TW200601921A - Substrate for forming printed circuit, printed circuit board and method of forming metallic thin layer thereon - Google Patents

Substrate for forming printed circuit, printed circuit board and method of forming metallic thin layer thereon

Info

Publication number
TW200601921A
TW200601921A TW094119239A TW94119239A TW200601921A TW 200601921 A TW200601921 A TW 200601921A TW 094119239 A TW094119239 A TW 094119239A TW 94119239 A TW94119239 A TW 94119239A TW 200601921 A TW200601921 A TW 200601921A
Authority
TW
Taiwan
Prior art keywords
metal
printed circuit
forming
thin layer
metallic thin
Prior art date
Application number
TW094119239A
Other languages
English (en)
Other versions
TWI350721B (en
Inventor
Toshiki Naito
Hiroshi Yamazaki
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of TW200601921A publication Critical patent/TW200601921A/zh
Application granted granted Critical
Publication of TWI350721B publication Critical patent/TWI350721B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Physical Vapour Deposition (AREA)
  • Structure Of Printed Boards (AREA)
TW094119239A 2004-06-17 2005-06-10 Substrate for forming printed circuit, printed circuit board and method of forming metallic thin layer thereon TWI350721B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004180245A JP3962039B2 (ja) 2004-06-17 2004-06-17 配線回路形成用基板、配線回路基板および金属薄層の形成方法

Publications (2)

Publication Number Publication Date
TW200601921A true TW200601921A (en) 2006-01-01
TWI350721B TWI350721B (en) 2011-10-11

Family

ID=34936692

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094119239A TWI350721B (en) 2004-06-17 2005-06-10 Substrate for forming printed circuit, printed circuit board and method of forming metallic thin layer thereon

Country Status (6)

Country Link
US (1) US7417316B2 (zh)
EP (1) EP1608211A3 (zh)
JP (1) JP3962039B2 (zh)
KR (1) KR101120526B1 (zh)
CN (1) CN1725933B (zh)
TW (1) TWI350721B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI398933B (zh) * 2008-03-05 2013-06-11 榮創能源科技股份有限公司 積體電路元件之封裝結構及其製造方法

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7804172B2 (en) * 2006-01-10 2010-09-28 Halliburton Energy Services, Inc. Electrical connections made with dissimilar metals
CN101489346B (zh) * 2008-01-15 2011-11-16 欣兴电子股份有限公司 线路板的图案化结构
FR2943072B1 (fr) * 2009-03-12 2019-08-16 Centre National De La Recherche Scientifique Cnrs Decoration par pulverisation plasma magnetron sur des contenants en verre pour les secteurs de la cosmetique.
CN101840988A (zh) * 2010-04-22 2010-09-22 傲迪特半导体(南京)有限公司 汽车前大灯发热pcb基台及其制作方法
EP3030061B1 (en) * 2013-07-29 2021-01-06 Kyocera Corporation Wiring substrate, wiring substrate with lead, and electronic device
TWI488549B (zh) * 2014-03-07 2015-06-11 Azotek Co Ltd 金屬基板及其製作方法
JP2015133167A (ja) * 2015-04-22 2015-07-23 大日本印刷株式会社 サスペンション用基板、サスペンション、素子付サスペンション、およびハードディスクドライブ
US10180708B2 (en) 2016-05-24 2019-01-15 Microsoft Technology Licensing, Llc Curved circuit board
KR20180058626A (ko) * 2016-11-24 2018-06-01 주식회사 아모그린텍 평판 케이블 제조 방법
CN108055790B (zh) * 2017-12-06 2019-10-18 深圳市和美源电子有限公司 一种电路板及其制作方法和应用
KR102847046B1 (ko) * 2019-05-08 2025-08-18 삼성디스플레이 주식회사 표시 장치 및 표시 장치의 제조 방법

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1097234B (de) * 1958-06-26 1961-01-12 Bosch Gmbh Robert Verfahren zum UEberziehen von Gegenstaenden mit Silber durch Aufdampfen im Vakuum unter Verwendung einer hafterhoehenden Chromzwischenschicht
LU46411A1 (zh) * 1964-06-27 1972-01-01
US3881884A (en) * 1973-10-12 1975-05-06 Ibm Method for the formation of corrosion resistant electronic interconnections
US4917963A (en) * 1988-10-28 1990-04-17 Andus Corporation Graded composition primer layer
JPH0382188A (ja) * 1989-08-25 1991-04-08 Kyocera Corp セラミック配線基板の製造方法
JPH04235272A (ja) 1991-01-11 1992-08-24 Kobe Steel Ltd 耐食性及び加工性に優れた蒸着Ａｌ−Ｍｎ系合金めっき材およびその製造方法
JP3422371B2 (ja) 1993-01-13 2003-06-30 石川島播磨重工業株式会社 連続真空蒸着方法
US5874174A (en) * 1995-08-09 1999-02-23 Matsushita Electric Industrial Co., Ltd. Conductor film and its forming method
JPH1192579A (ja) 1997-09-19 1999-04-06 Nitto Denko Corp 有機基材のプラズマ処理方法及び有機基材への金属層形成方法
JPH11158613A (ja) 1997-12-01 1999-06-15 Canon Inc 電極基板、及び該電極基板の製造方法
US6328858B1 (en) * 1998-10-01 2001-12-11 Nexx Systems Packaging, Llc Multi-layer sputter deposition apparatus
JP4430165B2 (ja) 1999-09-02 2010-03-10 日東電工株式会社 真空薄膜形成装置および真空薄膜形成方法
JP2003318533A (ja) 2002-04-24 2003-11-07 Toyo Metallizing Co Ltd フレキシブルプリント配線用基板
TW587322B (en) * 2002-12-31 2004-05-11 Phoenix Prec Technology Corp Substrate with stacked via and fine circuit thereon, and method for fabricating the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI398933B (zh) * 2008-03-05 2013-06-11 榮創能源科技股份有限公司 積體電路元件之封裝結構及其製造方法

Also Published As

Publication number Publication date
EP1608211A2 (en) 2005-12-21
US7417316B2 (en) 2008-08-26
CN1725933A (zh) 2006-01-25
JP3962039B2 (ja) 2007-08-22
CN1725933B (zh) 2010-10-06
EP1608211A3 (en) 2007-10-17
KR20060049235A (ko) 2006-05-18
KR101120526B1 (ko) 2012-02-24
TWI350721B (en) 2011-10-11
JP2006005176A (ja) 2006-01-05
US20050280153A1 (en) 2005-12-22

Similar Documents

Publication Publication Date Title
WO2009060821A1 (ja) 回路基板及びその製造方法
TW200601921A (en) Substrate for forming printed circuit, printed circuit board and method of forming metallic thin layer thereon
DE502004007078D1 (de) Dünnschichtanordnung und verfahren zum herstellen einer solchen dünnschichtanordnung
TW200625485A (en) Method of manufacturing a circuit substrate and method of manufacturing an electronic parts packaging structure
MY163049A (en) Method for reducing creep corrosion
EP1956875A3 (en) Wired circuit board and method for producing the same
TW200507218A (en) Layout circuit substrate, manufacturing method of layout circuit substrate, and circuit module
GB201316916D0 (en) A non-deleterious technique for creating continuous conductive circuits upon the surfaces of a non-conductive substrate
TW200603698A (en) Methods of forming solder bumps on exposed metal pads and related structures
TW200520662A (en) Multi-layer printed circuit board and fabricating method thereof
TW200746938A (en) Circuit board and connection board
WO2008087851A1 (ja) フレキシブル基板及び半導体装置
TW200641918A (en) Method for manufacturing base material provided with conductor layer pattern, base material provided with conductor layer pattern and electromagnetic wave blocking member using such base material
JP2006005176A5 (zh)
TW200943496A (en) Support substrate structure for supporting electronic component thereon and manufacturing method thereof
TW200616519A (en) Method for fabricating electrical connections of circuit board
TW200702189A (en) Method of manufacturing multi-layered substrate
TW200705589A (en) Printed circuit board
EP1619719A3 (en) Method of manufacturing a wiring board including electroplating
TW200605184A (en) Coated copper, method for inhibiting the occurrence of whisker, printing wiring board, and semiconductor device
TW200629432A (en) Method of manufacturing a wiring substrate and an electronic instrument
TW200640317A (en) Flexible printed wiring board, method for fabricating flexible printed wiring board, and semiconductor device
TW200802766A (en) Substrate strip and substrate structure and method for manufacturing the same
TW200640311A (en) A method of manufacturing a film printed circuit board
RU2008125209A (ru) Способ изготовления печатных плат с встроенными резисторами

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees