TW200610461A - Method of manufacturing double-sided printed circuit board - Google Patents

Method of manufacturing double-sided printed circuit board

Info

Publication number
TW200610461A
TW200610461A TW093127598A TW93127598A TW200610461A TW 200610461 A TW200610461 A TW 200610461A TW 093127598 A TW093127598 A TW 093127598A TW 93127598 A TW93127598 A TW 93127598A TW 200610461 A TW200610461 A TW 200610461A
Authority
TW
Taiwan
Prior art keywords
circuit board
printed circuit
layer
sided printed
forming
Prior art date
Application number
TW093127598A
Other languages
English (en)
Other versions
TWI252721B (en
Inventor
Hung-En Hsu
Bin-Wei Wang
Shing-Fun Ho
Original Assignee
Nan Ya Printed Circuit Board Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nan Ya Printed Circuit Board Corp filed Critical Nan Ya Printed Circuit Board Corp
Priority to TW093127598A priority Critical patent/TWI252721B/zh
Priority to US11/160,067 priority patent/US20060054588A1/en
Publication of TW200610461A publication Critical patent/TW200610461A/zh
Application granted granted Critical
Publication of TWI252721B publication Critical patent/TWI252721B/zh
Priority to US11/610,512 priority patent/US7524429B2/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1152—Replicating the surface structure of a sacrificial layer, e.g. for roughening
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/243—Reinforcing of the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
TW093127598A 2004-09-10 2004-09-10 Method of manufacturing double-sided printed circuit board TWI252721B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW093127598A TWI252721B (en) 2004-09-10 2004-09-10 Method of manufacturing double-sided printed circuit board
US11/160,067 US20060054588A1 (en) 2004-09-10 2005-06-07 Method of Manufacturing Double-Sided Printed Circuit Board
US11/610,512 US7524429B2 (en) 2004-09-10 2006-12-14 Method of manufacturing double-sided printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW093127598A TWI252721B (en) 2004-09-10 2004-09-10 Method of manufacturing double-sided printed circuit board

Publications (2)

Publication Number Publication Date
TW200610461A true TW200610461A (en) 2006-03-16
TWI252721B TWI252721B (en) 2006-04-01

Family

ID=36032781

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093127598A TWI252721B (en) 2004-09-10 2004-09-10 Method of manufacturing double-sided printed circuit board

Country Status (2)

Country Link
US (2) US20060054588A1 (zh)
TW (1) TWI252721B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115460798A (zh) * 2022-11-11 2022-12-09 四川富乐华半导体科技有限公司 一种陶瓷基板的填孔方法

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100882261B1 (ko) * 2007-07-25 2009-02-06 삼성전기주식회사 인쇄회로기판의 제조 방법 및 장치
KR100934110B1 (ko) * 2008-02-25 2009-12-29 대덕전자 주식회사 코어리스 인쇄회로기판 제조 방법
US7964106B2 (en) 2008-05-30 2011-06-21 Unimicron Technology Corp. Method for fabricating a packaging substrate
EP2295213A1 (de) 2009-09-12 2011-03-16 Scheppach Fabrikation von Holzbearbeitungsmaschinen GmbH Holzbearbeitungsmaschine und dafuer geeignetes Gehrungsanschlagsmodul
US9930789B2 (en) 2010-04-12 2018-03-27 Seagate Technology Llc Flexible printed circuit cable with multi-layer interconnection and method of forming the same
US8756804B2 (en) * 2010-09-29 2014-06-24 Samsung Electro-Mechanics Co., Ltd. Method of manufacturing printed circuit board
CN105657988B (zh) * 2014-11-21 2019-04-23 宏启胜精密电子(秦皇岛)有限公司 柔性电路板及其制作方法
US20190037691A1 (en) * 2016-01-15 2019-01-31 Hitachi Chemical Company, Ltd. Frp precursor, laminated plate, metal-clad laminate, printed circuit board, semiconductor package, and method for producing same
CN113710011A (zh) * 2021-08-30 2021-11-26 德中（天津）技术发展股份有限公司 一种只电镀加厚并可焊性处理孔后激光制蚀刻图案的制造电路板方法
CN114980500B (zh) * 2022-05-26 2023-08-11 苏州浪潮智能科技有限公司 一种用于双面压接元件的pcb结构及其制造方法
CN121148999B (zh) * 2025-11-19 2026-02-27 浙江创豪半导体有限公司 超薄封装基板的导通孔制作方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3437084A1 (de) 1984-10-05 1986-04-10 Schering AG, Berlin und Bergkamen, 1000 Berlin Verfahren zum an- und abaetzen von kunststoffschichten in bohrungen von basismaterial fuer leiterplatten
CN1044762C (zh) * 1993-09-22 1999-08-18 松下电器产业株式会社 印刷电路板及其制造方法
US6212769B1 (en) 1999-06-29 2001-04-10 International Business Machines Corporation Process for manufacturing a printed wiring board
EP1481796B1 (en) * 2002-03-05 2015-08-19 Hitachi Chemical Co., Ltd. Metal foil with resin and metal-clad laminate, and printed wiring board using the same and method for production thereof
US6815126B2 (en) * 2002-04-09 2004-11-09 International Business Machines Corporation Printed wiring board with conformally plated circuit traces
KR100584965B1 (ko) * 2003-02-24 2006-05-29 삼성전기주식회사 패키지 기판 및 그 제조 방법

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115460798A (zh) * 2022-11-11 2022-12-09 四川富乐华半导体科技有限公司 一种陶瓷基板的填孔方法

Also Published As

Publication number Publication date
TWI252721B (en) 2006-04-01
US20070084823A1 (en) 2007-04-19
US7524429B2 (en) 2009-04-28
US20060054588A1 (en) 2006-03-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees