TW093131961A TW93131961A TW200519988A TW 200519988 A TW200519988 A TW 200519988A TW 093131961 A TW093131961 A TW 093131961A TW 93131961 A TW93131961 A TW 93131961A TW 200519988 A TW200519988 A TW 200519988A
Authority
TW
Taiwan
Prior art keywords
multilayer ceramic
annealing
production
electronic device
ceramic electronic
Prior art date
Application number
TW093131961A
Other languages
English (en)
Other versions
TWI241604B (en
Inventor
Yasuo Watanabe
Kenta Endoh
Wataru Takahara
Original Assignee
Tdk Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tdk Corp filed Critical Tdk Corp
Publication of TW200519988A publication Critical patent/TW200519988A/zh
Application granted granted Critical
Publication of TWI241604B publication Critical patent/TWI241604B/zh

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    • C04B35/49—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zirconium or hafnium oxides, zirconates, zircon or hafnates containing also titanium oxides or titanates
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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TW093131961A 2003-10-31 2004-10-21 Method of production of multilayer ceramic electronic device TWI241604B (en)

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CN101176171B (zh) * 2005-05-10 2011-03-16 株式会社村田制作所 薄膜电容器的制造方法
WO2007139061A1 (ja) * 2006-05-31 2007-12-06 Murata Manufacturing Co., Ltd. 半導体セラミック、積層型半導体セラミックコンデンサ、半導体セラミックの製造方法、及び積層型半導体セラミックコンデンサの製造方法
CN102148261B (zh) * 2010-02-10 2013-01-23 中国科学院微电子研究所 电容器结构的制造方法
US9779874B2 (en) * 2011-07-08 2017-10-03 Kemet Electronics Corporation Sintering of high temperature conductive and resistive pastes onto temperature sensitive and atmospheric sensitive materials
JP5838927B2 (ja) * 2011-10-14 2016-01-06 Tdk株式会社 積層セラミック電子部品
WO2014069493A1 (en) * 2012-11-02 2014-05-08 Canon Kabushiki Kaisha Piezoelectric material, piezoelectric element, and electronic equipment
TWI545814B (zh) * 2012-11-02 2016-08-11 佳能股份有限公司 壓電式材料、壓電式元件及電子設備
KR102183423B1 (ko) * 2014-12-08 2020-11-26 삼성전기주식회사 유전체 자기 조성물 및 이를 포함하는 적층 세라믹 커패시터
US11148979B2 (en) 2017-10-31 2021-10-19 James R. Glidewell Dental Ceramics, Inc. Process for forming sintered ceramic bodies having improved properties
JP7279615B2 (ja) * 2019-11-05 2023-05-23 株式会社村田製作所 積層セラミックコンデンサ
CN112082667B (zh) * 2020-09-02 2022-08-16 苏州热工研究院有限公司 一种薄膜铂电阻温度传感器及其制造方法
JP2023094993A (ja) * 2021-12-24 2023-07-06 太陽誘電株式会社 積層セラミック電子部品の製造方法
CN116332626A (zh) * 2023-02-15 2023-06-27 中国振华集团云科电子有限公司 一种高温稳定型陶瓷粉及其陶瓷基板的制备方法
KR20250074931A (ko) * 2023-11-21 2025-05-28 삼성전기주식회사 적층형 전자 부품

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