TW200620367A - Pattern forming method and pattern forming apparatus - Google Patents

Pattern forming method and pattern forming apparatus

Info

Publication number
TW200620367A
TW200620367A TW094136659A TW94136659A TW200620367A TW 200620367 A TW200620367 A TW 200620367A TW 094136659 A TW094136659 A TW 094136659A TW 94136659 A TW94136659 A TW 94136659A TW 200620367 A TW200620367 A TW 200620367A
Authority
TW
Taiwan
Prior art keywords
substrate
pattern forming
outlets
linear pattern
forming apparatus
Prior art date
Application number
TW094136659A
Other languages
English (en)
Other versions
TWI297164B (en
Inventor
Manabu Yabe
Original Assignee
Dainippon Screen Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Mfg filed Critical Dainippon Screen Mfg
Publication of TW200620367A publication Critical patent/TW200620367A/zh
Application granted granted Critical
Publication of TWI297164B publication Critical patent/TWI297164B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
    • H01J9/241—Manufacture or joining of vessels, leading-in conductors or bases the vessel being for a flat panel display
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/20—Constructional details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/02—Manufacture of electrodes or electrode systems
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
    • B05C5/0212—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles
    • B05C5/0216—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles by relative movement of article and outlet according to a predetermined path
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
    • B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
    • B05C9/14—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation involving heating or cooling

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Gas-Filled Discharge Tubes (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Coating Apparatus (AREA)
TW094136659A 2004-11-10 2005-10-20 Pattern forming method and pattern forming apparatus TWI297164B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004326153A JP2006138911A (ja) 2004-11-10 2004-11-10 パターン形成方法およびパターン形成装置

Publications (2)

Publication Number Publication Date
TW200620367A true TW200620367A (en) 2006-06-16
TWI297164B TWI297164B (en) 2008-05-21

Family

ID=36316728

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094136659A TWI297164B (en) 2004-11-10 2005-10-20 Pattern forming method and pattern forming apparatus

Country Status (5)

Country Link
US (1) US20060099535A1 (zh)
JP (1) JP2006138911A (zh)
KR (1) KR100747016B1 (zh)
CN (1) CN100459016C (zh)
TW (1) TWI297164B (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4738319B2 (ja) * 2006-11-15 2011-08-03 大日本スクリーン製造株式会社 パターン形成装置
JP5465962B2 (ja) * 2009-09-24 2014-04-09 大日本スクリーン製造株式会社 電極形成方法および電極形成装置
JP5022462B2 (ja) * 2010-03-18 2012-09-12 大日本スクリーン製造株式会社 電極形成方法および電極形成装置
JP5547556B2 (ja) 2010-06-08 2014-07-16 大日本スクリーン製造株式会社 電池、車両、電子機器および電池の製造方法
JP2012064487A (ja) * 2010-09-17 2012-03-29 Dainippon Screen Mfg Co Ltd 電池の製造方法、電池、車両および電子機器
JP5462758B2 (ja) 2010-09-28 2014-04-02 大日本スクリーン製造株式会社 リチウムイオン二次電池、車両、電子機器およびリチウムイオン二次電池の製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3124718B2 (ja) * 1995-03-31 2001-01-15 キヤノン株式会社 カラーフィルタの製造方法及び製造装置及びカラーフィルタのフィルタエレメント列内の着色ムラを低減する方法
JP3918972B2 (ja) * 1998-06-23 2007-05-23 株式会社日立プラズマパテントライセンシング プラズマディスプレイパネル
KR100623977B1 (ko) * 1999-07-08 2006-09-13 삼성전자주식회사 액정 표시 장치용 박막 트랜지스터 기판의 제조 방법
US6734029B2 (en) * 2000-06-30 2004-05-11 Seiko Epson Corporation Method for forming conductive film pattern, and electro-optical device and electronic apparatus
JP4690556B2 (ja) * 2000-07-21 2011-06-01 大日本印刷株式会社 微細パターン形成装置と微細ノズルの製造方法
JP3366630B2 (ja) * 2000-10-04 2003-01-14 大日本スクリーン製造株式会社 平面表示装置用の隔壁形成方法及びその装置
JP4158962B2 (ja) * 2001-06-01 2008-10-01 漢拏空調株式会社 圧縮機ピストンコーティング方法
WO2003005424A1 (fr) * 2001-07-03 2003-01-16 Tokyo Electron Limited Dispositif de revetement et procede de revetement
JP3425946B2 (ja) * 2001-09-13 2003-07-14 大日本スクリーン製造株式会社 平面表示装置用の隔壁形成方法及びその装置
JP2003187694A (ja) * 2001-12-21 2003-07-04 Dainippon Screen Mfg Co Ltd 隔壁形成方法、隔壁形成装置およびパネル
US6720732B2 (en) * 2002-03-27 2004-04-13 Chunghwa Picture Tubers, Ltd. Barrier rib structure for plasma display panel
JP4082499B2 (ja) * 2002-09-20 2008-04-30 大日本スクリーン製造株式会社 パターン形成装置およびパターン形成方法
KR20040051289A (ko) * 2002-12-12 2004-06-18 현대 프라즈마 주식회사 투명전극이 없는 플라즈마 디스플레이 패널

Also Published As

Publication number Publication date
US20060099535A1 (en) 2006-05-11
KR20060049318A (ko) 2006-05-18
JP2006138911A (ja) 2006-06-01
TWI297164B (en) 2008-05-21
CN1773650A (zh) 2006-05-17
CN100459016C (zh) 2009-02-04
KR100747016B1 (ko) 2007-08-07

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees