TW200604012A - Method of manufacturing color filter substrate, method of manufacturing electro-optical device, the electro-optical device and electronic apparatus - Google Patents

Method of manufacturing color filter substrate, method of manufacturing electro-optical device, the electro-optical device and electronic apparatus

Info

Publication number
TW200604012A
TW200604012A TW094116166A TW94116166A TW200604012A TW 200604012 A TW200604012 A TW 200604012A TW 094116166 A TW094116166 A TW 094116166A TW 94116166 A TW94116166 A TW 94116166A TW 200604012 A TW200604012 A TW 200604012A
Authority
TW
Taiwan
Prior art keywords
electro
optical device
manufacturing
functional region
color filter
Prior art date
Application number
TW094116166A
Other languages
English (en)
Other versions
TWI259803B (en
Inventor
Hideyuki Kimura
Shunichi Seki
Naoki Yamamoto
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of TW200604012A publication Critical patent/TW200604012A/zh
Application granted granted Critical
Publication of TWI259803B publication Critical patent/TWI259803B/zh

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D31/00—Other cooling or freezing apparatus
    • F25D31/002—Liquid coolers, e.g. beverage cooler
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B67—OPENING, CLOSING OR CLEANING BOTTLES, JARS OR SIMILAR CONTAINERS; LIQUID HANDLING
    • B67D—DISPENSING, DELIVERING OR TRANSFERRING LIQUIDS, NOT OTHERWISE PROVIDED FOR
    • B67D1/00—Apparatus or devices for dispensing beverages on draught
    • B67D1/0042—Details of specific parts of the dispensers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/70—Testing, e.g. accelerated lifetime tests
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B67—OPENING, CLOSING OR CLEANING BOTTLES, JARS OR SIMILAR CONTAINERS; LIQUID HANDLING
    • B67D—DISPENSING, DELIVERING OR TRANSFERRING LIQUIDS, NOT OTHERWISE PROVIDED FOR
    • B67D1/00—Apparatus or devices for dispensing beverages on draught
    • B67D2001/0095—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/302—Details of OLEDs of OLED structures
    • H10K2102/3023—Direction of light emission
    • H10K2102/3026—Top emission
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/15—Deposition of organic active material using liquid deposition, e.g. spin coating characterised by the solvent used
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H10K71/441—Thermal treatment, e.g. annealing in the presence of a solvent vapour in the presence of solvent vapors, e.g. solvent vapour annealing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Electroluminescent Light Sources (AREA)
  • Optical Filters (AREA)
  • Ink Jet (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
TW094116166A 2004-05-19 2005-05-18 Method of manufacturing color filter substrate, method of manufacturing electro-optical device, electro-optical device, and electronic apparatus TWI259803B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004149168 2004-05-19
JP2005095183A JP4055171B2 (ja) 2004-05-19 2005-03-29 カラーフィルタ基板の製造方法、電気光学装置の製造方法、電気光学装置、電子機器

Publications (2)

Publication Number Publication Date
TW200604012A true TW200604012A (en) 2006-02-01
TWI259803B TWI259803B (en) 2006-08-11

Family

ID=34936399

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094116166A TWI259803B (en) 2004-05-19 2005-05-18 Method of manufacturing color filter substrate, method of manufacturing electro-optical device, electro-optical device, and electronic apparatus

Country Status (5)

Country Link
US (1) US7459177B2 (zh)
EP (1) EP1598880B1 (zh)
JP (1) JP4055171B2 (zh)
KR (1) KR100691707B1 (zh)
TW (1) TWI259803B (zh)

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US7928537B2 (en) * 2006-03-31 2011-04-19 Fujifilm Corporation Organic electroluminescent device
JP4935171B2 (ja) * 2006-04-24 2012-05-23 セイコーエプソン株式会社 膜形成方法、電気光学基板の製造方法、及び電気光学装置の製造方法、並びに機能膜、電気光学基板、電気光学装置、及び電子機器
CN101432141B (zh) 2006-08-28 2012-01-18 佳能株式会社 图像数据生成设备、图像打印设备和图像数据生成方法
JP4797930B2 (ja) * 2006-10-30 2011-10-19 セイコーエプソン株式会社 表示装置の製造方法
JP5017584B2 (ja) * 2007-08-02 2012-09-05 株式会社ジャパンディスプレイイースト 有機ｅｌ表示装置
JP4957477B2 (ja) * 2007-09-18 2012-06-20 セイコーエプソン株式会社 有機ｅｌ装置の製造方法
JP2009081097A (ja) * 2007-09-27 2009-04-16 Seiko Epson Corp 電気光学装置および電子機器
JP5338266B2 (ja) * 2007-11-20 2013-11-13 セイコーエプソン株式会社 有機エレクトロルミネッセンス装置および有機エレクトロルミネッセンス装置の製造方法
JP4978438B2 (ja) * 2007-11-21 2012-07-18 セイコーエプソン株式会社 成膜方法
US8616666B2 (en) * 2007-12-10 2013-12-31 E I Du Pont De Nemours And Company Multicolor electronic devices and processes of forming the same by printing
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JP5256841B2 (ja) * 2008-05-01 2013-08-07 セイコーエプソン株式会社 機能液滴吐出ヘッドの吐出検査方法および機能液滴吐出ヘッドの吐出検査装置
TW201005813A (en) 2008-05-15 2010-02-01 Du Pont Process for forming an electroactive layer
WO2010048269A2 (en) * 2008-10-21 2010-04-29 E. I. Du Pont De Nemours And Company Multicolor electronic devices and processes of forming the same by printing
TW201039382A (en) * 2009-03-06 2010-11-01 Du Pont Process for forming an electroactive layer
EP2406813A4 (en) 2009-03-09 2012-07-25 Du Pont METHOD FOR FORMING AN ELECTROACTIVE LAYER
US9209397B2 (en) 2009-03-09 2015-12-08 Dupont Displays Inc Process for forming an electroactive layer
CN102449805B (zh) * 2009-06-04 2015-06-10 E.I.内穆尔杜邦公司 多色电子器件及通过印刷来形成该器件的方法
US9240435B2 (en) * 2009-06-11 2016-01-19 Joled Inc Organic EL display
JP4951151B2 (ja) 2009-06-29 2012-06-13 パナソニック株式会社 有機ｅｌディスプレイパネル
JP5326999B2 (ja) * 2009-11-04 2013-10-30 セイコーエプソン株式会社 有機ｅｌ装置、有機ｅｌ装置の製造方法、電子機器
JP4920115B2 (ja) * 2011-04-04 2012-04-18 芝浦メカトロニクス株式会社 溶液の塗布装置及び塗布方法
CN103918351A (zh) 2011-11-09 2014-07-09 昭和电工株式会社 发光装置和发光装置的制造方法
JP5974601B2 (ja) * 2012-04-13 2016-08-23 株式会社Ｊｏｌｅｄ デバイスの製造方法
WO2014108931A1 (ja) * 2013-01-08 2014-07-17 ナカンテクノ株式会社 低粘度薄膜印刷における乾燥ムラ軽減方法と該方法が適用される印刷パターン
JP2015103427A (ja) * 2013-11-26 2015-06-04 株式会社ジャパンディスプレイ 表示装置の製造方法
KR102269134B1 (ko) * 2014-09-29 2021-06-25 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 유기 발광 표시 장치용 증착 마스크
JP2016147223A (ja) * 2015-02-12 2016-08-18 東レエンジニアリング株式会社 インクジェット塗布方法およびインクジェット塗布装置
JP6484487B2 (ja) * 2015-04-06 2019-03-13 株式会社ジャパンディスプレイ 表示装置の製造方法及び表示装置
CN105489632A (zh) * 2016-01-15 2016-04-13 京东方科技集团股份有限公司 Oled阵列基板及其制造方法、oled显示面板和oled显示装置
CN107123751B (zh) * 2017-04-28 2019-04-16 武汉华星光电技术有限公司 一种柔性有机发光二极管显示器及其制作方法
JP2019008962A (ja) * 2017-06-23 2019-01-17 株式会社Ｊｏｌｅｄ 有機ｅｌ表示パネル及び有機ｅｌ表示パネルの製造方法
WO2019021370A1 (ja) * 2017-07-25 2019-01-31 シャープ株式会社 塗布装置、ｅｌデバイス製造装置およびｅｌデバイス
KR102491393B1 (ko) * 2017-12-07 2023-01-20 엘지디스플레이 주식회사 전계 발광 표시장치
CN109080266B (zh) * 2018-08-21 2019-11-19 京东方科技集团股份有限公司 一种打印机台
CN111370439A (zh) 2018-12-07 2020-07-03 京东方科技集团股份有限公司 显示面板及其制备方法、显示装置
CN110611053B (zh) 2019-08-20 2020-11-24 武汉华星光电半导体显示技术有限公司 一种显示面板的制备方法及其功能层的制备方法
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Also Published As

Publication number Publication date
JP2006003870A (ja) 2006-01-05
US7459177B2 (en) 2008-12-02
EP1598880A2 (en) 2005-11-23
US20050260335A1 (en) 2005-11-24
JP4055171B2 (ja) 2008-03-05
KR20060047609A (ko) 2006-05-18
TWI259803B (en) 2006-08-11
KR100691707B1 (ko) 2007-03-09
EP1598880B1 (en) 2020-01-01
EP1598880A3 (en) 2009-10-28

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