TW200624924A - Mounting structure, mounting substrate, electro-optical device, and electronic apparatus - Google Patents

Mounting structure, mounting substrate, electro-optical device, and electronic apparatus

Info

Publication number
TW200624924A
TW200624924A TW094133137A TW94133137A TW200624924A TW 200624924 A TW200624924 A TW 200624924A TW 094133137 A TW094133137 A TW 094133137A TW 94133137 A TW94133137 A TW 94133137A TW 200624924 A TW200624924 A TW 200624924A
Authority
TW
Taiwan
Prior art keywords
connection terminals
substrate
disposed
electro
optical device
Prior art date
Application number
TW094133137A
Other languages
English (en)
Other versions
TWI308857B (en
Inventor
Masanori Yumoto
Yoshihisa Hirano
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of TW200624924A publication Critical patent/TW200624924A/zh
Application granted granted Critical
Publication of TWI308857B publication Critical patent/TWI308857B/zh

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09409—Multiple rows of pads, lands, terminals or dummy patterns; Multiple rows of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09481—Via in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Landscapes

  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Mathematical Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Structure Of Printed Boards (AREA)
TW094133137A 2004-09-28 2005-09-23 Mounting structure, mounting substrate, electro-optical device, and electronic apparatus TWI308857B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004281121A JP4277777B2 (ja) 2004-09-28 2004-09-28 実装構造体、実装用基板、電気光学装置及び電子機器

Publications (2)

Publication Number Publication Date
TW200624924A true TW200624924A (en) 2006-07-16
TWI308857B TWI308857B (en) 2009-04-11

Family

ID=36097716

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094133137A TWI308857B (en) 2004-09-28 2005-09-23 Mounting structure, mounting substrate, electro-optical device, and electronic apparatus

Country Status (5)

Country Link
US (1) US8081285B2 (zh)
JP (1) JP4277777B2 (zh)
KR (1) KR100739924B1 (zh)
CN (1) CN100405882C (zh)
TW (1) TWI308857B (zh)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI287661B (en) * 2005-12-23 2007-10-01 Au Optronics Corp Flexible printed circuit board and display device utilizing the same
KR101266248B1 (ko) * 2006-08-07 2013-05-22 삼성디스플레이 주식회사 표시 장치, 그 제조 방법 및 이를 갖는 이동통신 단말기
CN100552770C (zh) * 2007-09-20 2009-10-21 友达光电（苏州）有限公司 液晶显示器电路保护结构与其组装方法
JP5125632B2 (ja) * 2008-03-10 2013-01-23 セイコーエプソン株式会社 実装構造体および電気光学装置
EP2323466A1 (en) * 2008-08-11 2011-05-18 Sharp Kabushiki Kaisha Flexible substrate and electric circuit structure
JP5106341B2 (ja) 2008-10-02 2012-12-26 株式会社ジャパンディスプレイイースト 表示装置
JP2011107389A (ja) * 2009-11-17 2011-06-02 Hitachi Displays Ltd 表示装置
CN101965102B (zh) * 2010-09-17 2012-02-15 华映视讯（吴江）有限公司 电路板模块
CN103154863A (zh) * 2010-10-08 2013-06-12 夏普株式会社 电子设备
KR20120056568A (ko) * 2010-11-25 2012-06-04 삼성모바일디스플레이주식회사 표시 장치 및 그 제조 방법
JP5991915B2 (ja) * 2012-12-27 2016-09-14 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP6143466B2 (ja) * 2013-01-10 2017-06-07 株式会社ジャパンディスプレイ タッチパネル内蔵型液晶表示装置
TW201443516A (zh) * 2013-05-03 2014-11-16 Gio Optoelectronics Corp 顯示面板及顯示裝置
CN106206668B (zh) * 2016-08-31 2019-04-05 昆山国显光电有限公司 一种有源矩阵有机发光二极管显示装置以及制作方法
CN108075276B (zh) * 2016-11-11 2020-01-07 泰科电子(上海)有限公司 连接器和连接器组件
JP6797042B2 (ja) * 2017-02-02 2020-12-09 株式会社ジャパンディスプレイ 表示装置
CN108133665A (zh) * 2017-12-18 2018-06-08 武汉华星光电半导体显示技术有限公司 平板显示装置结构
CN113271837B (zh) * 2019-02-19 2024-09-27 奥林巴斯株式会社 内窥镜前端构造及内窥镜
US11425816B2 (en) * 2020-07-06 2022-08-23 Micron Technology, Inc. Card edge connector with intra-pair coupling
JP7547866B2 (ja) * 2020-08-26 2024-09-10 セイコーエプソン株式会社 電気光学装置、及び電子機器

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6188136A (ja) 1984-10-05 1986-05-06 Nec Corp 半導体マルチバイオセンサの製造方法
JPH0717162A (ja) 1993-06-30 1995-01-20 Toppan Moore Co Ltd 配送伝票
JP3054555B2 (ja) 1994-08-30 2000-06-19 シャープ株式会社 フレキシブルプリント基板と硬質基板との電極接合構造
JP3729113B2 (ja) 1994-09-16 2005-12-21 セイコーエプソン株式会社 電子機器
US5686703A (en) * 1994-12-16 1997-11-11 Minnesota Mining And Manufacturing Company Anisotropic, electrically conductive adhesive film
JP3163000B2 (ja) 1996-04-02 2001-05-08 富士写真光機株式会社 フレキシブルプリント板
JP2000235354A (ja) 1999-02-16 2000-08-29 Mitsubishi Electric Corp 配線体の接続構造、ディスプレイパネル、及びディスプレイ装置
JP3833425B2 (ja) * 1999-10-27 2006-10-11 富士通株式会社 プリント配線板どうしの接続方法およびプリント基板
JP3630116B2 (ja) * 2000-08-10 2005-03-16 セイコーエプソン株式会社 電気光学ユニットおよび電子機器
KR100390456B1 (ko) * 2000-12-13 2003-07-07 엘지.필립스 엘시디 주식회사 액정 디스플레이 패널 및 그 제조방법
JP3901004B2 (ja) * 2001-06-13 2007-04-04 セイコーエプソン株式会社 電気光学装置及びその製造方法、並びに電子機器
JP4526771B2 (ja) * 2003-03-14 2010-08-18 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP4543772B2 (ja) 2003-09-19 2010-09-15 セイコーエプソン株式会社 電気光学装置および電子機器

Also Published As

Publication number Publication date
CN100405882C (zh) 2008-07-23
US20060065437A1 (en) 2006-03-30
TWI308857B (en) 2009-04-11
KR20060051674A (ko) 2006-05-19
JP2006098455A (ja) 2006-04-13
US8081285B2 (en) 2011-12-20
CN1756457A (zh) 2006-04-05
KR100739924B1 (ko) 2007-07-16
JP4277777B2 (ja) 2009-06-10

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees