TW200615500A - Bendable heat spreader with metallic screens based micro-structure and method for fabricating same - Google Patents

Bendable heat spreader with metallic screens based micro-structure and method for fabricating same

Info

Publication number
TW200615500A
TW200615500A TW093134387A TW93134387A TW200615500A TW 200615500 A TW200615500 A TW 200615500A TW 093134387 A TW093134387 A TW 093134387A TW 93134387 A TW93134387 A TW 93134387A TW 200615500 A TW200615500 A TW 200615500A
Authority
TW
Taiwan
Prior art keywords
heat spreader
metallic housing
metallic
cavity
based micro
Prior art date
Application number
TW093134387A
Other languages
English (en)
Other versions
TWI284190B (en
Inventor
Kuo-Ying Lee
Chien-Wen Chiu
Chien-Hung Lin
Cherng-Yuh Su
Original Assignee
Taiwan Microloops Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiwan Microloops Corp filed Critical Taiwan Microloops Corp
Priority to TW093134387A priority Critical patent/TWI284190B/zh
Priority to US11/138,478 priority patent/US20060098411A1/en
Priority to GB0511538A priority patent/GB2420223B/en
Priority to JP2005174888A priority patent/JP2006140435A/ja
Priority to FR0509037A priority patent/FR2877717B3/fr
Priority to KR1020050084049A priority patent/KR20060051143A/ko
Priority to DE102005051142A priority patent/DE102005051142A1/de
Priority to DE202005021630U priority patent/DE202005021630U1/de
Publication of TW200615500A publication Critical patent/TW200615500A/zh
Application granted granted Critical
Publication of TWI284190B publication Critical patent/TWI284190B/zh
Priority to US11/907,730 priority patent/US20080040925A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D53/00—Making other particular articles
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW093134387A 2004-11-11 2004-11-11 Bendable heat spreader with metallic screens based micro-structure and method for fabricating same TWI284190B (en)

Priority Applications (9)

Application Number Priority Date Filing Date Title
TW093134387A TWI284190B (en) 2004-11-11 2004-11-11 Bendable heat spreader with metallic screens based micro-structure and method for fabricating same
US11/138,478 US20060098411A1 (en) 2004-11-11 2005-05-27 Bendable heat spreader with metallic wire mesh-based microstructure and method for fabricating same
GB0511538A GB2420223B (en) 2004-11-11 2005-06-07 Bendable heat spreader with metallic wire mesh-based microstructure and method for fabricating same
JP2005174888A JP2006140435A (ja) 2004-11-11 2005-06-15 金属ワイヤメッシュの微小構造を備えた屈曲可能なヒートスプレッダーとヒートスプレッダーの製造方法
FR0509037A FR2877717B3 (fr) 2004-11-11 2005-09-05 Repartiteur pliable de chaleur compremant une microstructure a base de mailles de fils metalliques et procede de fabrication du meme repartiteur
KR1020050084049A KR20060051143A (ko) 2004-11-11 2005-09-09 금속 와이어 그물망 기반 마이크로구조체를 구비하는구부릴 수 있는 열분산기 및 그 제조방법
DE102005051142A DE102005051142A1 (de) 2004-11-11 2005-10-26 Biegbarer Wärmeverteiler mit metallischer Mikrostruktur auf Basis eines Drahtnetzes sowie Verfahren zur Herstellung derselben
DE202005021630U DE202005021630U1 (de) 2004-11-11 2005-10-26 Biegbarer Wärmeverteiler mit metallischer Mikrostruktur auf Basis eines Drahtnetzes
US11/907,730 US20080040925A1 (en) 2004-11-11 2007-10-17 Bendable heat spreader with metallic wire mesh-based microstructure and method for fabricating same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW093134387A TWI284190B (en) 2004-11-11 2004-11-11 Bendable heat spreader with metallic screens based micro-structure and method for fabricating same

Publications (2)

Publication Number Publication Date
TW200615500A true TW200615500A (en) 2006-05-16
TWI284190B TWI284190B (en) 2007-07-21

Family

ID=34837015

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093134387A TWI284190B (en) 2004-11-11 2004-11-11 Bendable heat spreader with metallic screens based micro-structure and method for fabricating same

Country Status (7)

Country Link
US (2) US20060098411A1 (zh)
JP (1) JP2006140435A (zh)
KR (1) KR20060051143A (zh)
DE (2) DE202005021630U1 (zh)
FR (1) FR2877717B3 (zh)
GB (1) GB2420223B (zh)
TW (1) TWI284190B (zh)

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CN104053335A (zh) * 2013-03-13 2014-09-17 联想(北京)有限公司 一种电子设备的散热装置
CN104422322A (zh) * 2013-08-29 2015-03-18 讯强电子(惠州)有限公司 均温板及其制造方法
TWI582367B (zh) * 2015-04-01 2017-05-11 A hot plate and a method for manufacturing the same
CN109588007A (zh) * 2017-09-28 2019-04-05 英特尔公司 顺应的散热器
CN110369854A (zh) * 2019-08-08 2019-10-25 东莞市纵鑫电子科技有限公司 热压式复合散热板的制作工艺
CN110385382A (zh) * 2019-08-08 2019-10-29 东莞市纵鑫电子科技有限公司 冲压与热压相结合之复合散热板的制作工艺
CN112951728A (zh) * 2021-05-12 2021-06-11 中兴通讯股份有限公司 蒸发结构、散热器、半导体器件及制备方法

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CN104053335A (zh) * 2013-03-13 2014-09-17 联想(北京)有限公司 一种电子设备的散热装置
CN104422322A (zh) * 2013-08-29 2015-03-18 讯强电子(惠州)有限公司 均温板及其制造方法
CN104422322B (zh) * 2013-08-29 2016-08-10 讯强电子(惠州)有限公司 均温板及其制造方法
TWI582367B (zh) * 2015-04-01 2017-05-11 A hot plate and a method for manufacturing the same
CN109588007A (zh) * 2017-09-28 2019-04-05 英特尔公司 顺应的散热器
CN110369854A (zh) * 2019-08-08 2019-10-25 东莞市纵鑫电子科技有限公司 热压式复合散热板的制作工艺
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CN112951728A (zh) * 2021-05-12 2021-06-11 中兴通讯股份有限公司 蒸发结构、散热器、半导体器件及制备方法

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US20060098411A1 (en) 2006-05-11
GB0511538D0 (en) 2005-07-13
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FR2877717B3 (fr) 2008-07-11
JP2006140435A (ja) 2006-06-01
DE102005051142A1 (de) 2006-06-01
TWI284190B (en) 2007-07-21
DE202005021630U1 (de) 2008-12-24
GB2420223A (en) 2006-05-17
KR20060051143A (ko) 2006-05-19
GB2420223B (en) 2008-05-14

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